公开(公告)号：US10856848B2

公开(公告)日：2020-12-08

申请号：US15626885

申请日：2017-06-19

Applicant: Butterfly Network, Inc.

Inventor： Tomer Gafner ,  Matthew de Jonge ,  Robert Schneider ,  David Elgena ,  Alex Rothberg ,  Jonathan M. Rothberg ,  Michal Sofka ,  Karl Thiele ,  Abraham Neben

IPC: A61B8/00 ,  G06T7/70 ,  G06K9/00 ,  G06K9/62 ,  G06K9/46 ,  A61B8/08 ,  A61B8/06 ,  G06T19/00 ,  A61B8/02 ,  G06T7/00 ,  G06T11/60 ,  G06K9/66 ,  A61B90/00 ,  A61B34/20

Abstract: Aspects of the technology described herein relate to techniques for guiding an operator to use an ultrasound device. Thereby, operators with little or no experience operating ultrasound devices may capture medically relevant ultrasound images and/or interpret the contents of the obtained ultrasound images. For example, some of the techniques disclosed herein may be used to identify a particular anatomical view of a subject to image with an ultrasound device, guide an operator of the ultrasound device to capture an ultrasound image of the subject that contains the particular anatomical view, and/or analyze the captured ultrasound image to identify medical information about the subject.

公开(公告)号：US20200211174A1

公开(公告)日：2020-07-02

申请号：US16816076

申请日：2020-03-11

Applicant: Butterfly Network, Inc.

Inventor： Alex Rothberg ,  Igor Lovchinsky ,  Jimmy Jia ,  Tomer Gafner ,  Matthew de Jonge ,  Jonathan M. Rothberg

IPC: G06T7/00 ,  G01S17/00

Abstract: Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.

公开(公告)号：US20200066966A1

公开(公告)日：2020-02-27

申请号：US16666238

申请日：2019-10-28

Applicant: Butterfly Network Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Keith G. Fife

IPC: H01L41/27 ,  H05K3/36 ,  H01L41/047 ,  B06B1/06 ,  B06B1/02

Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

公开(公告)号：US20190388935A1

公开(公告)日：2019-12-26

申请号：US16562821

申请日：2019-09-06

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B7/00 ,  G10K9/12 ,  G10K11/18 ,  B81C1/00 ,  B81B3/00

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20190283081A1

公开(公告)日：2019-09-19

申请号：US16364388

申请日：2019-03-26

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  B81B7/00 ,  G10K9/12 ,  G10K11/18

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20190261955A1

公开(公告)日：2019-08-29

申请号：US16404672

申请日：2019-05-06

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

IPC: A61B8/08 ,  H04B11/00

Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

公开(公告)号：US20190261954A1

公开(公告)日：2019-08-29

申请号：US16404665

申请日：2019-05-06

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

IPC: A61B8/08 ,  H04B11/00

Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

公开(公告)号：US20190047850A1

公开(公告)日：2019-02-14

申请号：US16158999

申请日：2018-10-12

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Jaime Scott Zahorian

IPC: B81C1/00 ,  B06B1/02 ,  B06B1/06 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US09899371B2

公开(公告)日：2018-02-20

申请号：US15259243

申请日：2016-09-08

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Susan A. Alie

IPC: B81B3/00 ,  B81C1/00 ,  H01L21/768 ,  H01L27/06 ,  B06B1/02 ,  B81B7/00 ,  H01L21/3213 ,  H01L21/56 ,  H01L21/8238 ,  H01L23/522 ,  H01L23/528 ,  A61B8/00 ,  H01L27/092

CPC classification number: H01L27/0617 ,  A61B8/00 ,  A61B8/4494 ,  B06B1/02 ,  B06B1/0292 ,  B06B2201/51 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0271 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01L21/32134 ,  H01L21/56 ,  H01L21/768 ,  H01L21/76838 ,  H01L21/823871 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0688 ,  H01L27/092 ,  H01L2224/16225

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

公开(公告)号：US20170360414A1

公开(公告)日：2017-12-21

申请号：US15631729

申请日：2017-06-23

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife ,  David Elgena

IPC: A61B8/00 ,  A61B8/08

CPC classification number: A61B8/4477 ,  A61B8/0883 ,  A61B8/0891 ,  A61B8/12 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4472 ,  A61B8/4494 ,  A61B8/465 ,  A61B8/467 ,  A61B8/483 ,  A61B8/485 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  B06B1/0292 ,  B06B1/0622

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.