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131.发明授权
公开(公告)号：US5916805A
公开(公告)日：1999-06-29
申请号：US836982
申请日：1997-06-27
IPC分类号： A61K38/00 , C07K16/36 , C12N5/20 , C12P21/08 , A61K39/395
摘要： A monoclonal antibody, which has reactivity with human von Willebrand factor, which has action to inhibit RIPA (ristocetin-induced platelet aggregation), BIPA (botrocetin-induced platelet aggregation), and SIPA (shear stress-induced platelet aggregation) of human platelet, and which does not express bleeding action in an medicinally effective dose to exhibit antithrombotic action, is used as an active ingredient of an antithrombotic agent.
摘要翻译： PCT No.PCT / JP95 / 02435 Sec。 371日期：1997年6月27日 102（e）日期1997年6月27日PCT提交1995年11月29日PCT公布。 出版物WO96 / 17078 日期1996年6月6日具有与人血管性血友病因子的反应性的单克隆抗体，其具有抑制RIPA（瑞斯他汀诱导的血小板聚集），BIPA（博来敏素诱导的血小板聚集）和SIPA（剪切应力诱导的血小板聚集）的作用 ）的人血小板，并且在药物有效剂量中不表现出血作用以显示抗血栓形成作用，用作抗血栓形成剂的活性成分。
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132.发明授权Electrophotographic photoreceptor, image forming apparatus and image forming process 失效电子照相感光体，成像装置和成像方法
公开(公告)号：US5795690A
公开(公告)日：1998-08-18
申请号：US784545
申请日：1997-01-21
CPC分类号： G03G5/0659 , G03G5/0657 , G03G5/0679 , G03G5/0681 , G03G5/142
摘要： An electrophotographic photoreceptor is disclosed which comprises an electrically-conductive substrate having provided thereon an undercoat layer and a photosensitive layer, wherein said undercoat layer comprises a crosslinkable matrix and an electron-transporting material.
摘要翻译： 公开了一种电子照相感光体，其包括其上设置有底涂层和感光层的导电基底，其中所述底涂层包含可交联基质和电子传输材料。
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公开(公告)号：US5794332A
公开(公告)日：1998-08-18
申请号：US597151
申请日：1996-02-06
申请人： Hiroshi Yamamoto , Akira Kato
发明人： Hiroshi Yamamoto , Akira Kato
IPC分类号： H01R43/00 , H01R4/24 , H01R43/052 , H01R43/24 , H01R43/04
CPC分类号： H01R43/24 , H01R4/2433 , Y10S439/937 , Y10T29/49153 , Y10T29/49174 , Y10T29/49185 , Y10T29/53217 , Y10T29/53235
摘要： A method of producing a press-connecting joint connector and a method of press-connecting wires, in which the step of mounting press-connecting terminals in a housing is eliminated thereby reducing the production time, the housing-forming mold is simplified, and connective portions are prevented from being easily ruptured. Linked press-connecting terminal groups (32) are inserted-molded integrally in housings (34), respectively, thereby forming press-connecting joint connectors (30) which are linked together by a linkage plate (40) which is integral with the press-connecting terminal groups (32). Thus, when molding the housings (34), the press-connecting terminal groups (32) are formed integrally with the housings (34), respectively, so that the step of inserting the press-connecting terminal groups into the respective housings (34) is eliminated. The housings (34) can be molded independently of each other so that the housing (34) can be simplified, and linkage portions of the press-connecting joint connectors (30) have an increased strength.
