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公开(公告)号：US11360118B2
公开(公告)日：2022-06-14
申请号：US16983132
申请日：2020-08-03
发明人： Katsumi Suzuki , Seiya Yamamoto
摘要： The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.
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公开(公告)号：US20220163564A1
公开(公告)日：2022-05-26
申请号：US17440912
申请日：2020-03-09
发明人： Michael BERGLER , Roland ZEISEL
摘要： A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.
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公开(公告)号：US11340260B2
公开(公告)日：2022-05-24
申请号：US16726640
申请日：2019-12-24
申请人： Teradyne, Inc.
发明人： Brian Brecht , Steve Ledford
摘要： A probe card in an automated test equipment (ATE) and methods for operating the same for testing electronic devices. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins. The probe card has a pad geometry that compensates for misalignment with corresponding probe pins due to manufacturing error or a mismatch of coefficient of thermal expansion, enabling reliable operation of the ATE over a wide range of test temperatures. The pad array may have a plurality of elongated pads, each of uniquely designed size, tilt angle, and/or center location, with the characteristics of each pad being dependent on a distance between each pad and a centroid of the pad array, such that a probe pin to pad location errors can be mitigated.
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公开(公告)号：US11333680B2
公开(公告)日：2022-05-17
申请号：US16577073
申请日：2019-09-20
发明人： Jae-hwan Jeong
摘要： A probe socket for inspecting electric characteristics of an object to be tested. The probe socket includes a plurality of power pins for applying power to the object to be tested, a plurality of ground pins arranged in parallel with the power pins, a support block for accommodating and supporting the plurality of power pins or ground pins in parallel, and a conductive plate arranged inside the support block in a direction transverse to lengthwise directions of the power pin and the ground pin and having at least one of a power connection pattern for electrically connecting the plurality of power pins in common and a ground connection pattern for electrically connecting the plurality of ground pins in common.
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公开(公告)号：US11327093B2
公开(公告)日：2022-05-10
申请号：US16742982
申请日：2020-01-15
发明人： Takashi Kawashima , Akihiko Ito , Keishi Oku , Natsuki Shiota
摘要： The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.
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公开(公告)号：US11320480B1
公开(公告)日：2022-05-03
申请号：US16531097
申请日：2019-08-04
申请人： Albert Gaoiran
发明人： Albert Gaoiran
摘要： Various embodiments of the invention provide a system and a method for testing one or more devices under test (DUTs) and for checking one or more test setups. Each of the one or more test setups includes a test board having several sockets for receipt of a DUT. A custom hardware interface is used to electrically connect the test board, such as a burn-in board with a test system configuration having multiple modules that can be configured using a computer device and related software to provide customized testing of the DUTs. The system is scalable to accommodate any DUT having any number of channels and to provide customized testing. Results of the testing are sent to the computing device.
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公开(公告)号：US20220128598A1
公开(公告)日：2022-04-28
申请号：US17077834
申请日：2020-10-22
申请人： Teradyne, Inc.
发明人： Christopher James Bruno , Philip Luke Campbell , Adnan Khalid , Evgeny Polyakov , John Patrick Toscano
摘要： An example test system includes packs. The packs include test sockets for testing devices under test (DUTs) and at least some test electronics for performing tests on the DUTs in the test sockets. Different packs are configured to have different configurations. The different configurations include at least different numbers of test sockets arranged at different pitches.
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公开(公告)号：US20220107355A1
公开(公告)日：2022-04-07
申请号：US17338312
申请日：2021-06-03
发明人： Kyoonwoo KIM , Jaehun LEE , Taejun PARK , Sanghun LIM , Seokyung KIM , Junnyeon JEONG
摘要： A substrate testing apparatus configured to perform a hot electron analysis (HEA) test for analyzing a stand-by failure in a substrate includes a heating chuck having a first surface configured to support the substrate and a second surface opposite to the first surface. The heating chuck is configured to heat the substrate and has an aperture passing through the first surface and the second surface. A substrate moving device moves the substrate on the heating chuck in a lateral direction. A camera is under the heating chuck and photographs the substrate, which is exposed by the heating chuck aperture.
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公开(公告)号：US20220099727A1
公开(公告)日：2022-03-31
申请号：US17488353
申请日：2021-09-29
申请人： IBIDEN CO., LTD.
发明人： Takayuki MORI , Taishi TAKEDA
摘要： A conduction inspection jig includes a first member having first openings, a second member having second openings and formed to be positioned above the first member, a third member formed to be positioned between the first member and the second member such that the third member forms a space between the first member and the second member and at least substantially surrounds the space, and a probe formed to pass through one of the first openings and one of the second openings such that the probe extends through the space formed between the first member and the second member.
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公开(公告)号：US11276600B2
公开(公告)日：2022-03-15
申请号：US16086706
申请日：2017-03-14
发明人： Eiji Hayashishita
IPC分类号： H01L21/66 , H01L21/683 , C09J201/00 , C09J7/20 , C09J7/22 , H01L21/67 , H01L21/677 , H01L21/02 , B32B43/00 , G01R1/04 , G01R31/28
摘要： Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.
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