摘要:
A slide mechanism (100) used in portable electronic device (300) is described including a main plate (10), a slide plate (20), two sliders (40), and two guiders (30). The slide plate is installed on the main plate and slidable relative to the main plate. The sliders are securely attached to the slide plate, and the guiders are securely attached to the main plate deformably guiding the sliders to move along it. When the slide plate slides along the main plate, the sliders and the guiders compress with each other, thereby generating deformations therebetween and driving the sliding of the slide plate along the main plate.
摘要:
The invention discloses a conductive elastic sheet structure mounted on a metallic cover of an electronic device eliminates static electricity. The conductive elastic sheet structure includes a main panel, a first extending portion, and a second extending portion. The main panel includes a first side wall, and a second side wall opposite to the first side wall. The first extending portion and the second extending portion extend from the side edges of the first side wall and the second side wall respectively, and each forms a sharp angle with the main panel. The first extending portion and the second extending portion extend from two opposite sides of the main panel respectively. The invention also provides an electronic device using the conductive elastic sheet structure.
摘要:
A negative feedback system includes a first summation module for receiving a system input and outputting a first summation output. A first forward module is coupled to the first summation module for receiving the first summation output and outputting a first forward output. A feedback module is coupled to the first summation module for receiving the first forward output and outputting a feedback output to the first summation module, wherein the first summation output equals the system input minus the feedback output. An error compensation module, having a compensation gain, is coupled to the first summation module for receiving the first summation output and outputting an error compensation output. The compensation gain is adjusted to provide the error compensation output with a predetermined value, such that an output error of a system output is substantially eliminated by combining the error compensation output with the first forward output.
摘要:
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.