摘要翻译： 一种压接连接连接器的制造方法以及压接线的方法，其中消除了将连接端子安装在壳体中的步骤，从而缩短了生产时间，简化了壳体成型模具和连接 防止部分容易破裂。 连接的压接端子组（32）分别一体地嵌入模制在壳体（34）中，从而形成压连接接头连接器（30），该连接接头连接器通过与压制连接端子组成一体的连接板（40）连接在一起， 连接端子组（32）。 因此，当模制壳体（34）时，压接端子组（32）分别与壳体（34）一体地形成，从而将压接端子组插入相应的壳体（34）中的步骤， 被淘汰。 壳体（34）可以彼此独立地模制，使得壳体（34）可以被简化，并且压力连接接头连接器（30）的连接部分具有增加的强度。
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公开(公告)号：US5772480A
公开(公告)日：1998-06-30
申请号：US898246
申请日：1997-07-22
申请人： Hiroshi Yamamoto , Akira Kato
发明人： Hiroshi Yamamoto , Akira Kato
IPC分类号： H01R43/00 , H01R4/24 , H01R43/052 , H01R43/24 , H01R13/02
CPC分类号： H01R43/24 , H01R4/2433 , Y10S439/937 , Y10T29/49153 , Y10T29/49174 , Y10T29/49185 , Y10T29/53217 , Y10T29/53235
摘要： A press-connecting joint connector in which the step of mounting press-connecting terminals in a housing is eliminated thereby reducing the production time, the housing-forming mold is simplified, and connective portions are prevented from being easily ruptured. Linked press-connecting terminal groups (32) are inserted-molded integrally in housings (34), respectively, thereby forming press-connecting joint connectors (30) which are linked together by a linkage plate (40) which is integral with the press-connecting terminal groups (32). Thus, when molding the housings (34), the press-connecting terminal groups (32) are formed integrally with the housings (34), respectively, so that the step of inserting the press-connecting terminal groups into the respective housings (34) is eliminated. The housings (34) can be molded independently of each other so that the housing (34) can be simplified, and linkage portions of the press-connecting joint connectors (30) have an increased strength.
摘要翻译： 一种按压连接接头连接器，其中消除了将接合端子安装在壳体中的步骤，从而减少了生产时间，简化了成型模具，并且防止了连接部分容易破裂。 连接的压接端子组（32）分别一体地嵌入模制在壳体（34）中，从而形成压连接接头连接器（30），该连接接头连接器通过与压制连接端子组成一体的连接板（40）连接在一起， 连接端子组（32）。 因此，当模制壳体（34）时，压接端子组（32）分别与壳体（34）一体地形成，从而将压接端子组插入相应的壳体（34）中的步骤， 被淘汰。 壳体（34）可以彼此独立地模制，使得壳体（34）可以被简化，并且压力连接接头连接器（30）的连接部分具有增加的强度。
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公开(公告)号：US5705776A
公开(公告)日：1998-01-06
申请号：US235708
申请日：1994-04-29
CPC分类号： G01G13/22
摘要： An apparatus for weighing a softened solid rapidly and precisely, wherein no excessive force is exerted on, and no shock is given to, the load cell. The apparatus has a simplified structure including 1/4 cylindrical weighing containers so that the apparatus is easy to disassemble and clean. The inventive apparatus comprises a load cell for transmitting signals; a pair of weighing containers each having a cross-section of approximately 1/4 of a cylinder, arranged closely, and installed on the load cell rotatably around center axis of rotation; a scraping member installed closely to the inner surface of the weighing containers; and a driving unit, which is not connected to said load cell, for opening and closing the weighing containers by reversely rotating them around their axes. This apparatus for weighing a softened solid discharges the weighed substance as it is scraped from the sides of the containers by the scraping member.
