公开(公告)号：US20160001558A1

公开(公告)日：2016-01-07

申请号：US14770762

申请日：2013-12-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16

CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

Abstract: In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

Abstract translation: 在一个示例中，模制打印头包括嵌入模制件中的打印头模头和电连接到打印头模具的外部电触头，并暴露在模制件外部以连接到打印头外部的电路。 模制件具有通道，流体可以通过该通道传递到模具的后部。 模具的前部暴露在模制件的外部，并且模具的后部由模具覆盖，除了在通道之外，模制件的厚度从模具周围的较小厚度变化到离模具更大的厚度。

公开(公告)号：US12233598B2

公开(公告)日：2025-02-25

申请号：US18098094

申请日：2023-01-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B29C64/209 ,  B29D99/00 ,  B33Y30/00 ,  B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

公开(公告)号：US11969995B2

公开(公告)日：2024-04-30

申请号：US18222354

申请日：2023-07-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Scott A. Linn ,  James Michael Gardner ,  Michael W. Cumbie

IPC: B41J2/045

CPC classification number: B41J2/04536 ,  B41J2/04586 ,  B41J2/04541

Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

公开(公告)号：US11938722B2

公开(公告)日：2024-03-26

申请号：US17471844

申请日：2021-09-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Scott A. Linn ,  James Michael Gardner ,  Michael W. Cumbie

IPC: B41J2/045

CPC classification number: B41J2/04536 ,  B41J2/04586 ,  B41J2/04541

Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

公开(公告)号：US11745507B2

公开(公告)日：2023-09-05

申请号：US17311593

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Anthony M. Fuller ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1637

Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

公开(公告)号：US11738562B2

公开(公告)日：2023-08-29

申请号：US17864662

申请日：2022-07-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Stephen D. Panshin ,  Jefferson P. Ward ,  David Owen Roethig ,  David N. Olsen ,  Anthony D. Studer ,  Michael W. Cumbie ,  Sirena Chi Lu

IPC: B41J2/175 ,  B41J29/393 ,  G01L23/08 ,  G06F13/42 ,  G06F21/44 ,  G06K15/00 ,  B33Y50/00 ,  G03G15/08 ,  G06K15/10 ,  G06F9/30 ,  G06F21/62 ,  H04L9/08 ,  H04L9/32

CPC classification number: B41J2/17546 ,  B33Y50/00 ,  B41J2/1752 ,  B41J2/1753 ,  B41J2/17513 ,  B41J2/17523 ,  B41J2/17526 ,  B41J2/17553 ,  B41J2/17556 ,  B41J2/17559 ,  B41J2/17566 ,  B41J29/393 ,  G01L23/08 ,  G03G15/0856 ,  G03G15/0863 ,  G06F9/30105 ,  G06F13/42 ,  G06F13/4282 ,  G06F21/44 ,  G06F21/62 ,  G06K15/102 ,  G06K15/4075 ,  H04L9/0819 ,  H04L9/3242 ,  B41J2002/17516 ,  B41J2002/17579 ,  B41J2002/17586 ,  B41J2202/13 ,  B41J2202/20 ,  G05B2219/49023 ,  G06F2213/0016 ,  G06F2213/40

Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.

公开(公告)号：US11721636B2

公开(公告)日：2023-08-08

申请号：US16603821

申请日：2018-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Anthony M. Fuller ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: H01L23/544 ,  B41J2/175 ,  H01L21/68

CPC classification number: H01L23/544 ,  B41J2/17546 ,  H01L21/68 ,  H01L2223/54426

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

公开(公告)号：US11691431B2

公开(公告)日：2023-07-04

申请号：US17699050

申请日：2022-03-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Si-lam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/18 ,  B41J2/14

CPC classification number: B41J2/18 ,  B41J2/14145 ,  B41J2202/12

Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

公开(公告)号：US20230173495A1

公开(公告)日：2023-06-08

申请号：US18102412

申请日：2023-01-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Viktor Shkolnikov ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00

CPC classification number: B01L3/523 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/16 ,  B01L2300/041 ,  B01L2300/12 ,  B01L2300/16 ,  B01L2300/168 ,  B01L2300/1805

Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

公开(公告)号：US11654680B2

公开(公告)日：2023-05-23

申请号：US17340570

申请日：2021-06-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-Iam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen ,  Jeffrey R. Pollard

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/175 ,  B41J2/21

CPC classification number: B41J2/14145 ,  B41J2/14032 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/17503 ,  B41J2/21 ,  B41J2202/12

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.