公开(公告)号：US06238952B1

公开(公告)日：2001-05-29

申请号：US09516024

申请日：2000-02-29

Applicant: Chun Hung Lin

Inventor： Chun Hung Lin

IPC: H01L2144

CPC classification number: H01L21/568 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K3/06 ,  H05K3/202 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the connection pads have a concave profile. A package body is formed over the semiconductor chip, the die pad and the connection pads in a manner that a potion of the die pad and a portion of each connection pad extend outward from the bottom of the package body. The present invention further provides a novel method of producing the low-pin-count chip package described above.

公开(公告)号：US09053621B2

公开(公告)日：2015-06-09

申请号：US13958629

申请日：2013-08-05

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: G06K9/00 ,  G08B13/196

CPC classification number: G08B13/19602

Abstract: An image surveillance system and an image surveillance method are provided. The image surveillance method includes following steps. An image is captured, and at least one reference target is defined in the captured image. A monitored object in the image is identified. A distance between the monitored object and each of the at least one reference target is individually calculated. Whether to announce at least one warning is determined according to a relationship between at least one threshold and the distance.

Abstract translation: 提供图像监视系统和图像监视方法。 图像监视方法包括以下步骤。 拍摄图像，并且在捕获的图像中定义至少一个参考目标。 识别图像中的被监视对象。 分别计算被监视对象与至少一个参考目标中的每一个之间的距离。 根据至少一个阈值和距离之间的关系来确定是否宣布至少一个警告。

公开(公告)号：US20150010213A1

公开(公告)日：2015-01-08

申请号：US13958629

申请日：2013-08-05

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: G08B13/196

CPC classification number: G08B13/19602

Abstract: An image surveillance system and an image surveillance method are provided. The image surveillance method includes following steps. An image is captured, and at least one reference target is defined in the captured image. A monitored object in the image is identified. A distance between the monitored object and each of the at least one reference target is individually calculated. Whether to announce at least one warning is determined according to a relationship between at least one threshold and the distance.

Abstract translation: 提供图像监视系统和图像监视方法。 图像监视方法包括以下步骤。 拍摄图像，并且在捕获的图像中定义至少一个参考目标。 识别图像中的被监视对象。 分别计算被监视对象与至少一个参考目标中的每一个之间的距离。 根据至少一个阈值和距离之间的关系来确定是否宣布至少一个警告。

公开(公告)号：US20140078647A1

公开(公告)日：2014-03-20

申请号：US13620591

申请日：2012-09-14

Applicant: Chi-Hao CHIU ,  Kun-Huang CHANG ,  Chun-Hung LIN

Inventor： Chi-Hao CHIU ,  Kun-Huang CHANG ,  Chun-Hung LIN

IPC: H01G4/228 ,  B32B37/14

CPC classification number: H01G9/0032 ,  B32B2457/16 ,  H01G9/012 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  Y10T156/1002

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract translation: 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 导电单元包括堆叠在彼此顶部并彼此电连接的多个层叠型电容器，并且每个堆叠型电容器具有正部分和负极部分。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括第一导电端子和第二导电端子。 第一导电端子具有电连接到正部分并由封装主体封闭的第一嵌入部分和连接到第一嵌入部分的第一横向暴露部分。 第二导电端子具有第二横向暴露部分，第二前部暴露部分，第二后部暴露部分和与该负极部分电连接并被封装主体封闭的第二嵌入部分。

公开(公告)号：US20130175008A1

公开(公告)日：2013-07-11

申请号：US13347640

申请日：2012-01-10

Applicant: Chien-Chih Yeh ,  Wen-Shiang Chen ,  Chian Tao ,  Chun-Hung Lin

Inventor： Chien-Chih Yeh ,  Wen-Shiang Chen ,  Chian Tao ,  Chun-Hung Lin

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28F13/187 ,  F28F2245/02 ,  F28F2245/04

Abstract: A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process.

Abstract translation: 薄的热管包括薄的中空管和毛细结构。 毛细结构通过化学蚀刻工艺形成在薄中空管的内壁的至少一半中。

公开(公告)号：US08466291B2

公开(公告)日：2013-06-18

申请号：US12609392

申请日：2009-10-30

Applicant: Chun-Hung Lin ,  Ching-Wen Ho

Inventor： Chun-Hung Lin ,  Ching-Wen Ho

IPC: C07D211/00 ,  A61K31/445

CPC classification number: C07D211/40 ,  C07D211/58 ,  C07D401/10 ,  C07D405/10

Abstract: 1,5-Dideoxy-1,5-imino-D-glucitol compounds as shown in the specification. Also disclosed is a method of treating a hexosaminidase-associated disease.