摘要翻译： 一种用于快速且精确地称重软化固体的装置，其中不会对称重传感器施加过大的力并且不施加冲击。 该设备具有简化的结构，包括+ E，fra 1/4 + EE圆柱形称重容器，使设备易于拆卸和清洁。 本发明的装置包括用于发送信号的测力传感器; 一对称重容器，每个称重容器各自具有大致+ E的横截面，1/4 + EE的圆柱体，紧密地布置并且以可旋转的方式围绕中心旋转轴线安装在测力传感器上; 一个靠近称重容器内表面的刮擦件; 以及驱动单元，其未连接到所述称重传感器，用于通过使称重容器绕其轴线反向旋转来打开和关闭称重容器。 用于称量软化固体的装置通过刮擦构件将被称重的物质从容器侧面刮下来排出。
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136.发明授权Method of press-connecting electrical wires to a connector and cutting waste end portions of the wires within the connector housing 失效将电线按压连接到连接器并切割连接器壳体内的电线的废弃端部的方法
公开(公告)号：US5675890A
公开(公告)日：1997-10-14
申请号：US685978
申请日：1996-07-22
申请人： Hiroshi Yamamoto , Akira Kato
发明人： Hiroshi Yamamoto , Akira Kato
CPC分类号： H01R4/2454 , H01R43/01 , Y10T29/49181
摘要： A press-connecting joint connector with which electrical wires can be readily connected to each other, and a method of press-connecting the electrical wires to the 5 connector. The joint connector (31) includes a connector body (33) with a wire inserting section (47) in which the wires are to be inserted and a press-connecting blade (43) provided in the wire inserting section (47). The wires (W1) and (W2) are inserted in the wire inserting section (47) and the insulation of the wires is cut by the blade such that the blade electrically interconnects the wires. Thereafter, a cutter is inserted into the connector body to thereby cut the waste end portion (105) of at least one of the wires inside the connector body (33). The cutting step may be performed simultaneously to when the wires are pressed into the blades.
摘要翻译： 电线可以容易地彼此连接的按压连接接头连接器，以及将电线按压连接到5连接器的方法。 接头连接器（31）包括连接器本体（33），其中插入有导线的导线插入部分（47）和设置在导线插入部分（47）中的压力连接叶片（43）。 电线（W1）和（W2）插入电线插入部分（47）中，并且电线的绝缘被刀片切割，使得刀片将电线互连。 此后，将切割器插入连接器主体中，从而切割连接器主体（33）内的至少一根电线的废弃端部（105）。 当将电线压入刀片时，可以同时执行切割步骤。
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137.发明授权Method of manufacturing semiconductor device having multilevel interconnection structure 失效制造具有多层互连结构的半导体器件的方法
公开(公告)号：US5637534A
公开(公告)日：1997-06-10
申请号：US172717
申请日：1993-12-27
申请人： Nobuyuki Takeyasu , Hiroshi Yamamoto , Yumiko Kawano , Eiichi Kondoh , Tomoharu Katagiri , Tomohiro Ohta
发明人： Nobuyuki Takeyasu , Hiroshi Yamamoto , Yumiko Kawano , Eiichi Kondoh , Tomoharu Katagiri , Tomohiro Ohta
IPC分类号： H01L21/768 , H01L23/522 , H01L23/532 , H01L21/44
CPC分类号： H01L23/53223 , H01L21/76802 , H01L21/76879 , H01L23/5226 , H01L2924/0002
摘要： A semiconductor device has a multilayered structure that includes an insulating interlayer formed on a lower wiring layer, a semiconductor substrate, and a via hole. The semiconductor device is manufactured by a method that includes plasma etching at least one surface of the insulating interlayer the in an atmosphere having as a major component either a carbonless, chlorine-based gas or a carbonless, chlorine-based gas and an inactive gas in order to remove contaminates that would otherwise promote reactivity with aluminum CVD on the surface of the insulating interlayer.
摘要翻译： 半导体器件具有多层结构，其包括形成在下布线层，半导体衬底和通孔上的绝缘中间层。 半导体器件通过以下方法制造：包括在作为主要成分的无碳，氯系气体或无碳，氯系气体和惰性气体的气氛中等离子体蚀刻绝缘夹层的至少一个表面 以去除否则将促进绝缘中间层表面上的铝CVD的反应性的污染物。
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公开(公告)号：US5627345A
公开(公告)日：1997-05-06
申请号：US198788
申请日：1994-02-18
IPC分类号： H01L23/522 , H01L23/532 , H05K1/09 , H05K1/14
CPC分类号： H01L21/76852 , H01L21/76885 , H01L23/5226 , H01L23/53223 , H01L2924/0002 , Y10T29/49126 , Y10T29/49165
摘要： A multilevel interconnect structure for use in a semiconductor device includes a lower metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting point metal alloy film. An interlayer insulating film is deposited on the lower metal wiring and a via hole is formed in the interlayer insulating film. A plug made of aluminum or aluminum alloy is formed in the via hole. An upper metal wiring has an aluminum or aluminum alloy film and a high melting point metal or high melting point metal alloy film. The plug directly contacts the aluminum or aluminum alloy film of at least one of the lower and upper metal wirings to decrease the via resistance without reducing the electromigration reliability.
