摘要:
A surface mount LED assembly (10) comprises a substrate (11), a bonding pad, an LED chip (12) and a lens package (13). The bonding pad, the LED chip and the lens package are positioned on the substrate. The LED chip is electrically connected with the bonding pad. The lens package covers the LED chip. The lens package comprises a light emitting surface (132) located away from the LED chip. The light emitting surface is a curved surface protruding away from the substrate.
摘要:
The present invention relates to a method of forming a nitride semiconductor substrate. This method includes steps of providing a substrate and then forming an epitaxy layer on the substrate. A patterned mask layer is formed on the epitaxy layer, wherein the patterned mask layer exposes a portion of the epitaxy layer. Next, an oxidation process is performed to oxidize the exposed epitaxy layer so as to form a plurality of dislocation blocking structures. The patterned mask layer is then removed. Further, a nitride semiconductor layer is formed on the epitaxy layer having the dislocation blocking structures.
摘要:
A structure of an interface card connector includes a connector body and a plurality of terminals provided on the connector body. The bottom surface of the connector body is divided into a terminal zone and a space zone along the transverse direction. The distal ends of the terminals project from the terminal zone toward the bottom surface of the connector body. The space zone is recessed toward the connector body to form a notch portion, so that the bottom surface formed by the space zone is higher than that formed by the terminal zone. The space zone is used to provide a space for arranging the electronic components on the main board, so that more space on the main board is spared for the circuit layout. With this arrangement, the problem of the insufficient space and area of the main board can be solved.
摘要:
A chip adapter seat for positioning and connecting to a chip includes an insulating seat body, a plurality of terminals and a pressing element. The insulating seat body has an accommodating space for arranging the chip. On the corresponding sides of the accommodating space, a plurality of terminal-receiving grooves is provided to correspond to the chip pins. Each terminal-receiving groove is provided with a terminal therein. On end of the each terminal is electrically connected to the chip pin, and the other end thereof projects from the outside of the periphery of the insulating seat body. The pressing element is connected above the accommodating space of the insulating seat body for pressing the chip in the accommodating space of the insulating seat body. With the above arrangement, another chip can be rapidly changed without complicated detaching process when the chip is damaged. Further, the repairing procedure becomes simple and convenient for use to connect various kinds of chips with different sizes, thereby increasing the versatility.
摘要:
A pixel structure utilized for flexible displays, which is suitably disposed on a flexible substrate and is driven by a data line and a scan line, is characterized in that the pixel structure comprises a plurality of thin film transistors. In the pixel structure, the plural thin film transistors are connected by various connection layouts so as to solve the prior-art problem that the pixel structure can't functional normally since the single transistor contained in the pixel structure is damaged by alignment error caused by the deformation in the manufacturing process of the flexible substrate or the buckling of the flexible display while it is being used, and further to improve the reliability of the pixel structure disposed on the flexible substrate.
摘要:
A locking device has a blocking member, a first operating unit and a second operating unit. The blocking member is provided for blocking a printed circuit board under a locking position when the printed circuit board is installed into the printed circuit board connector, so as to retain the printed circuit board within the printed circuit board connector. Furthermore, the blocking member is removed from the locking position by operating either the first operating unit or the second operating unit. The first operating unit and the second operating unit are spaced from each other and mounted to different positions, so as to benefit from applying either the first operating unit or the second operating unit to remove the locking position when either the first operating unit or the second operating unit is obstructed by other devices.
摘要:
A method for making a terminal includes forming a reinforcement enclosed around the pieces of the distal end of the terminal to combine and connect the pieces. Thus, the pieces of the distal end of the terminal are connected closely by the reinforcement to form a compact conic body without forming an opening in the distal end of the terminal, so that the distal end of the terminal has a greater structural strength, thereby preventing the distal end of the terminal from being broken or worn out due to mutual hit when the distal end of the terminal is inserted into a female terminal in a misalignment manner.
摘要:
An integrated socket has a first slot and a second slot. The first slot has a structure and electric specifications in compliance with a first bus interface, and the second slot has a structure and electric specifications in compliance with a second bus interface. In addition, the first slot and the second slot are integrated into one in an efficient and a length manner, the first slot is used to support a printed circuit board with the first bus interface and the second slot is used to support a printed circuit board with the second bus interface. Because the integrated socket only occupies a length space of a computer motherboard, the space utilization of the computer motherboard is improved.
摘要:
A method for determining a compensation value for tracking error signal in an optical disc drive is disclosed. The optical disc drive rotates a DVD to read data. The DVD has a first reflection layer and a second reflection layer. The first and the second reflection layers have respectively a number of circles of first and second tracks. First, read data on two first and two second tracks and accordingly generate two first compensation values for tracking error signal and two second compensation values for tracking error signal. Next, determine the third compensation value for tracking error signal corresponding to each of the other first tracks according to two of the first compensation values for tracking error signal. Then, determine the forth compensation value for tracking error signal corresponding to each of the other second tracks according to two of the second compensation values for tracking error signal.
摘要:
The present disclosure provides an interconnect structure for a semiconductor device. The interconnect structure includes a first metal layer that contains a first metal line. The interconnect structure includes a dielectric layer located over the first metal layer. The dielectric layer contains a first sub-via electrically coupled to the first metal line and a second sub-via electrically coupled to the first sub-via. The second sub-via is different from the first sub-via. The interconnect structure includes a second metal layer located over the dielectric layer. The second metal layer contains a second metal line electrically coupled to the second sub-via. No other metal layer is located between the first metal layer and the second metal layer.