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公开(公告)号：US20170303897A1
公开(公告)日：2017-10-26
申请号：US15647222
申请日：2017-07-11
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
CPC classification number: A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4411 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , A61N2007/0078 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , Y10T29/49005
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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公开(公告)号：US20170296145A1
公开(公告)日：2017-10-19
申请号：US15638343
申请日：2017-06-29
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , G01S15/89 , A61B8/14 , G01S15/02 , G01S7/52 , B81C1/00 , B06B1/02 , A61N7/02 , A61N7/00 , H04R1/00 , A61B8/08
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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公开(公告)号：US20170285155A1
公开(公告)日：2017-10-05
申请号：US15087914
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
CPC classification number: G01S7/52022 , A61B7/04 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S7/521 , G01S15/8915 , G01S15/8977
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号：US20170285150A1
公开(公告)日：2017-10-05
申请号：US15087943
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
IPC: G01S7/521 , H03K17/687
CPC classification number: G01S7/521 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S15/8915 , H03K17/6874
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号：US20170160388A1
公开(公告)日：2017-06-08
申请号：US14957051
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
IPC: G01S7/527
CPC classification number: G01S7/5273 , B06B1/0292 , G01S7/52026 , G01S7/5208 , G01S15/8959
Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
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Patent Agency Ranking
公开(公告)号：US20170160387A1
公开(公告)日：2017-06-08
申请号：US15288324
申请日：2016-10-07
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston
IPC: G01S7/524 , G01S7/521 , H03K19/0175
CPC classification number: G01S7/524 , A61B8/4483 , A61B8/54 , G01S7/5202 , G01S7/5208 , G01S7/52096 , G01S7/521 , H03K19/017545
Abstract: Apparatus and methods are provided directed to a device, including at least one ultrasonic transducer, a multi-level pulser coupled to the at least one ultrasonic transducer; the multi-level pulser including a plurality of input terminals configured to receive respective input voltages, an output terminal configured to provide an output voltage, and a signal path between a first input terminal and the output terminal including a first transistor having a first conductivity type coupled to a first diode and, in parallel, a second transistor having a second conductivity type coupled to a second diode.
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公开(公告)号：US20170135676A1
公开(公告)日：2017-05-18
申请号：US15419252
申请日：2017-01-30
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
CPC classification number: A61B8/56 , A61B8/4483 , A61B8/4494 , A61B8/488 , A61B8/5207 , G01S7/52033 , G01S7/52034 , G01S7/5208 , G01S7/52085 , G01S15/8915
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.
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148.发明申请COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCERS AND METHODS FOR FORMING THE SAME 有权补充金属氧化物半导体（CMOS）超声波传感器及其形成方法公开(公告)号：US20170029271A1
公开(公告)日：2017-02-02
申请号：US15291697
申请日：2016-10-12
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC classification number: B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
Abstract translation: 描述了互补金属氧化物半导体（CMOS）超声波换能器（CUT）以及用于形成CUT的方法。 CUT可以包括用于与换能器连接的单体集成超声换能器和集成电路。 CUT可用于超声波装置，例如超声成像装置和/或高强度聚焦超声（HIFU）装置。
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公开(公告)号：US09521991B2
公开(公告)日：2016-12-20
申请号：US14208281
申请日：2014-03-13
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/14 , A61B8/00 , A61N7/00 , G01S15/02 , G01S15/89 , H04R1/00 , B81C1/00 , G01S7/52 , B06B1/02 , A61N7/02 , A61B8/08
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00 , Y10T29/41
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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150.发明授权公开(公告)号：US09476969B2
公开(公告)日：2016-10-25
申请号：US14940837
申请日：2015-11-13
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
CPC classification number: G01S7/52019 , B06B1/0292 , B06B1/0607 , G01S7/52017 , G01S7/5202 , G10K11/346 , H03K5/13 , H03K2005/00019
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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