公开(公告)号：US11018472B2

公开(公告)日：2021-05-25

申请号：US16752504

申请日：2020-01-24

Applicant: PANASONIC CORPORATION

Inventor： Shinichiro Nozaki

IPC: H01S5/023 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/22 ,  H01S5/02345 ,  H01S5/0235 ,  H01S5/024 ,  H01S5/02212 ,  H01S5/0237 ,  H01S5/34 ,  H01S5/343

Abstract: A semiconductor light emitting device includes a mount section having an insulating property connected to a heat sink, a plurality of semiconductor laser elements disposed on the mount section, and a heat radiation block having an insulating property disposed on the plurality of semiconductor laser elements. A first wiring made of a metal is disposed on an upper surface of the mount section, and a second wiring made of a metal is disposed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring. By electrically connecting the first wiring and the second wiring to each of the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are connected in series, and have a same polarity with each other at a side that each of the plurality of semiconductor laser elements is connected to the first wiring.

公开(公告)号：US11011886B2

公开(公告)日：2021-05-18

申请号：US16802438

申请日：2020-02-26

Applicant: INPHI CORPORATION

Inventor： Frank Gelhausen ,  Ahmed Sanaa Ahmed Awny ,  Edward Pillai ,  Ulrich Schacht ,  Oliver Piepenstock

IPC: H01S5/024 ,  G02B6/42 ,  H05K1/02 ,  H04B10/50 ,  H01S5/022 ,  H01S5/042

Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

公开(公告)号：US10998689B2

公开(公告)日：2021-05-04

申请号：US16249360

申请日：2019-01-16

Applicant: Shailendhar Saraf

Inventor： Shailendhar Saraf

IPC: H01S3/30 ,  H01S3/094 ,  H01S3/067 ,  H01S3/0941 ,  G02B6/42 ,  H01S5/02251 ,  H01S3/04 ,  H01S3/131 ,  H01S3/06 ,  H01S3/102 ,  H01S3/02 ,  H01S5/024 ,  H01S3/042 ,  H01S3/00 ,  H01S5/02

Abstract: A laser system has a fiber cable, a pump enclosure connected to the fiber cable outside of the pump enclosure, and a laser-head enclosure connected to the fiber cable disposed outside of the laser-head enclosure. The pump enclosure houses a fiber-coupled laser diode configured to produce and convey pump light through the pump enclosure out to the fiber cable. The laser-head enclosure houses a crystal. The pump light, when produced by the laser diode, propagates out from the pump enclosure through the fiber cable into the laser-head enclosure and into the crystal. The crystal produces a laser beam in response to the pump light. The integrated fiber of the laser diode, the fiber cable, and internal fiber of the laser-head enclosure, through which the pump light propagates, may be single-mode fibers, to achieve superior laser system performance with lower frequency and intensity noise than pumping through multimode fibers.

公开(公告)号：US20210126426A1

公开(公告)日：2021-04-29

申请号：US17254616

申请日：2019-06-18

Applicant: TRUMPF Photonics, Inc.

Inventor： Christoph Tillkorn ,  Stephan Strohmaier ,  Steffen Ried

IPC: H01S5/024 ,  H01S5/40

Abstract: A diode laser arrangement for the cooling of and supply of electrical current to diode laser devices, having at least two stacks, each having a diode laser device which is configured to emit a laser beam, an upper cooling device, and a lower cooling device. The diode laser device is arranged on the upper cooling device and on the lower cooling device such that the diode laser device is arranged between the upper cooling device and the lower cooling device. The upper and lower cooling devices are in each case electrically connected to the diode laser device arranged therebetween. The upper cooling device and/or the lower cooling device of a stack are in each case formed as a microchannel cooler. The upper cooling device and/or the lower cooling device of a stack in each case have substantially no electrical insulation with respect to the diode laser device arranged therebetween.

公开(公告)号：US20210126425A1

公开(公告)日：2021-04-29

申请号：US16663091

申请日：2019-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Pei-Jung YANG

IPC: H01S5/022 ,  G02B6/12 ,  H01S5/028 ,  H01S5/024

Abstract: An optoelectronic package includes a substrate having a first surface and a second surface opposite to the first surface, an optoelectronic device on the first surface of the substrate, and a first conductive through via connecting the first surface and the second surface of the substrate. The optoelectronic device is electrically connected to the first conductive through via. A method for manufacturing the optoelectronic package is also provided.

