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    Metal-insulator- metal (MIM) devices and their methods of fabrication
    122.
    发明申请
    Metal-insulator- metal (MIM) devices and their methods of fabrication 有权
    金属 - 绝缘体 - 金属（MIM）器件及其制造方法

    公开(公告)号：US20080169464A1

    公开(公告)日：2008-07-17

    申请号：US11983205

    申请日：2007-11-06

    Applicant: Xiong Gong ,  Kaixia Yang ,  Gang Yu ,  Boo Jorgen Lars Nilsson ,  Chan-Long Shieh ,  Hsing-Chung Lee ,  Fatt Foong

    Inventor： Xiong Gong ,  Kaixia Yang ,  Gang Yu ,  Boo Jorgen Lars Nilsson ,  Chan-Long Shieh ,  Hsing-Chung Lee ,  Fatt Foong

    IPC: H01L51/52 ,  G02F1/135 ,  H01L51/56

    CPC classification number: G02F1/1365 ,  G02F1/167 ,  H01G11/48 ,  H01G11/56 ,  H01L45/00 ,  Y02E60/13 ,  Y10S438/957

    Abstract: Two-terminal switching devices of MIM type having at least one electrode formed by a liquid phase processing method are provided for use in active matrix backplane applications; more specifically, MIM devices with symmetric current-voltage characteristics are applied for LCD active matrix backplane applications, and MIM devices with asymmetric current-voltage characteristics are applied for active matrix backplane implementation for electrophoretic displays (EPD) and rotating element displays. In particular, the combination of the bottom metal, metal-oxide insulator and solution-processible top conducting layer enables high throughput, roll-to-roll process for flexible displays.

    Abstract translation: 提供具有通过液相处理方法形成的至少一个电极的MIM型的两端开关装置用于有源矩阵背板应用; 更具体地说，将具有对称电流 - 电压特性的MIM器件应用于LCD有源矩阵背板应用，并且将具有不对称电流 - 电压特性的MIM器件应用于电泳显示器（EPD）和旋转元件显示器的有源矩阵背板实施。 特别地，底部金属，金属氧化物绝缘体和可溶液加工的顶部导电层的组合可实现灵活显示器的高生产率，卷对卷过程。

    Electronic devices having a layer overlying an edge of a different layer and a process for forming the same
    123.
    发明授权
    Electronic devices having a layer overlying an edge of a different layer and a process for forming the same 有权
    具有覆盖不同层的边缘的层的电子器件及其形成工艺

    公开(公告)号：US07250632B2

    公开(公告)日：2007-07-31

    申请号：US11088164

    申请日：2005-03-23

    Applicant: Matthew Dewey Hubert ,  Matthew Stevenson ,  Patrick Hahn ,  Frank P. Uckert ,  Gang Yu

    Inventor： Matthew Dewey Hubert ,  Matthew Stevenson ,  Patrick Hahn ,  Frank P. Uckert ,  Gang Yu

    IPC: H01L33/00

    CPC classification number: H01L27/3246 ,  H01L27/3283 ,  H01L51/5203 ,  H01L51/5262

    Abstract: An electronic device includes a radiation-emitting component, a radiation-responsive component, or a combination thereof. In one embodiment, the electronic device includes a substrate and a first structure overlying the substrate. The electronic device also includes a second structure that includes a first layer, wherein the first layer has a first refractive index, and the first layer includes a first edge. The electronic device further includes a second layer overlying at least portions of the first structure and the second structure at the first edge. The second layer has a second refractive index that is lower than the first refractive index. In another embodiment, the first structure includes a layer having a perimeter and a pattern lying within the perimeter. The pattern extends at least partly though the first layer to define an opening with a first edge. In another embodiment, a process is used to form the electronic device.

    Abstract translation: 电子设备包括辐射发射部件，辐射响应部件或其组合。 在一个实施例中，电子设备包括衬底和覆盖衬底的第一结构。 电子设备还包括第二结构，其包括第一层，其中第一层具有第一折射率，并且第一层包括第一边缘。 电子设备还包括在第一边缘处覆盖第一结构和第二结构的至少部分的第二层。 第二层具有低于第一折射率的第二折射率。 在另一个实施例中，第一结构包括具有位于周边内的周长和图案的层。 图案至少部分地延伸穿过第一层以限定具有第一边缘的开口。 在另一个实施例中，使用一个过程来形成电子设备。

    Electronic devices and processes for forming electronic devices
    125.
    发明申请
    Electronic devices and processes for forming electronic devices 审中-公开
    用于形成电子设备的电子设备和工艺

    公开(公告)号：US20070075626A1

    公开(公告)日：2007-04-05

    申请号：US11446945

    申请日：2006-06-05

    Applicant: Gang Yu ,  Charles Lang ,  Stephen Sorich ,  Alberto Goenaga ,  Matthew Stainer ,  Paul Sant ,  Dennis Walker ,  Charles MacPherson ,  Gordana Srdanov

    Inventor： Gang Yu ,  Charles Lang ,  Stephen Sorich ,  Alberto Goenaga ,  Matthew Stainer ,  Paul Sant ,  Dennis Walker ,  Charles MacPherson ,  Gordana Srdanov

    IPC: H05B33/00

    CPC classification number: H01L27/3244 ,  H01L51/0005 ,  H01L51/5012 ,  H01L51/56 ,  H01L2251/558

    Abstract: An electronic device includes a substrate, a first layer, a first pixel, and a patterned reactive surface-active layer. The first pixel includes a first pixel driving circuit that overlies the substrate and includes a first electronic component. The first electronic component includes a first electrode and a second layer. The first electrode overlies at least a part of the first pixel driving circuit. The patterned reactive surface-active layer has a lower surface energy than the first layer. A process for forming an electronic device includes forming a first pixel driving circuit over a substrate, forming a first electrode of a first electronic component over the substrate, forming a first layer, forming a patterned reactive surface-active layer, and forming a second layer over the first electrode of the first electronic component.

