公开(公告)号：US07592375B2

公开(公告)日：2009-09-22

申请号：US11415116

申请日：2006-05-02

申请人： Greg Shafer ,  Masaya Kawasumi ,  Yoichi Hosokawa ,  Naoki Hasegawa ,  Satoru Yamamoto ,  Kenji Imai ,  Yuko Murayama ,  Shiaki Hyodo

发明人： Greg Shafer ,  Masaya Kawasumi ,  Yoichi Hosokawa ,  Naoki Hasegawa ,  Satoru Yamamoto ,  Kenji Imai ,  Yuko Murayama ,  Shiaki Hyodo

IPC分类号： C08J5/20

CPC分类号： C08J5/2218

摘要： Disclosed herein is an ion conductive polymer comprising a unit represented by Formula (1) below: —SO2[N−SO2(M+)]X1-  (1) wherein X1 is an integer greater than 1, and M+ is H+ or Li+. Further disclosed is an imide monomer represented by Formula (A) below: Z1-SO2[N−SO2M+]Y-Z2   (A) wherein Y is an integer of 2 or greater, Z1 is OH, F, Cl, Br, I or NZ3Z4 (in which Z3 and Z4 are each independently H, M or SiMe3, and M is a metal element), Z2 is OH, F, Cl, Br, I or NZ3Z4 (in which Z3 and Z4 are each independently H, M or SiMe3, and M is a metal element), and M+ is H+ or Li+.

摘要翻译： 本文公开了包含由下式（1）表示的单元的离子导电聚合物：<？在线公式描述=“在线公式”end =“lead”→SO ​​2 [N-SO 2（M +）] X1-（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中X1是大于1的整数，M +是H +或Li +。 进一步公开的是由下式（A）表示的酰亚胺单体：<？in-line-formula description =“In-line formula”end =“lead”？> Z1-SO2 [N-SO2M +] Y-Z2（A） 其中Y为2以上的整数，Z1为OH，F，Cl，Br，I或NZ3Z4（其中Z3和 Z4各自独立地为H，M或SiMe3，M为金属元素），Z2为OH，F，Cl，Br，I或NZ3Z4（其中Z3和Z4各自独立为H，M或SiMe3，M为 金属元素），M +为H +或Li +。

公开(公告)号：US20090149602A1

公开(公告)日：2009-06-11

申请号：US11921865

申请日：2007-01-30

申请人： Maki Saitou ,  Shinichirou Kanai ,  Motohiro Seki ,  Satoru Yamamoto ,  Ikkou Hanaki ,  Keiji Hayashi ,  Kazuhito Okumura

发明人： Maki Saitou ,  Shinichirou Kanai ,  Motohiro Seki ,  Satoru Yamamoto ,  Ikkou Hanaki ,  Keiji Hayashi ,  Kazuhito Okumura

IPC分类号： C08L75/04

CPC分类号： B29C33/62 ,  B29C33/68 ,  C08K5/29 ,  C08L23/02 ,  C08L23/06 ,  C08L23/0846 ,  C08L23/0853 ,  C08L23/0861 ,  C08L23/10 ,  C08L29/02 ,  C08L2207/066 ,  C09J7/40 ,  C09J2423/005 ,  C08L2666/06 ,  C08L2666/20

摘要： A release resin composition that is excellent in thermal stability, for example, during extrusion molding and does not cause problems such as smoking and foaming during preparation of a compound product or extrusion molding and further does not contaminate metal rollers. The release resin composition can be formed into a release layer that does not cause migration of impurities to an adhesive layer being in direct contact with the release layer and therefore does not decrease the adhesive properties of the adhesive layer. The release resin composition includes a release agent (A) of which main component is a polymer compound having a weight average molecular weight of 10000 to 1000000 and containing an aliphatic group having 8 to 30 carbon atoms and includes a thermoplastic polymer (B) containing an olefin monomer and/or a polar monomer as a constitutional unit, wherein the amount of the release agent (A) is 0.1 to 20 parts by weight to 100 parts by weight of the thermoplastic polymer (B). The release agent (A) shows a 2% weight loss temperature in the range of 260° C. or higher but lower than 275° C. and a 5% weight loss temperature in the range of 275° C. or higher but lower than 330° C. in thermogravimetric analysis.