摘要翻译： 用于半导体器件的多层互连结构包括具有铝或铝合金膜和高熔点金属或高熔点金属合金膜的下金属布线。 层间绝缘膜沉积在下金属布线上，并且在层间绝缘膜中形成通孔。 在通孔中形成由铝或铝合金制成的塞子。 上金属布线具有铝或铝合金膜和高熔点金属或高熔点金属合金膜。 插头直接接触下部和上部金属布线中的至少一个的铝或铝合金膜以降低通孔电阻而不降低电迁移可靠性。
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公开(公告)号：US5619465A
公开(公告)日：1997-04-08
申请号：US584471
申请日：1996-01-11
IPC分类号： G11C7/06 , G11C11/406 , G11C11/4091 , G11C7/02
CPC分类号： G11C11/406 , G11C11/4091 , G11C7/065
摘要： A semiconductor memory device is disclosed, which is supplied with power from a power supply and which includes memory cells and a sense amplifier connected to the cells via bit lines. The memory device further includes a circuit for enabling the sense amplifier in response to a supplied enable signal, and for allowing the sense amplifier to rewrite cell data, read on the bit lines, into the memory cell again in self-refresh mode. The enabling circuit incorporates a noise suppression circuit which suppresses rapid changes in an operation current flowing between the power supply and the sense amplifier in order to minimize power supply related noise.
摘要翻译： 公开了一种半导体存储器件，其从电源提供电力，并且包括存储器单元和经由位线连接到单元的读出放大器。 存储器件还包括一个电路，用于响应所提供的使能信号使读出放大器能够使能，并且允许读出放大器在自刷新模式下再次将位线上的单元数据重新读入存储器单元。 使能电路包括噪声抑制电路，其抑制在电源和读出放大器之间流动的工作电流的快速变化，以便最小化与电源相关的噪声。
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公开(公告)号：US5562468A
公开(公告)日：1996-10-08
申请号：US282461
申请日：1994-08-01
申请人： Hitoshi Sakai , Hitoshi Saito , Hiroshi Yamamoto
发明人： Hitoshi Sakai , Hitoshi Saito , Hiroshi Yamamoto
CPC分类号： H01R31/085 , Y10S439/923
摘要： A joint connector has a notch for exposing an outer peripheral surface of a bus bar-containing holder to the exterior when the holder is fitted in a holder receiving chamber is formed in a peripheral wall of the holder receiving chamber. Steps are formed at the outer peripheral surface of the bus bar containing holder, each of the steps being located at the notch when the bus bar-containing holder is fitted in the holder receiving chamber, thereby enabling the lifting of the bus bar-containing holder. A step is provided at the notch, so that the notch has a stair-like configuration. A plurality of notches and a plurality of pairs of steps are provided at the peripheral wall of the holder receiving chamber and the outer peripheral surface of the bus bar-containing holder, respectively.
摘要翻译： 接头连接器具有凹口，用于在保持器容纳室中的保持器接收室形成在保持器接收室的周壁上时，使总线条容纳保持器的外周面暴露于外部。 在汇流条容纳保持器的外周面上形成有台阶，当母线容纳保持器装配在保持器容纳室中时，每个台阶位于切口处，从而能够提升含母线夹持器 。 在切口处设置有台阶，使得切口具有阶梯状构造。 多个凹口和多对台阶分别设置在保持架容纳室的周壁和含母线容纳架的外周面上。
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