公开(公告)号：US11482621B2

公开(公告)日：2022-10-25

申请号：US16143222

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Willy Rachmady ,  Patrick Morrow ,  Aaron Lilak ,  Rishabh Mehandru ,  Cheng-Ying Huang ,  Gilbert Dewey ,  Kimin Jun ,  Ryan Keech ,  Anh Phan ,  Ehren Mannebach

IPC: H01L29/78 ,  H01L21/768 ,  H01L29/66 ,  H01L29/06

Abstract: Embodiments include transistor devices and a method of forming the transistor devices. A transistor device includes a first dielectric over a substrate, and vias on a first metal layer, where the first metal layer is on an etch stop layer that is on the first dielectric. The transistor device also includes a second dielectric over the first metal layer, vias, and etch stop layer, where the vias include sidewalls, top surfaces, and bottom surfaces, and stacked transistors on the second dielectric and the top surfaces of the vias, where the sidewalls and top surfaces of the vias are positioned within a footprint of the stacked transistors. The stacked transistors include gate electrodes and first and second transistor layers. The first metal layer includes conductive materials including tungsten or cobalt. The footprint may include a bottom surface of the first transistor layer and a bottom surface of the gate electrodes.

公开(公告)号：US20220278057A1

公开(公告)日：2022-09-01

申请号：US17748877

申请日：2022-05-19

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Patrick Morrow ,  Henning Braunisch ,  Kimin Jun ,  Brennen Karl Mueller ,  Shawna M. Liff ,  Johanna M. Swan ,  Paul B. Fischer

IPC: H01L23/64 ,  H01L23/34 ,  H01L23/66 ,  H01L49/02

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may a die having a front side and a back side, the die comprising a first material and conductive contacts at the front side; and a thermal layer attached to the back side of the die, the thermal layer comprising a second material and a conductive pathway, wherein the conductive pathway extends from a front side of the thermal layer to a back side of the thermal layer.

公开(公告)号：US20220199546A1

公开(公告)日：2022-06-23

申请号：US17127382

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Gerald S. Pasdast ,  Kimin Jun ,  Zhiguo Qian ,  Johanna M. Swan ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Mohammad Enamul Kabir ,  Feras Eid ,  Kevin P. O'Brien ,  Han Wui Then

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component, having a first surface and an opposing second surface including a first direct bonding region at the second surface with first metal contacts and a first dielectric material between adjacent ones of the first metal contacts; a second microelectronic component, having a first surface and an opposing second surface, including a second direct bonding region at the first surface with second metal contacts and a second dielectric material between adjacent ones of the second metal contacts, wherein the second microelectronic component is coupled to the first microelectronic component by the first and second direct bonding regions; and a shield structure in the first direct bonding dielectric material at least partially surrounding the one or more of the first metal contacts.

公开(公告)号：US20220199468A1

公开(公告)日：2022-06-23

申请号：US17133065

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Kimin Jun ,  Souvik Ghosh ,  Willy Rachmady ,  Ashish Agrawal ,  Siddharth Chouksey ,  Jessica Torres ,  Jack Kavalieros ,  Matthew Metz ,  Ryan Keech ,  Koustav Ganguly ,  Anand Murthy

IPC: H01L21/768 ,  H01L23/522 ,  H01L29/417 ,  H01L29/45 ,  H01L29/40 ,  H01L29/66 ,  H01L23/00 ,  H01L27/22 ,  H01L27/24

Abstract: An integrated circuit interconnect structure includes a metallization level above a first device level. The metallization level includes an interconnect structure coupled to the device structure, a conductive cap including an alloy of a metal of the interconnect structure and either silicon or germanium on an uppermost surface of the interconnect structure. A second device level above the conductive cap includes a transistor coupled with the conductive cap. The transistor includes a channel layer including a semiconductor material, where at least one sidewall of the conductive cap is co-planar with a sidewall of the channel layer. The transistor further includes a gate on a first portion of the channel layer, where the gate is between a source region and a drain region, where one of the source or the drain region is in contact with the conductive cap.

