Abstract:
The invention provides a battery device and a method for packaging, disassembling, and recycling the battery device, wherein the anode conductive element is disposed in a reaction trough frame with a bump thereof protruding from the frame; two sets of the cathode conductive elements cover on a first opening and a second opening of the reaction trough frame, respectively, so as to form a reaction region for accommodating electrolyte therein; and a metallic fastener is disposed on surfaces of the cathode conductive elements and the reaction trough frame and fastened with a buckling member. The invention provides a simple structure that can be packaged rapidly, disassembled and recycled to thereby overcome the drawbacks of conventional batteries.
Abstract:
A projection module adapted to be disposed in an electronic device is provided. The electronic device includes a main body and the projection module disposed in the main body. The projection module includes a chassis, a light source, a light valve, a first lens group, and a second lens group. The light source and the light valve are disposed on the chassis. The first lens group is fixed on the chassis. The second lens group is slidably assembled on the chassis and is disposed between the light valve and the first lens group. The light source is capable of providing a light beam, and the light beam is capable of emitting through the light valve, the second lens group, and the first lens group in sequence.
Abstract:
A method of fabricating a photoelectric device of Group III nitride semiconductor comprises the steps of: forming a first Group III nitride semiconductor layer on a surface of an original substrate; forming a patterned epitaxial-blocking layer on the first Group III nitride semiconductor layer; forming a second Group III nitride semiconductor layer on the epitaxial-blocking layer and the first Group III nitride semiconductor layer not covered by the epitaxial-blocking layer and then removing the epitaxial-blocking layer; forming a third Group III nitride semiconductor layer on the second Group III nitride semiconductor layer; depositing or adhering a conductive layer on the third Group III nitride semiconductor layer; and releasing a combination of the third Group III nitride semiconductor layer and the conductive layer apart from the second Group III nitride semiconductor layer.
Abstract:
A backlight structure comprises a frame, a circuit board, and a connector. The frame has an opening. The circuit board is located below the frame and has a through hole, wherein the through hole aligns with the opening. The connector passes through the opening and the through hole, protrudes from a surface of the frame, and is electrically connected to the circuit board.
Abstract:
An image stabilization method for a camera is provided. The image stabilization method controls the shutter of the camera. The image stabilization method, according to the present invention, first detects whether a trigger signal has been inputted, wherein the trigger signal is inputted by a user and starts an image capturing process. Next, the time when the trigger signal was inputted is detected and recorded as a first time. Afterwards, a stabilization time is delayed based upon the first time. Finally, a drive signal is generated when the stabilization time ends, wherein the drive signal drives the shutter to turn on for executing the image capturing process.
Abstract:
A method for separating an epitaxial substrate from a semiconductor layer initially forms a patterned silicon dioxide layer between a substrate and a semiconductor layer, and then separates the substrate from the patterned silicon dioxide layer using two wet etching processes.
Abstract:
A wireless network connecting and setting method includes the following steps; a detect signal is transmitted through a first wireless network device; a detect reply is replied to the first wireless network device when the detect signal is received by a second wireless network device; a wireless access point (AP) profile of the first wireless network device, according to which the first wireless network device connects to a wireless AP, is transmitted to the second wireless network device; the second wireless network device is connected to the wireless AP according to the wireless AP profile, such that the second wireless network device connects to a network through the wireless AP.
Abstract:
A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.
Abstract:
A semiconductor optoelectronic device with enhanced light extraction efficiency includes at least one protrusion structure, which can be formed around a light-emitting region of the device. The at least one protrusion structure can include a plurality of protrusion structures in one embodiment. In addition, a fabricating method for forming a semiconductor optoelectronic device with enhanced light extraction efficiency is provided in the present invention.
Abstract:
A latch locking type connector has one elastic cantilever and an actuation plate respectively disposed with an inclined plate and a slide corresponding to each other; plunging by both of the slide and the inclined plate raises a free end of the elastic cantilever to separate a connector casing from a lead frame; the elastic cantilever pushes and contacts in opposite direction to return the actuation plate to its original place while allowing a free end of the elastic cantilever to return to its normal position to produce expected latch locking function when the connector casing and the lead frame are connected to each other once again.