Abstract:
Disclosed are designs and methods of fabrication of silicon carrier-depletion based electro-optical modulators having doping configurations that produce modulators exhibiting desirable modulation efficiency, optical absorption loss and bandwidth characteristics. The disclosed method of fabrication of a modulator having such doping configurations utilizes counter doping to create narrow regions of relatively high doping levels near a waveguide center.
Abstract:
Disclosed herein is a traveling-wave Mach-Zehnder modulator and method of operating same that advantageously exhibits a reduced optical insertion loss as compared with contemporary Mach-Zehnder structures. Such advantage comes at the modest expense of increased modulator length and increased RF loss.
Abstract:
Disclosed herein are methods, structures, and devices for a silicon carrier-depletion based modulator with enhanced doping in at least part of slab regions between waveguide core and contact areas. Compared to prior designs, this modulator exhibits lower optical absorption loss and better modulation bandwidth without sacrificing the modulation efficiency when operating at comparable bandwidth settings.
Abstract:
Disclosed herein are methods, structures, apparatus and devices for the termination of unused waveguide ports in planar photonic integrated circuits with doped waveguides such that free-carrier absorption therein may advantageously absorb any undesired optical power resulting in a significant reduction of stray light and resulting reflections.
Abstract:
Disclosed are structures and methods for optical isolation based on tandem phase modulators in a long interferometer that advantageously provides low-loss, broadband isolation in a photonic integrated circuit without requiring special materials or fabrication steps.
Abstract:
A photonic device comprising a first waveguide core and a second waveguide core. The first waveguide core is asymmetric relative to an imaginary plane that bisects a height of the first waveguide core and is parallel to the bottom surface of the first waveguide core throughout a first region of the photonic device. A side surface of the second waveguide core is parallel to the first waveguide core throughout the first region of the photonic device.
Abstract:
A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.
Abstract:
Techniques for forming a facet optical coupler that includes a waveguide formed over a trench of a silicon substrate are described. The trench is formed in a silicon substrate and then filled with a dielectric material. The waveguide is patterned on the dielectric material over the trench such that the waveguide is disposed a distance from the first surface. A first end of the waveguide has a first size and a second end of the waveguide distal the first end has a second size different than the first size. A material of the waveguide and the first size define a mode size of the waveguide.
Abstract:
Disclosed herein are methods, structures, and devices for optical communications systems operating through turbulent media. More specifically, a spatial division multiplexing photonic integrated circuit is used in conjunction with digital signal processing systems to mitigate the effects of the turbulent media.
Abstract:
Disclosed herein are methods, structures, apparatus and devices to integrate polarization filters and power tap couplers on planar photonic circuits that advantageously provide a lower insertion loss to an optical signal and improved optical bandwidth as compared with contemporary designs wherein these two functions are implemented separately.