Abstract translation: 1,5-二脱氧-1,5-亚氨基-D-葡萄糖醇化合物，如说明书所示。 还公开了一种治疗氨基糖苷酶相关疾病的方法。

公开(公告)号：US08429569B2

公开(公告)日：2013-04-23

申请号：US13086935

申请日：2011-04-14

Applicant: Chih-Jen Yu ,  Chun-Hung Lin ,  Juin-Hung Lin ,  Hsueh-Yi Chung ,  Li-Kong Turn ,  Keh-Wen Chang

Inventor： Chih-Jen Yu ,  Chun-Hung Lin ,  Juin-Hung Lin ,  Hsueh-Yi Chung ,  Li-Kong Turn ,  Keh-Wen Chang

IPC: G06F17/50

CPC classification number: G06F17/50 ,  G03F7/705 ,  G03F7/70558 ,  G03F7/70625

Abstract: A method including providing a present wafer to be processed by a photolithography tool, selecting a processed wafer having a past chip design from a plurality of processed wafers, the processed wafer being previously processed by the photolithography tool, selecting a plurality of critical dimension (CD) data points extracted from a plurality of fields on the processed wafer, modeling the plurality of CD data points with a function relating CD to position on the processed wafer, creating a field layout on the present wafer for a new chip design, creating an initial exposure dose map for the new chip design using the function and the field layout, and controlling the exposure of the photolithography tool according to the initial exposure dose map to form the new chip design on the present wafer.

Abstract translation: 一种方法，包括提供由光刻工具处理的当前晶片，从多个处理的晶片中选择具有过去晶片设计的经处理的晶片，处理的晶片由光刻工具预先处理，选择多个关键尺寸（CD ）数据点，其处理晶片上的多个场中提取的数据点，以与CD相关的功能对处理的晶片上的位置对多个CD数据点进行建模，在当前晶片上创建用于新芯片设计的场布局， 使用功能和现场布局的新芯片设计的曝光剂量图，并根据初始曝光剂量图控制光刻工具的曝光，以在当前晶片上形成新的芯片设计。

公开(公告)号：US20130048247A1

公开(公告)日：2013-02-28

申请号：US13218420

申请日：2011-08-25

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04 ,  B21D53/02

CPC classification number: B21C37/154 ,  B21C37/16 ,  F28D15/0233 ,  F28D15/046 ,  Y10T29/49353

Abstract: A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section and the condensing sections. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.

Abstract translation: 热管包括台阶管，网和支撑构件。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 网状物包含在台阶管中，位于蒸发段和冷凝段内。 支撑部件包含在台阶管中并包裹在网中。 这些结构的组合增加了热管内空气的流量，提高了热管的热传导效率。

公开(公告)号：US20120318480A1

公开(公告)日：2012-12-20

申请号：US13160555

申请日：2011-06-15

Applicant: Chun-Hung LIN ,  Tung-Yang SHIEH ,  Yen-Hsiang CHIU ,  Chun-Yi LEE

Inventor： Chun-Hung LIN ,  Tung-Yang SHIEH ,  Yen-Hsiang CHIU ,  Chun-Yi LEE

IPC: F28D15/04 ,  B21D53/02

CPC classification number: F28D15/0233 ,  F28D15/0275 ,  F28D2021/0028 ,  F28F1/32 ,  F28F2275/04 ,  F28F2275/122 ,  Y10T29/4935

Abstract: The present invention relates to a heat sink having juxtaposed heat pipes and a method for manufacturing the same. The heat sink includes a base, a plurality of heat pipes and a pair of side strips. The base has a surface on which an open trough and an insertion trough on both sides of the open trough are provided. Each heat pipe has an evaporating section. The evaporating sections are juxtaposed in the open trough and adhered to each other. Each evaporating section has a planar surface. The side strips are fixed into the insertion troughs and protrude from the surface of the base. The planar surface of each evaporating section and the outer surface of each side strip are coplanar. By this structure, the thermal contact surface between the heat pipes and electronic heat-generating sources is increased, so that the heat-dissipating efficiency of the heat sink is improved.

Abstract translation: 本发明涉及具有并置热管的散热器及其制造方法。 散热器包括基座，多个热管和一对侧条。 底座具有一个表面，在该表面上设置开口槽和开口槽两侧的插槽。 每个热管都有一个蒸发部分。 蒸发部分在开槽中并列并相互粘合。 每个蒸发部分具有平坦的表面。 侧条固定在插入槽中并从基座的表面突出。 每个蒸发段的平面和每个侧条的外表面是共面的。 通过这种结构，热管和电子发热源之间的热接触表面增加，从而提高了散热器的散热效率。

公开(公告)号：US08253014B2

公开(公告)日：2012-08-28

申请号：US12985847

申请日：2011-01-06

Applicant: Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

Inventor： Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

IPC: H01L31/00

CPC classification number: H01L31/022433 ,  H01L31/02168 ,  Y02E10/50 ,  Y02E10/52

Abstract: A solar cell includes a substrate, a lower conductor layer, an anti-reflection coating (ARC) layer and an upper conductor layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The lower conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer is disposed on the front side of the substrate and covers the lower conductor layer such that the second portion of the lower conductor layer is disposed in the ARC layer. The upper conductor layer has a first portion embedded into the ARC layer and a second portion other than the first portion of the upper conductor layer. The second portion of the upper conductor layer is exposed out of the ARC layer, and the upper conductor layer is electrically connected to the lower conductor layer.

Abstract translation: 太阳能电池包括基板，下导体层，抗反射涂层（ARC）层和上导体层。 衬底具有与前侧相邻的前侧，后侧和掺杂区。 下导体层具有嵌入掺杂区域中的第一部分和除第一部分之外的第二部分。 ARC层设置在基板的前侧，并覆盖下导体层，使得下导体层的第二部分设置在ARC层中。 上导体层具有嵌入到ARC层中的第一部分和除了上导体层的第一部分之外的第二部分。 上导体层的第二部分露出ARC层，并且上导体层电连接到下导体层。