公开(公告)号：US10772190B2

公开(公告)日：2020-09-08

申请号：US15865156

申请日：2018-01-08

Applicant: Apple Inc.

Inventor： Kristopher P. Laurent ,  Brett W. Degner

IPC: H05K1/02 ,  G06F1/20 ,  H01L23/40 ,  H01L23/367

Abstract: Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.

公开(公告)号：US10656719B2

公开(公告)日：2020-05-19

申请号：US14867376

申请日：2015-09-28

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Daniel D. Sunshine ,  Ron A. Hopkinson ,  Christiaan A. Ligtenberg ,  William F. Leggett ,  Patrick Kessler

IPC: G06F3/01 ,  G06F1/16 ,  G06F3/044 ,  G06F3/0488 ,  G06F3/0354 ,  G06F3/041 ,  G06F3/02

Abstract: A dynamic input surface for an electronic device and a method of reconfiguring the same is disclosed. The input surface has a partially-flexible metal contact portion defining an input area, and a group of indicators. The indicators may be group of holes extending through the contact portion. The group of holes may be selectively illuminated based on a gesture performed on the contact portion. A size of the input area may be dynamically varied based on the gesture. Additionally, the group of indicators indicates a boundary of the input area.

公开(公告)号：US10539984B2

公开(公告)日：2020-01-21

申请号：US15234629

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： Eugene A. Whang ,  Christopher J. Stringer ,  Brett W. Degner ,  David H. Narajowski ,  Patrick Kessler ,  Eric R. Prather ,  Caitlin Elizabeth Kalinowski ,  Adam T. Stagnaro ,  Daniel L. McBroom ,  Matthew P. Casebolt ,  Michael D. McBroom

IPC: H05K5/00 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20 ,  H01L23/40 ,  H05K5/03 ,  H05K1/02 ,  F21V8/00 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H05K7/00 ,  H05K1/18

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

公开(公告)号：US10381144B1

公开(公告)日：2019-08-13

申请号：US15343177

申请日：2016-11-03

Applicant: Apple Inc.

Inventor： Brett W. Degner

IPC: H01F7/00 ,  H01F7/10

Abstract: Disclosed herein are linear actuators and haptic actuators for providing haptic output on an electronic device. In some embodiments, the linear actuator comprises two linear arrays of permanent magnets within and fixed to a housing. The linear arrays are arranged in parallel planes oriented toward, and located on opposites sides of, a moveable assembly comprising a shaft having a ferritic core. The shaft comprises a set of conducting coils, each conducting coil being located between a magnet from each of the two linear arrays. The linear actuator comprises a support mechanism that is attached to both the housing and to the moveable assembly and is configured to pivot. An electromagnetic force can arise from a current in the coils to cause the moveable assembly to move linearly between the two linear arrays.

公开(公告)号：US20190222936A1

公开(公告)日：2019-07-18

申请号：US16362404

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  William K. Smith ,  Christopher J. Stringer ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R5/033 ,  H04R1/10

CPC classification number: H04R5/0335 ,  H04R1/1008 ,  H04R1/1041

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US10254805B2

公开(公告)日：2019-04-09

申请号：US15964973

申请日：2018-04-27

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: H05K7/00 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20 ,  H01L23/40 ,  H05K5/03 ,  H05K1/02 ,  F21V8/00 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

公开(公告)号：US20190104608A1

公开(公告)日：2019-04-04

申请号：US15865156

申请日：2018-01-08

Applicant: Apple Inc.

Inventor： Kristopher P. Laurent ,  Brett W. Degner

IPC: H05K1/02

Abstract: Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.

公开(公告)号：US10248171B2

公开(公告)日：2019-04-02

申请号：US15965272

申请日：2018-04-27

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: H05K7/00 ,  G06F1/18 ,  H05K7/20 ,  F21V8/00 ,  G06F1/20 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/40 ,  H05K1/02 ,  H05K5/03

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

公开(公告)号：US10120450B2

公开(公告)日：2018-11-06

申请号：US15808549

申请日：2017-11-09

Applicant: Apple Inc.

Inventor： Jeffrey Traer Bernstein ,  Avi Cieplinski ,  Brett W. Degner ,  Duncan Kerr ,  Patrick Kessler ,  Paul Puskarich ,  Marcelo H. Coelho ,  Aleksandar Pance

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/044 ,  G09G5/00 ,  G06F1/16 ,  G06F3/02 ,  G06F3/0354 ,  A63B22/00

Abstract: Electronic devices may use touch pads that have touch sensor arrays, force sensors, and actuators for providing tactile feedback. A touch pad may be mounted in a computer housing. The touch pad may have a rectangular planar touch pad member that has a glass layer covered with ink and contains a capacitive touch sensor array. Force sensors may be mounted under each of the four corners of the rectangular planar touch pad member. The force sensors may be used to measure how much force is applied to the surface of the planar touch pad member by a user. Processed force sensor signals may indicate the presence of button activity such as press and release events. In response to detected button activity or other activity in the device, actuator drive signals may be generated for controlling the actuator. The user may supply settings to adjust signal processing and tactile feedback parameters.

公开(公告)号：US10073499B2

公开(公告)日：2018-09-11

申请号：US15614354

申请日：2017-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: H05K5/00 ,  G06F1/18 ,  G06F3/00 ,  H05K7/20 ,  G08B5/36 ,  G08B21/18 ,  H05K5/03 ,  F21V8/00 ,  H05K1/02 ,  G06F1/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).