Abstract:
A ternary content-addressable memory (TCAM) array of cells features reduced area and improved matching functionality. 1T-3R and 2T-3R embodiments are disclosed as illustrative. A row or block of TCAM memory cells may include a serial string interconnecting the cells so as to provide reduced power consumption during matching operations. In other aspects, Pre-charge/Discharge logic configurations are described utilizing complementary resistive ram (cRRAM) storage for input data to form improved programmable logic circuits.
Abstract:
Non-transitory computer-readable media having information embodied therein that includes a description of an integrated circuit device. The information includes descriptions of a volatile storage die having a first addressable range of storage cells and a non-volatile storage die. The description of the non-volatile storage die having a second addressable range of storage cells that defines an overlapping region with the first addressable range of storage cells. The information also includes a description of an interface circuit coupled to the volatile and non-volatile storage die to selectively transfer data stored in the overlapping region of storage cells between the die.
Abstract:
A memory system includes a memory module that supports error detection and correction (EDC) in a manner that relieves a memory controller or processor of some or all of the computational burden associated with EDC. individual EDC components perform EDC functions on subsets of the data, and share data between themselves using relatively short, fast interconnections.
Abstract:
Non-transitory computer-readable media having information embodied therein that includes a description of an integrated circuit device. The information includes descriptions of a volatile storage die having a first addressable range of storage cells and a non-volatile storage die. The description of the non-volatile storage die having a second addressable range of storage cells that defines an overlapping region with the first addressable range of storage cells. The information also includes a description of an interface circuit coupled to the volatile and non-volatile storage die to selectively transfer data stored in the overlapping region of storage cells between the die.
Abstract:
A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.
Abstract:
A memory controller receives data and phase-providing signals from a memory device. The phase-providing signal is not a clock signal, but is used by the memory controller to phase align a local data-sampling signal with the incoming data. The memory controller samples the data signal with the data-sampling signal. The memory controller can perform maintenance operations to update the phase relationship between the phase-providing and data-sampling signals.
Abstract:
A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.
Abstract:
A memory controller receives data and phase-providing signals from a memory device. The phase-providing signal is not a clock signal, but is used by the memory controller to phase align a local data-sampling signal with the incoming data. The memory controller samples the data signal with the data-sampling signal. The memory controller can perform maintenance operations to update the phase relationship between the phase-providing and data-sampling signals.
Abstract:
A buffer circuit is disclosed. The buffer circuit includes a command address (C/A) interface to receive an incoming activate (ACT) command and an incoming column address strobe (CAS) command. A first match circuit includes first storage to store failure row address information associated with the memory, and first compare logic. The first compare logic is responsive to the ACT command, to compare incoming row address information to the stored failure row address information. A second match circuit includes second storage to store failure column address information associated with the memory, and second compare logic. The second compare logic is responsive to the CAS command, to compare the incoming column address information to the stored failure column address information. Gating logic maintains a state of a matching row address identified by the first compare logic during the comparison carried out by the second compare logic.
Abstract:
The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.