摘要翻译： 作为热稳定性优异的脱模树脂组合物，例如在挤出成型时，在复合制品的制备或挤出成型时不会引起吸烟，发泡等问题，不会污染金属辊。 脱模树脂组合物可以形成为不引起杂质迁移到与剥离层直接接触的粘合剂层的剥离层，因此不会降低粘合剂层的粘合性。 剥离性树脂组合物包含其主要成分为重均分子量为10000〜1000000，含有碳原子数为8〜30的脂肪族基团的高分子化合物的脱模剂（A），其含有含有 烯烃单体和/或极性单体作为结构单元，其中脱模剂（A）的量相对于热塑性聚合物（B）100重量份为0.1〜20重量份。 脱模剂（A）在260℃以上但低于275℃的范围内显示出2％的重量损失温度，在275℃以上且低于275℃的范围内显示5％的重量损失温度 330℃在热重分析中。

公开(公告)号：US07479213B2

公开(公告)日：2009-01-20

申请号：US11020068

申请日：2004-12-23

申请人： Mizuki Nagai ,  Hiroyuki Kanda ,  Keiichi Kurashina ,  Satoru Yamamoto ,  Hidenao Suzuki ,  Koji Mishima ,  Brett C. Baker-O'Neal ,  Hariklia Deligianni ,  Keith Kwietniak

发明人： Mizuki Nagai ,  Hiroyuki Kanda ,  Keiichi Kurashina ,  Satoru Yamamoto ,  Hidenao Suzuki ,  Koji Mishima ,  Brett C. Baker-O'Neal ,  Hariklia Deligianni ,  Keith Kwietniak

IPC分类号： C25D5/10

CPC分类号： C25D17/001 ,  C25D5/10 ,  C25D5/18 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.

摘要翻译： 电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响 孔。 电镀方法包括第一电镀工艺和第二电镀工艺。 通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在 阳极和衬底，同时多孔构件被保持与衬底接触。

公开(公告)号：US07311809B2

公开(公告)日：2007-12-25

申请号：US10930823

申请日：2004-09-01

申请人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

发明人： Keiichi Kurashina ,  Mizuki Nagai ,  Satoru Yamamoto ,  Hiroyuki Kanda ,  Koji Mishima ,  Brett Baker ,  Hariklia Deligianni ,  Phillipe Vereecken

IPC分类号： C25D17/00

CPC分类号： C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  H01L21/2885

摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.

摘要翻译： 本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。 用于基板的电镀装置包括：用于保持基板的基板保持器; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极 该基板向基板提供电流。 可垂直移动的阳极以与基板的待镀表面相对的方式设置; 电镀溶液浸渍材料设置在阳极和待镀覆的表面之间，电镀液浸渍材料由保水材料制成; 并且多孔构件设置在电镀溶液浸渍材料和要被电镀的表面之间。 电镀溶液浸渍材料由多个分开的构件构成。

公开(公告)号：US20070278073A1

公开(公告)日：2007-12-06

申请号：US11790951

申请日：2007-04-30

申请人： Satoru Yamamoto ,  Yoshimichi Mochizuki ,  Yuji Migimatsu

发明人： Satoru Yamamoto ,  Yoshimichi Mochizuki ,  Yuji Migimatsu

IPC分类号： H01H9/00

CPC分类号： B60Q1/1476

摘要： A lever switch is provided, in which an arrangement of a push button is fixed with respect to an operation of a rotary ring to realize improvement in operation. A lever switch includes: a first shaft projecting from a base of a control means of a mobile unit; a plurality of push buttons provided at a distal end of the first shaft; a fixing-supporting part which fixes and supports a plurality of the push buttons for preventing a plurality of the push buttons from rotating relatively to the first shaft; and a rotary ring which is provided in the middle of the first shaft and is rotatable separately from a plurality of the push buttons, wherein when the rotary ring is operated, the rotary ring is rotated around the first shaft on a condition that a plurality of the push buttons are fixed and supported being prevented from rotating.