    Abstract translation: 电子器件包括衬底，第一层，第一像素和图案化的反应性表面活性层。 第一像素包括覆盖在衬底上并包括第一电子部件的第一像素驱动电路。 第一电子部件包括第一电极和第二层。 第一电极覆盖第一像素驱动电路的至少一部分。 图案化的反应性表面活性层具有比第一层更低的表面能。 一种用于形成电子器件的方法包括在衬底上形成第一像素驱动电路，在衬底上形成第一电子部件的第一电极，形成第一层，形成图案化的反应性表面活性层，以及形成第二层 在第一电子部件的第一电极之上。

    Process for forming an electronic device including workpieces and a conductive member therebetween
    127.
    发明申请
    Process for forming an electronic device including workpieces and a conductive member therebetween 审中-公开
    用于形成包括工件和其间的导电构件的电子设备的工艺

    公开(公告)号：US20060276024A1

    公开(公告)日：2006-12-07

    申请号：US11270158

    申请日：2005-11-09

    Applicant: Jian Wang ,  Gang Yu

    Inventor： Jian Wang ,  Gang Yu

    IPC: H01L21/44

    CPC classification number: H01L27/3253 ,  H01L27/30 ,  H01L27/3211 ,  H01L27/3246 ,  H01L27/3276 ,  H01L51/0021 ,  H01L51/0024 ,  H01L51/5212 ,  H01L51/5284 ,  H01L51/56 ,  H01L2251/568 ,  Y02E10/549

    Abstract: A process for forming an electronic device can include providing a first workpiece including an electronic component that includes an electrode and an organic layer, and providing a second workpiece that includes a conductor. The process can also include reflowing a conductive member between the electrode and conductor. In one embodiment, after reflowing, the conductive member can have a width at a point about halfway between the first electrode and the conductor that is wider than a width of the conductive member at a point closer to the electrode or the conductor. In another embodiment, after reflowing, the conductive member can include a void. In still another embodiment, after reflowing, a conductive member can separate into a set of conductive members that lie between the electrode and the conductor.

    Abstract translation: 用于形成电子器件的方法可以包括提供包括电极和有机层的电子部件的第一工件，以及提供包括导体的第二工件。 该方法还可以包括在电极和导体之间回流导电构件。 在一个实施例中，在回流之后，导电构件可以在第一电极和导体之间的大约一半的点处具有比在更接近电极或导体的点处的导电构件的宽度宽的点。 在另一个实施例中，在回流之后，导电构件可以包括空隙。 在另一个实施例中，在回流之后，导电构件可以分离成位于电极和导体之间的一组导电构件。

    Workpiece including electronic components and conductive members
    128.
    发明申请
    Workpiece including electronic components and conductive members 审中-公开
    工件包括电子部件和导电部件

    公开(公告)号：US20060273309A1

    公开(公告)日：2006-12-07

    申请号：US11270208

    申请日：2005-11-09

    Applicant: Jian Wang ,  Gang Yu

    Inventor： Jian Wang ,  Gang Yu

    IPC: H01L29/08

    CPC classification number: H01L27/3253 ,  H01L27/30 ,  H01L27/3211 ,  H01L27/3246 ,  H01L27/3276 ,  H01L51/0021 ,  H01L51/0024 ,  H01L51/5212 ,  H01L51/5284 ,  H01L51/56 ,  H01L2251/568 ,  Y02E10/549

    Abstract: A workpiece can include conductive members that include a material that melts at a temperature no higher than 240° C. In one embodiment, conductive members that are attached to electronic components that each include an electrode and an organic layer that emits radiation, responds to radiation, or a combination thereof, and more particularly, the conductive members are attached to the electrodes of the electronic component. In another embodiment, the conductive members are attached to conductors that are part of or electrically connected to control circuits designed to control electronic components that each include an organic layer that emits radiation, responds to radiation, or a combination thereof.

    Abstract translation: 工件可以包括导电构件，其包括在不高于240℃的温度下熔化的材料。在一个实施例中，附接到每个包括电极和发射辐射的有机层的电子部件的导电构件响应辐射 ，或其组合，更具体地，导电构件附接到电子部件的电极。 在另一个实施例中，导电构件附接到导体，该导体是设计成控制电子部件的控制电路的一部分或电连接，每个电子部件包括发射辐射的有机层，响应辐射或其组合。

    Process for making an organic electronic device having a roughened surface heat sink
    130.
    发明授权
    Process for making an organic electronic device having a roughened surface heat sink 有权
    制造具有粗糙表面散热器的有机电子器件的方法

    公开(公告)号：US07135357B2

    公开(公告)日：2006-11-14

    申请号：US10683828

    申请日：2003-10-10

    Applicant: Gang Yu ,  Jian Wang

    Inventor： Gang Yu ,  Jian Wang

    IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC classification number: H01L51/529 ,  H01L23/3675 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.

    Abstract translation: 本发明的一个方面提供了一种有机电子器件，其包括具有粗糙表面和/或黑色表面的侧面的散热器和用于形成具有这种散热器的器件的工艺，包括形成图案化的导电层，包括导电构件 。 该方法包括选择性地形成间隔开的构件。 散热器包括彼此间隔开并热耦合到导电构件的间隔开的构件。

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