Abstract:
A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer.
Abstract:
A method for fabricating metal gate transistor is disclosed. First, a substrate having a first transistor region and a second transistor region is provided. Next, a stacked film is formed on the substrate, in which the stacked film includes at least one high-k dielectric layer and a first metal layer. The stacked film is patterned to form a plurality of gates in the first transistor region and the second transistor region, a dielectric layer is formed on the gates, and a portion of the dielectric layer is planarized until reaching the top of each gates. The first metal layer is removed from the gate of the second transistor region, and a second metal layer is formed over the surface of the dielectric layer and each gate for forming a plurality of metal gates in the first transistor region and the second transistor region.
Abstract:
A method of manufacturing a metal gate is provided. The method includes providing a substrate. Then, a gate dielectric layer is formed on the substrate. A multi-layered stack structure having a work function metal layer is formed on the gate dielectric layer. An O2 ambience treatment is performed on at least one layer of the multi-layered stack structure. A conductive layer is formed on the multi-layered stack structure.
Abstract:
The present invention provides a method of manufacturing semiconductor device having metal gates. First, a substrate is provided. A first conductive type transistor having a first sacrifice gate and a second conductive type transistor having a second sacrifice gate are disposed on the substrate. The first sacrifice gate is removed to form a first trench. Then, a first metal layer is formed in the first trench. The second sacrifice gate is removed to form a second trench. Next, a second metal layer is formed in the first trench and the second trench. Lastly, a third metal layer is formed on the second metal layer wherein the third metal layer is filled into the first trench and the second trench.
Abstract:
A method for fabricating a semiconductor structure is disclosed. A substrate with a first transistor having a first dummy gate and a second transistor having a second dummy gate is provided. The conductive types of the first transistor and the second transistor are different. The first and second dummy gates are simultaneously removed to form respective first and second openings. A high-k dielectric layer, a second type conductive layer and a first low resistance conductive layer are formed on the substrate and fill in the first and second openings, with the first low resistance conductive layer filling up the second opening. The first low resistance conductive layer and the second type conductive layer in the first opening are removed. A first type conductive layer and a second low resistance conductive layer are then formed in the first opening, with the second low resistance conductive layer filling up the first opening.
Abstract:
In a particular embodiment, a system to dissipate heat in an information handling system includes a first heat-generating component adapted to process first data and a second heat-generating component adapted to process second data. The system also includes a cooling fluid guide including an electroactive material. The cooling fluid guide is adapted to change from a first shape to a second shape, in response to receiving a trigger voltage or in response to no longer receiving the trigger voltage. The system also includes a controller adapted to detect a data load processed at the second heat-generating component and, in response to detecting the data load, to cause the trigger voltage to be received at, or no longer received at, the cooling fluid guide. The cooling fluid guide is adapted to direct an increased portion of cooling fluid toward the first heat-generating component when the cooling fluid guide is in a form of the second shape, as compared to the first shape.
Abstract:
A photographic reflector includes an engagement unit, a support frame, a fabric canopy, and a lamp holder. The engagement unit includes an engagement seat and an engagement member moveably mounted in the engagement seat. The support frame includes a plurality of ribs and a plurality of stretchers corresponding to each respective rib. One end of each rib is pivotally connected to the engagement seat. One end of each stretcher is pivotally connected to a preset location of the corresponding rib, and the other end of each stretcher is pivotally connected to the engagement member. The fabric canopy is mounted on the ribs of the support frame and has a reflective layer at an inside thereof and a mounting hole defined at a location close to the engagement unit. The lamp holder is mounted in the mounting hole of the fabric canopy. The photographic reflector can be folded as compactly as desired, easily stored, and convenient in transportation and use.
Abstract:
A support head assembly includes a main body, a tooth disk unit, a tooth disk cap, a button, a button cap, and a spring. The tooth disk cap and the button cap are assembled on the main body. Two ends of the spring are respectively secured on a securing post of the tooth disk unit and a securing post of the tooth disk cap, and abutted against therebetween, such that a tooth disk of the tooth disk unit is engaged with a first tooth slot of the main body and a second tooth slot of the tooth disk cap. The tooth disk of the tooth disk unit can be disengaged from the first tooth slot of the main body and fully received in the second tooth slot of the tooth disk cap by pressing the button and further the tooth disk unit to compress the spring, so as to allow the support head assembly to be made angle adjustment according to the desires.
Abstract:
Provided is a tripod structure of a stand, which is combined on a central post of the stand and allows the leg units of the stand to be folded, and includes: an upper tripod unit having a central post orifice and at least three leg unit connection parts evenly arranged at the outer periphery of the central post and formed with at least an accessory part, wherein the upper tripod unit is fastened at a preset location of the central post of the stand via the central post orifice, and each leg unit of the stand is respectively hinged with each leg unit connection part; and a lower tripod unit having a post plug and at least three moveable support rod connection parts evenly arranged at the outer periphery of the post plug, and each moveable support rod connection part is correspondingly formed with a leg unit buckling part and formed with at least an accessory part, wherein the post plug is installed at the distal end of the central post of the stand, and hinged to the leg unit and the moveable support rod connection part through a support rod, such that the leg units can be folded and respectively buckled with each corresponding leg unit buckling part.