Abstract:
A camera strobe recharging IC includes a one-shot unit, an R-S latch block unit, a PWM control unit, and a ready control unit. The one-shot unit provides square wave signals. The R-S latch block unit is electrically connected with the one-shot unit. The PWM control unit includes a reference voltage source, an oscillator, a PWM comparator, a voltage boost comparator, and a current source. The ready control unit includes an FET, which has a gate contact electrically connected with an output contact of the R-S latch block unit. Accordingly, the present invention is compact and structurally tiny to facilitate integration and is good at modulating charging current, accelerating charging, and automatically recharging.
Abstract:
A surface dresser for removing contaminants includes a body assembly with a stationary seat and an adjustable assembly with a dressing wheel. The adjustable assembly is rotatably mounted on an outer periphery of the stationary seat. Two pairs of pin holes are defined in the stationary seat, and a flexible pin with two short ends is movably mounted in each pair of pin holes. A latch is slidably attached on the outer periphery of the stationary seat and has two clamping holes and two detents corresponding to two adjacent pin holes. When the adjustable assembly is rotated relative to the body assembly by a specific angle, the flexible pins selectively engage the clamping holes and the detents in the latch to lock the adjustable assembly. Consequently, the angle of the dressing wheel is adjustable to accommodate various requirements.
Abstract:
Performance of the high resistance resistor, which is polysilicon, is improved by treating the surface of the polysilicon layer in mixed signal integrated circuits for ADSL (Asymmetric Digital Subscriber Line) broadband service application. This treated surface of the polysilicon layer will prevent ions in the resistor from out-diffusion when performing an annealing step after forming the resistor.
Abstract:
An elaborately designed miniature air compressor is composed of a motor unit, a compression unit, and an air collection unit. Several bladders installed in the compression unit are sequentially actuated by a compression vane with a thrust and pulling force imparted from priston like motion caused by revolution of an eccentrically installed follower rod such that air is continuously supplied to the air collection unit and ejected out of an air output port uniformly, stably, and adequately. Besides, all component units of the miniature air pump are combined together by two shackles in stead of using latch pins.
Abstract:
The uniformity of material removal, as well as contamination due to deposited particulate matter, has been reduced in single wafer sputter-etchers by providing an improved gas baffle. Said gas baffle presents a smooth surface to the incoming sputtering gas so that it disperses uniformly throughout the sputtering chamber, thereby avoiding local fluctuations in pressure which, in turn, can lead to local differences in material removal rate as well as to particulate contamination of the surface that is being etched. The design of the baffle is described along with a method for attaching it to the inside of the sputtering shield.
Abstract:
A method of fabricating shallow trench isolation. A silicon oxide layer is formed on a substrate. The silicon oxide layer is patterned and a portion of the substrate is removed to form a trench within the substrate. A liner oxide layer is formed on the sidewall of the trench. An insulating layer is formed on the substrate and filled in the trench. A portion of the insulating layer is removed by CMP to expose the silicon oxide layer. The silicon oxide layer is removed and the STI structure is completed.
Abstract:
The invention provides a chemical-mechanical polishing pad, which includes a plurality of annular grooves and a plurality of streamline grooves designed according to principles of the hydrodynamics. The streamline grooves of polishing pad are designed according to flow equations derived from source flow and vortex flow, and the streamline grooves of polishing pad uniformly distribute the slurry on the polishing pad. An angle and a depth of the streamline groove, which are calculated by boundary layer effect of the streamline groove function, are used to design an optimum structure for polishing pad.
Abstract:
A method for preventing the occurrence of poisoned trenches and vias in a dual damascene process that includes performing a densification process, such as an electron-beam process, on the surface of the exposed dielectric layer around the openings before the openings are filled with conductive material. The densified surface of the dielectric layer is able to efficiently prevent the occurrence of poisoned trenches and vias caused by the outgassing phenomena.
Abstract:
Measurement of contaminating nitrogen during silicon ion implantation has been achieved by including a silicon wafer as a monitor in the implantation chamber. After silicon ion implantation, the monitor is subjected to a rapid thermal oxidation (about 1,100.degree. C. for one minute) and the thickness of the resulting grown oxide layer is measured. The thinner the oxide layer (relative to an oxide layer grown on pure silicon) the greater the degree of nitrogen contamination. For example, a reduction in oxide thickness of about 30 Angstroms corresponds to a nitrogen dosage of about 10.sup.13 atoms/sq. cm. By measuring total ion dosage during implantation and then subtracting the measured nitrogen dosage, the corrected silicon dosage may also be computed.
Abstract:
The uniformity of material removal, as well as contamination due to deposited particulate matter, has been reduced in single wafer sputter-etchers by providing an improved gas baffle. Said gas baffle presents a smooth surface to the incoming sputtering gas so that it disperses uniformly throughout the sputtering chamber, thereby avoiding local fluctuations in pressure which, in turn, can lead to local differences in material removal rate as well as to particulate contamination of the surface that is being etched. The design of the baffle is described along with a method for attaching it to the inside of the sputtering shield.