公开(公告)号：US07821229B2

公开(公告)日：2010-10-26

申请号：US12335325

申请日：2008-12-15

申请人： Wei Wang ,  Guoxing Li ,  Sean Xiao

发明人： Wei Wang ,  Guoxing Li ,  Sean Xiao

IPC分类号： H01M10/44 ,  H01M10/46

CPC分类号： H02J7/0016

摘要： A system and method for cell balancing with smart low-voltage control circuit. The cell balancing system comprises a plurality of battery cells, an external bypass path for each cell, an internal bypass path for each cell, an input terminal receiving an enable signal for each cell, an input terminal receiving a selection signal, and a cell balancing unit for generating a configuration signal to conduct the external bypass path or internal bypass path. The enable signal is configured to enable a bypass current of each cell, and the selection signal is configured to select the external bypass path or internal bypass path. The cell balancing unit is employed to receive signals from input terminals, and generate a configuration signal to control the conductance of external bypass paths or internal bypass paths.

摘要翻译： 一种智能低压控制电路电池平衡的系统和方法。 电池平衡系统包括多个电池单元，每个单元的外部旁路路径，每个单元的内部旁路路径，每个单元接收使能信号的输入端子，接收选择信号的输入端子和单元平衡 用于产生配置信号以传导外部旁路路径或内部旁路路径的单元。 使能信号被配置为启用每个单元的旁路电流，并且选择信号被配置为选择外部旁路路径或内部旁路路径。 采用电池平衡单元从输入端子接收信号，并产生配置信号以控制外部旁路路径或内部旁路路径的电导。

公开(公告)号：US20100268109A1

公开(公告)日：2010-10-21

申请号：US12451944

申请日：2008-06-06

申请人： Wei Wang

发明人： Wei Wang

IPC分类号： A61B5/053

CPC分类号： A61B5/0536

摘要： A method for analyzing the structure of an electrically conductive object, the method comprising the steps of: (i) obtaining electrical impedance data for the object over a range of frequencies; (ii) analyzing the obtained electrical impedance data using a transfer function of an assumed electrical model to determine a plurality of electrical impedance properties for the object; (iii) constructively combining selected ones of the determined plurality of electrical impedance properties to provide at least one parametric impedance value for the object; and (iii) imaging one or more of the determined parametric impedance values.

摘要翻译： 一种用于分析导电物体的结构的方法，所述方法包括以下步骤：（i）在频率范围内获得所述物体的电阻抗数据; （ii）使用假定的电气模型的传递函数分析所获得的电阻抗数据，以确定所述物体的多个电阻抗特性; （iii）构建性地组合所确定的多个电阻抗特性中的所选择的一个以为所述物体提供至少一个参数阻抗值; 以及（iii）对确定的参数阻抗值中的一个或多个进行成像。

公开(公告)号：USD623642S1

公开(公告)日：2010-09-14

申请号：US29356972

申请日：2010-03-04

申请人： Wei Wang

设计人： Wei Wang

公开(公告)号：US20100133640A1

公开(公告)日：2010-06-03

申请号：US12434199

申请日：2009-05-01

申请人： Zhiqi Wang ,  Guoqing Yu ,  Qiuhong Zou ,  Youjun Wang ,  Wei Wang

发明人： Zhiqi Wang ,  Guoqing Yu ,  Qiuhong Zou ,  Youjun Wang ,  Wei Wang

IPC分类号： H01L31/0224 ,  H01L21/768

CPC分类号： H01L27/14687 ,  H01L24/13 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing from a back side of the chip to the pad is provided on the chip, and the intermediate metal layer is connected to the pad within the through hole. In the packaging structure, a through hole is formed on the back side of the chip to expose the pad on the front side of the chip and the intermediate metal layer is connected to the pad within the through hole. This provides a relatively large contacting area therebetween. The connection thus formed is more reliable and stable, compared with the prior art structure.