摘要翻译： 提供了一种杠杆开关，其中相对于旋转环的操作固定按钮的布置以实现操作的改进。 杠杆开关包括：从移动单元的控制装置的底部突出的第一轴; 设置在所述第一轴的远端的多个按钮; 固定支撑部，其固定并支撑多个按钮，用于防止多个按钮相对于第一轴旋转; 以及旋转环，其设置在所述第一轴的中间并且能够与多个所述按钮分离地旋转，其中当所述旋转环被操作时，所述旋转环围绕所述第一轴旋转，条件是多个 按钮被固定并被支撑防止旋转。

公开(公告)号：US20070238265A1

公开(公告)日：2007-10-11

申请号：US11396572

申请日：2006-04-04

申请人： Keiichi Kurashina ,  Tsutomu Nakada ,  Takashi Kawakami ,  Satoru Yamamoto ,  Keisuke Hayabusa

发明人： Keiichi Kurashina ,  Tsutomu Nakada ,  Takashi Kawakami ,  Satoru Yamamoto ,  Keisuke Hayabusa

IPC分类号： C25D3/00 ,  B05C9/08 ,  B32B15/04

CPC分类号： C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

摘要： A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.

摘要翻译： 电镀装置可以在基板的整个表面上形成具有更均匀厚度的镀膜，并且即使当基板在表面中具有高的薄层电阻时，也可以牢固地填充与金属的互连凹槽，而不会在嵌入的金属中形成空隙。 电镀装置包括用于保持基板的基板保持器，包括用于与由基板保持器保持的基板接触的阴极以向基板供电的阴极部分，以及部分或全部具有高电阻的阳极， 由衬底保持器保持的衬底的表面，其中在用电镀溶液填充阳极和由衬底保持器保持的衬底之间进行衬底的表面的电镀。

公开(公告)号：US20070053701A1

公开(公告)日：2007-03-08

申请号：US11470222

申请日：2006-09-05

申请人： Naohisa Nagata ,  Ichiro Sasaki ,  Akinobu Nishikata ,  Satoru Yamamoto ,  Hiroshi Matsumoto

发明人： Naohisa Nagata ,  Ichiro Sasaki ,  Akinobu Nishikata ,  Satoru Yamamoto ,  Hiroshi Matsumoto

IPC分类号： G03G15/00

CPC分类号： G03G15/55 ,  G03G15/502

摘要： An image forming apparatus determines process items needed as exchanged components and an order of executing the process items needed for a plurality of kinds of exchanged components based on priority order information of the process items and causes a display unit to control a display for ordering to execute process items needed for the components according to the determined order of execution.

摘要翻译： 图像形成装置基于处理项目的优先级顺序信息来确定所交换的组件所需的处理项目和执行多种交换的组件所需的处理项目的顺序，并使显示单元控制显示以进行排序 根据确定的执行顺序，组件所需的处理项目。

公开(公告)号：US07154341B2

公开(公告)日：2006-12-26

申请号：US10994280

申请日：2004-11-23

申请人： Satoru Yamamoto ,  Hirotaka Oosawa ,  Toshiya Uozumi ,  Noriyuki Kurakami ,  Jiro Shinbo

发明人： Satoru Yamamoto ,  Hirotaka Oosawa ,  Toshiya Uozumi ,  Noriyuki Kurakami ,  Jiro Shinbo

IPC分类号： H03L7/00

CPC分类号： H03L7/193 ,  H03L7/099 ,  H03L7/10 ,  H03L7/199

摘要： A communication semiconductor integrated circuit device includes an RFVCO and a TXVCO and is formed over one semiconductor substrate, and has a first operation mode (idle mode) which does not perform transmission and reception, a second operation mode (warmup mode) which performs a preparation prior to the start of transmission or reception, and a third operation mode (transmission or reception mode) which performs transmission or reception. In the first operation mode, two oscillators are deactivated, and the operation of selecting a frequency band to be used in at least the TXVCO which generates a transmit signal, is performed in the second operation mode. In the communication semiconductor integrated circuit device, a high frequency signal generator which generates a signal having a desired frequency with an oscillation signal outputted from a crystal oscillator as a reference signal, a reception system circuit (RXC) including a frequency converter, and a transmission system circuit (TXC) including the TXVCO which generates the transmit signal, are respectively formed in different semiconductor regions isolated by insulators.