公开(公告)号：US10992103B1

公开(公告)日：2021-04-27

申请号：US16700827

申请日：2019-12-02

Applicant: Sharp Fukuyama Laser Co., Ltd.

Inventor： Satoshi Komada ,  Keisuke Miyazaki ,  Takashi Ono ,  Tetsuya Fujitani

IPC: H01S3/13 ,  H01S5/02326 ,  H01S5/183 ,  H01S5/0236 ,  H01S5/024 ,  H01S5/40 ,  H01S5/0222 ,  H01S5/323

Abstract: A laser device includes a substrate including a principal surface and a recess provided in the principal surface; a laser oscillation unit fixed to the principal surface in direct contact with the principal surface or with an adhesive interposed between the laser oscillation unit and the principal surface, the laser oscillation unit having an emission surface from which laser light that diverges as the laser light travels is emitted along the principal surface; and a reflecting member fixed to a bottom surface of the recess and having an inclined surface that is inclined with respect to the principal surface so as to reflect the laser light. At least a portion of the inclined surface is positioned in a space inside the recess.

公开(公告)号：US10978852B2

公开(公告)日：2021-04-13

申请号：US16365975

申请日：2019-03-27

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/042 ,  H01S5/40 ,  H01S5/00 ,  H01S5/068 ,  H01S5/02216

Abstract: A light emitting device includes a package body, a light-transmissive cover, one or more semiconductor laser elements, a wavelength converting member, a wiring, electrically conductive layers, an opaque electrically insulating member, and electrodes. The light-transmissive cover is secured to the package body. The wavelength converting member is disposed above the light-transmissive cover in an optical path of the laser light emitted from the semiconductor laser element. The wiring is disposed on a light incidence surface-side of the wavelength converting member. The electrically conductive layers are electrically connected to the wiring and disposed on an upper surface of the light-transmissive cover. The electrically insulating member at least partially covers the electrically conductive layers and the light-transmissive cover. The electrodes are disposed on a surface of the package body at locations outward of the electrically insulating member in a plan view, and electrically connected to the electrically conductive layers.

公开(公告)号：US10971893B2

公开(公告)日：2021-04-06

申请号：US16465589

申请日：2017-02-01

Applicant: HP Indigo B.V.

Inventor： Yuval Yunger ,  Benny Kimelman ,  Tsahi Geller

IPC: H01S5/042 ,  H01S5/024 ,  G06K15/12 ,  H01S5/40

Abstract: A method of controlling a laser unit in order to negate heat build-up caused by a laser modulation current, and eliminating artifacts caused by image related thermal effects. Upon receipt of an activation signal, an activation current is applied which causes lasing of the laser unit. Upon receipt of a deactivation signal, the method ceases lasing by selectively applying either an idle current below the activation current, or a cooling current below the idle current.

公开(公告)号：US10965096B2

公开(公告)日：2021-03-30

申请号：US16358800

申请日：2019-03-20

Applicant: Chroma Ate Inc.

Inventor： James E. Hopkins

IPC: H01S5/00 ,  H01S5/183 ,  H01S5/024

Abstract: A fixture assembly for testing a surface emitting laser diode and a testing apparatus having the same are provided. The fixture assembly comprises a base, an upper cover and a latch mechanism. The base includes at least one pocket, and at least one electrical contact interface disposed in the pocket. The upper cover includes a body, an abutting block and a pressing member disposed in the body. The abutting block is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the base and the upper cover, and is configured to selectively connect or disconnect the base to or from the upper cover. When the latch mechanism is operated to connect the base to the upper cover, the pocket and an opening of the abutting block form into a through cavity through which the laser diode emits the laser beam.

公开(公告)号：US10951006B2

公开(公告)日：2021-03-16

申请号：US15686413

申请日：2017-08-25

Applicant: TERADIODE, INC.

Inventor： Won Tae Lee ,  Michael Deutsch ,  Zhongyong Liu

IPC: H01S5/022 ,  H01S5/042 ,  H01S5/40 ,  G02B5/18 ,  G02B7/18 ,  G02B27/44 ,  H01S5/024 ,  H01S5/14

Abstract: In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.