摘要翻译： 本发明公开了一种包装结构和包装方法。 封装结构包括焊料凸块，位于芯片前侧的焊盘和连接焊料凸块和焊盘的中间金属层，其中提供从芯片的背面通过焊盘的通孔 并且中间金属层在通孔内连接到焊盘。 在封装结构中，在芯片的背面形成通孔，露出芯片正面的焊盘，中间金属层与通孔内的焊盘连接。 这提供了它们之间相对较大的接触面积。 与现有技术的结构相比，这样形成的连接更可靠和稳定。

公开(公告)号：USD615587S1

公开(公告)日：2010-05-11

申请号：US29321951

申请日：2008-07-25

申请人： Wei Wang

设计人： Wei Wang

公开(公告)号：US20100113827A1

公开(公告)日：2010-05-06

申请号：US12290757

申请日：2008-11-03

申请人： Wei Wang

发明人： Wei Wang

IPC分类号： C07C53/08

CPC分类号： C07C51/12 ,  C07C51/47 ,  C07C53/08

摘要： A method for removing iodobenzene compounds from an acetic acid is disclosed. The method comprises contacting an acetic acid with palladium supported on macroreticular ion-exchange resins. A process for producing acetic acid is also disclosed. The process comprises carbonylating methanol in the presence of a carbonylation catalyst and a triphenylphosphine oxide stabilizer to produce acetic acid which contains iodobenzene compounds and removing the iodobenzene compounds by contacting the acetic acid product with palladium.

摘要翻译： 公开了一种从乙酸中除去碘苯化合物的方法。 该方法包括使乙酸与负载在大网络离子交换树脂上的钯接触。 还公开了一种生产乙酸的方法。 该方法包括在羰基化催化剂和三苯基膦氧化物稳定剂的存在下羰基化甲醇以产生含有碘苯化合物的乙酸，并通过使乙酸产物与钯接触来除去碘苯化合物。

公开(公告)号：US20100065956A1

公开(公告)日：2010-03-18

申请号：US12412778

申请日：2009-03-27

申请人： Zhiqi WANG ,  Guoqing Yu ,  Qiuhong Zou ,  Wei Wang

发明人： Zhiqi WANG ,  Guoqing Yu ,  Qiuhong Zou ,  Wei Wang

IPC分类号： H01L23/485 ,  H01L21/50

CPC分类号： H01L27/14618 ,  H01L24/16 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05099 ,  H01L2924/01028

摘要： The application provides a packaging structure, a packaging method and a photosensitive device. The packaging structure includes a substrate structure, a chip and a solder bump electrically connecting with a pad on the chip. The solder bump is located on the substrate structure, so that the multilayer coverage structure required when forming a bump on a side of the chip in the prior art packaging structure is avoided. In this way, the thickness of the packaging structure is reduced and the reliably of the packaging structure is improved.

摘要翻译： 该应用提供包装结构，包装方法和感光装置。 封装结构包括与芯片上的焊盘电连接的衬底结构，芯片和焊料凸块。 焊料凸块位于衬底结构上，从而避免了在现有技术的封装结构中在芯片侧面形成凸块所需的多层覆盖结构。 以这种方式，减小了包装结构的厚度，提高了包装结构的可靠性。

公开(公告)号：US07673450B2

公开(公告)日：2010-03-09

申请号：US11492734

申请日：2006-07-25

申请人： Wei Wang ,  Philip George ,  Christopher Shamie ,  Bhaskar Marathe

发明人： Wei Wang ,  Philip George ,  Christopher Shamie ,  Bhaskar Marathe

IPC分类号： F16D33/00 ,  F16D33/20

CPC分类号： F16H41/28

摘要： More efficient, economic vehicular torque converters comprising novel integrated one-piece turbine/impeller blade-core assemblies with innovative fluid coupling means for greater torque capacities.