公开(公告)号：US20220093569A1

公开(公告)日：2022-03-24

申请号：US17538200

申请日：2021-11-30

Applicant: INTEL CORPORATION

Inventor： Anup Pancholi ,  Kimin Jun

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00

Abstract: An apparatus is provided which comprises: a first die having a first surface and a second surface, the first die comprising: a first layer formed on the first surface of the first die, and a second layer formed on the second surface of the first die; a second die coupled to the first layer; and a plurality of structures to couple the apparatus to an external component, wherein the plurality of structures is coupled to the second layer.

公开(公告)号：US20220093547A1

公开(公告)日：2022-03-24

申请号：US17025843

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Zhiguo Qian ,  Gerald S. Pasdast ,  Mohammad Enamul Kabir ,  Han Wui Then ,  Kimin Jun ,  Kevin P. O'Brien ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Feras Eid

IPC: H01L23/00 ,  H01L25/065 ,  H01L49/02

Abstract: Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.

公开(公告)号：US11244943B2

公开(公告)日：2022-02-08

申请号：US16728983

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Cheng-Ying Huang ,  Gilbert Dewey ,  Ashish Agrawal ,  Kimin Jun ,  Willy Rachmady ,  Zachary Geiger ,  Cory Bomberger ,  Ryan Keech ,  Koustav Ganguly ,  Anand Murthy ,  Jack Kavalieros

IPC: H01L27/06 ,  H01L21/683 ,  H01L21/8238 ,  H01L29/10 ,  H01L29/04 ,  H01L29/08 ,  H01L27/092

Abstract: A monolithic three-dimensional integrated circuit may include multiple transistor levels separated by one or more levels of metallization. An upper level transistor structure may include a monocrystalline channel material over a bottom gate stack. The channel material and the gate stack materials may be formed on a donor substrate at any suitable temperature, and subsequently transferred from the donor substrate to a host substrate that includes lower-level circuitry. The upper-level transistor may be patterned from the transferred layers so that the gate electrode includes one or more bonding layers. Source and drain material may be patterned from a source and drain material layer that was transferred from the donor substrate along with the channel material, or source and drain material may be grown at low temperatures from the transferred channel material.

公开(公告)号：US10784358B2

公开(公告)日：2020-09-22

申请号：US15747119

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Patrick Morrow ,  Rishabh Mehandru ,  Aaron D. Lilak ,  Kimin Jun

IPC: H01L29/417 ,  H01L29/423 ,  H01L27/12 ,  H01L29/78 ,  H01L29/66 ,  H01L21/8234 ,  H01L29/08 ,  H01L29/40 ,  H01L21/225 ,  H01L21/265

Abstract: An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a transistor device including a channel between a source region and a drain region and a gate electrode on the channel defining a first side of the device; and forming an interconnect to one of the source region and the drain region from a second side of the device.

公开(公告)号：US20200295003A1

公开(公告)日：2020-09-17

申请号：US16354960

申请日：2019-03-15

Applicant: INTEL CORPORATION

Inventor： Gilbert W. Dewey ,  Jack T. Kavalieros ,  Willy Rachmady ,  Cheng-Ying Huang ,  Matthew V. Metz ,  Kimin Jun ,  Patrick Morrow ,  Aaron D. Lilak ,  Ehren Mannebach ,  Anh Phan

IPC: H01L27/092 ,  H01L29/16 ,  H01L29/20 ,  H01L29/06 ,  H01L29/78 ,  H01L21/8238 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L29/10

Abstract: Disclosed herein are stacked transistors having device strata with different channel widths, as well as related methods and devices. In some embodiments, an integrated circuit structure may include stacked strata of transistors, wherein different channel materials of different strata have different widths.

公开(公告)号：US10658291B2

公开(公告)日：2020-05-19

申请号：US16227406

申请日：2018-12-20

Applicant: Intel Corporation

Inventor： Donald W. Nelson ,  Patrick Morrow ,  Kimin Jun

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/00 ,  H01L29/78

Abstract: A method including forming a plurality of first interconnects and a plurality of second interconnects on opposite sides of an integrated circuit device layer including a plurality of circuit devices, wherein the plurality of second interconnects include interconnects of different dimensions; and forming contact points to the second plurality of interconnects, the contact points operable for connection to an external source. An apparatus including a substrate including a plurality of first interconnects and a plurality of second interconnects on opposite sides of an integrated circuit device layer including a plurality of circuit devices, wherein the plurality of second interconnects include interconnects of different dimensions; and contact points coupled to the second plurality of interconnects, the contact points operable for connection to an external source.