摘要翻译： 通信半导体集成电路器件包括RFVCO和TXVCO，并且形成在一个半导体衬底上，并且具有不执行发送和接收的第一操作模式（空闲模式），执行准备的第二操作模式（预热模式） 在发送或接收开始之前，以及执行发送或接收的第三操作模式（发送或接收模式）。 在第一操作模式中，两个振荡器被去激活，并且在第二操作模式中执行选择在至少产生发送信号的TXVCO中使用的频带的操作。 在通信半导体集成电路装置中，生成具有从晶体振荡器输出的振荡信号作为参考信号的期望频率的信号的高频信号发生器，包括变频器的接收系统电路（RXC）和发送 包括产生发送信号的TXVCO的系统电路（TXC）分别形成在由绝缘体隔离的不同的半导体区域中。

公开(公告)号：US20060267699A1

公开(公告)日：2006-11-30

申请号：US11501778

申请日：2006-08-10

申请人： Toshiya Uozumi ,  Hirotaka Osawa ,  Jiro Shinbo ,  Satoru Yamamoto

发明人： Toshiya Uozumi ,  Hirotaka Osawa ,  Jiro Shinbo ,  Satoru Yamamoto

IPC分类号： H03L7/00

CPC分类号： H03L7/099 ,  H03L7/0891 ,  H03L7/10 ,  H03L7/199

摘要： An RF IC in which a PLL circuit including a loop filter is incorporated into a semiconductor chip is achieved without increasing power consumption or chip size. The RF IC includes a VCO capable of switching oscillation frequency bands, a variable frequency divider, a phase comparator, and a loop filter, which are contained in the PLL loop. A discrimination circuit discriminates a lead or lag in a phase of an output signal from the variable frequency divider against a reference signal and an automatic band selecting circuit generates a signal for switching the frequency bands of the VCO based on output from the discrimination circuit. While switching the frequency bands of the VCO by means of bisection algorithm, the RF IC detects an optimum frequency band, and adds offset to it to determine a final usable frequency band.

摘要翻译： 在不增加功耗或芯片尺寸的情况下，实现将包括环路滤波器的PLL电路并入半导体芯片的RF IC。 RF IC包括能够切换振荡频带的VCO，可变分频器，相位比较器和环路滤波器，其包含在PLL环路中。 判别电路基于参考信号鉴别来自可变分频器的输出信号的相位的引导或滞后，并且自动频带选择电路根据鉴别电路的输出产生用于切换VCO的频带的信号。 在通过平分算法切换VCO的频带的同时，RF IC检测最佳频带，并向其添加偏移量以确定最终可用频带。

公开(公告)号：US20060258759A1

公开(公告)日：2006-11-16

申请号：US11415116

申请日：2006-05-02

申请人： Greg Shafer ,  Masaya Kawasumi ,  Yoichi Hosokawa ,  Naoki Hasegawa ,  Satoru Yamamoto ,  Kenji Imai ,  Yuko Murayama ,  Shiaki Hyodo

发明人： Greg Shafer ,  Masaya Kawasumi ,  Yoichi Hosokawa ,  Naoki Hasegawa ,  Satoru Yamamoto ,  Kenji Imai ,  Yuko Murayama ,  Shiaki Hyodo

IPC分类号： C08J5/20

CPC分类号： C08J5/2218

摘要： Disclosed herein is an ion conductive polymer comprising a unit represented by Formula (1) below: —SO2[N−SO2(M+)]X1—  (1) wherein X1 is an integer greater than 1, and M+ is H+ or Li+. Further disclosed is an imide monomer represented by Formula (A) below: Z1-SO2[N−SO2M+]Y-Z2   (A) wherein Y is an integer of 2 or greater, Z1 is OH, F, Cl, Br, I or NZ3Z4 (in which Z3 and Z4 are each independently H, M or SiMe3, and M is a metal element), Z2 is OH, F, Cl, Br, I or NZ3Z4 (in which Z3 and Z4 are each independently H, M or SiMe3, and M is a metal element), and M+ is H+ or Li+.

摘要翻译： 本文公开了包含由下式（1）表示的单元的离子导电聚合物：<？在线公式描述=“在线配方”末端=“铅”→SO ​​2 （N） - （1）＆lt;＆lt;＆lt; 2＆gt;（1）＆lt; description =“In-line Formulas”end =“tail”？>其中X 1是一个大于1的整数，而M + H是H + SUP>或Li + + / / SUP。 进一步公开的是由下式（A）表示的酰亚胺单体：<？in-line-formula description =“In-line formula”end =“lead”？> Z < 2 N 2 - - - - - - - - - - - - - - - - - - （2） （A）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中Y是2或更大的整数，Z 1是OH，F ，Cl，Br，I或NZ 3 Z 4（其中Z 3和Z 4各自独立地为 H，M或SiMe 3，M是金属元素），Z 2是OH，F，Cl，Br，I或NZ 3 Z 3，其中Z 3和Z 4各自独立地为H，M或SiMe 3，和 M是金属元素），并且M + +是H +或/或SUP。