摘要翻译： 更高效，经济的车辆扭矩转换器包括新颖的集成的单件涡轮/叶轮叶片 - 芯组件，其具有用于更大扭矩容量的创新的流体联接装置。

公开(公告)号：US20090288985A1

公开(公告)日：2009-11-26

申请号：US10592166

申请日：2005-03-08

申请人： Jun Long ,  Zhijian Da ,  Dadong Li ,  Xieqing Wang ,  Xingtian Shu ,  Jiushun Zhang ,  Hong Nie ,  Chaogang Xie ,  Zhigang Zhang ,  Wei Wang

发明人： Jun Long ,  Zhijian Da ,  Dadong Li ,  Xieqing Wang ,  Xingtian Shu ,  Jiushun Zhang ,  Hong Nie ,  Chaogang Xie ,  Zhigang Zhang ,  Wei Wang

IPC分类号： C10G45/00 ,  C10G51/02

CPC分类号： C10G69/04 ,  C07C4/06 ,  C07C5/05 ,  C07C5/11 ,  C10G11/18 ,  C10G69/02 ,  C10G69/06 ,  C10G69/14 ,  C10G2300/1044 ,  C10G2300/1055 ,  C10G2300/107 ,  C10G2300/1074 ,  C10G2300/1077 ,  C10G2300/301 ,  C10G2300/4006 ,  C10G2300/4018 ,  C10G2300/4093 ,  C10G2300/44 ,  C10G2300/807 ,  C10G2400/20 ,  C10G2400/30

摘要： A process for producing light olefins and aromatics, which comprises reacting a feedstock with a catalytic cracking catalyst in at least two reaction zones, wherein the reaction temperature of at least one reaction zone downstream of the first reaction zone is higher than that of the first reaction zone and its weight hourly space velocity is lower than that of the first reaction zone. The spent catalyst is separated from the reaction product vapor, regenerated and then returned to the reactor. The reaction product vapor is separated to obtain the desired products, light olefins and aromatics. This process efficiently produces light olefins such as propylene, ethylene, etc. from heavy feedstocks, wherein the yield of propylene exceeds 20% by weight, and produces aromatics such as toluene, xylene, etc. at the same time.

摘要翻译： 一种用于生产轻质烯烃和芳族化合物的方法，其包括在至少两个反应区中使原料与催化裂化催化剂反应，其中第一反应区下游的至少一个反应区的反应温度高于第一反应的反应温度 其重量时空速度低于第一反应区。 将废催化剂与反应产物蒸气分离，再生，然后返回反应器。 将反应产物蒸气分离以获得所需产物，轻质烯烃和芳族化合物。 该方法从重质原料中有效地生产轻质烯烃如丙烯，乙烯等，其中丙烯的产率超过20重量％，同时产生芳烃如甲苯，二甲苯等。

公开(公告)号：US20090285439A1

公开(公告)日：2009-11-19

申请号：US12453496

申请日：2009-05-13

申请人： Hideo Yuasa ,  Hidenori Motonaga ,  Katsunari Fujita ,  Wei Wang

发明人： Hideo Yuasa ,  Hidenori Motonaga ,  Katsunari Fujita ,  Wei Wang

IPC分类号： H04R1/00

CPC分类号： H04R1/06 ,  H04R2499/11

摘要： According to the invention, in an electroacoustic transducing device comprising: a magnetic circuit 13 having a yoke 4, a magnet 11, and a pole piece 12; a vibration system 16 having a diaphragm 14 and a voice coil 15; and a frame 1 which holds the magnetic circuit 13 and the vibration system 16, the voice coil 15 being placed in a magnetic gap 30, lead wires 17, 18 of the voice coil 15 are drawn out from the voice coil 15 at positions which are remote from the diaphragm 14, and openings 7A, 7B for air forming for forming slack portions 31, 32 in the lead wires 17, 18 drawn out from the voice coil 15 are disposed in the frame 1. The lead wires 17, 18 are adequately subjected to the wire laying process, and the audio performance is prevented from being lowered.

摘要翻译： 根据本发明，在一种电声转换装置中，包括：具有轭4，磁体11和极片12的磁路13; 具有隔膜14和音圈15的振动系统16; 和保持磁路13和振动系统16的框架1，将音圈15放置在磁隙30中，将音圈15的引线17,18从音圈15拉出， 远离隔膜14的空气形成开口7A，7B，用于形成用于形成从音圈15拉出的引线17,18中的松弛部31,32的开口7A，7B设置在框架1中。引线17,18充分 进行布线处理，防止音频性能下降。