公开(公告)号：US10107667B2

公开(公告)日：2018-10-23

申请号：US15839587

申请日：2017-12-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Robert N. K. Browning

IPC: G01F23/24 ,  G01F23/22 ,  H05B3/82 ,  B41J2/175 ,  B41J2/195

Abstract: Examples provide a series of heaters supported at different depths within the volume. A series of temperature sensors is supported at different depths within the volume. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid within the volume.

公开(公告)号：US20180269125A1

公开(公告)日：2018-09-20

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/29 ,  B41J2/14

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US20180264813A1

公开(公告)日：2018-09-20

申请号：US15761202

申请日：2015-11-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/145

CPC classification number: B41J2/1433 ,  B41J2/14 ,  B41J2/145 ,  B41J2/155 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2002/14491 ,  B41J2202/20

Abstract: Examples include a glass-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises nozzles for dispensing printing material. The glass-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.

公开(公告)号：US20180226316A1

公开(公告)日：2018-08-09

申请号：US15745743

申请日：2015-08-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/48 ,  H01L23/373 ,  B41J2/155

CPC classification number: H01L23/3135 ,  B41J2/155 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2202/20 ,  H01L23/3737 ,  H01L23/48 ,  H01L23/552 ,  H01L2224/96 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49401 ,  H01L2924/00012

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US09969157B1

公开(公告)日：2018-05-15

申请号：US15665560

申请日：2017-08-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Scott A. Linn ,  George H. Corrigan, III ,  Michael W. Cumbie

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/21

CPC classification number: B41J2/04573 ,  B41J2/0452 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14129 ,  B41J2/14201 ,  B41J2/2125 ,  B41J2002/14362

Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.

公开(公告)号：US09902162B2

公开(公告)日：2018-02-27

申请号：US14770049

申请日：2013-02-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/155 ,  B41J2/16

CPC classification number: B41J2/17526 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In one example, a print bar includes multiple printhead dies molded into an elongated, monolithic body. The dies are arranged generally end to end along a length of the body and the body has a channel therein through which fluid may pass directly to the dies.

公开(公告)号：US20170313079A1

公开(公告)日：2017-11-02

申请号：US15654084

申请日：2017-07-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B29C69/001 ,  B41J2/14016 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4007 ,  H05K2203/0228 ,  H05K2203/1316 ,  Y10T29/49401

Abstract: A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.

公开(公告)号：US20170305167A1

公开(公告)日：2017-10-26

申请号：US15644235

申请日：2017-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Silam J. Choy

IPC: B41J2/175 ,  B41J2/14 ,  B41J2/16 ,  B41J2/155

Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

公开(公告)号：US09656469B2

公开(公告)日：2017-05-23

申请号：US14770344

申请日：2013-06-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Arun K. Agarwal

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1645 ,  B41J2002/14411 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

公开(公告)号：US20160221341A1

公开(公告)日：2016-08-04

申请号：US15021522

申请日：2013-09-20

Applicant: HEWLETT-PACKARD DEVELOPMENT, COMPANY L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2002/14419 ,  B41J2202/19

Abstract: A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.

Abstract translation: 描述了印刷模块及其形成方法。 在一个示例中，打印头模块包括印刷电路板（PCB），多个打印头芯片和歧管。 打印头芯片嵌入模制中并连接到PCB。 模制件具有与打印头芯片的流体供给孔流体连通的多个槽。 歧管与槽直接流体连通以向其供应流体。