公开(公告)号：USD659655S1

公开(公告)日：2012-05-15

申请号：US29396123

申请日：2011-06-26

Applicant: Bily Wang

Designer： Bily Wang

公开(公告)号：USD659654S1

公开(公告)日：2012-05-15

申请号：US29396121

申请日：2011-06-26

Applicant: Bily Wang

Designer： Bily Wang

公开(公告)号：US20110157868A1

公开(公告)日：2011-06-30

申请号：US12845709

申请日：2010-07-28

Applicant: Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC: G02F1/13357 ,  F21S4/00 ,  F21V11/00

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

公开(公告)号：US07951621B2

公开(公告)日：2011-05-31

申请号：US12591329

申请日：2009-11-17

Applicant: Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC: H01L21/00

CPC classification number: G02F1/133603 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

Abstract translation: 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。 每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。

公开(公告)号：US07923747B2

公开(公告)日：2011-04-12

申请号：US12346329

申请日：2008-12-30

Applicant: Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

Inventor： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

IPC: H01L33/00

CPC classification number: H01L33/38 ,  H01L33/44 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

Abstract: A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

Abstract translation: 晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。 发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。 绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

公开(公告)号：US07834365B2

公开(公告)日：2010-11-16

申请号：US11898378

申请日：2007-09-12

Applicant: Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC: H01L29/18

CPC classification number: G02F1/133603 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

Abstract translation: 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。 每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。

公开(公告)号：US20100271844A1

公开(公告)日：2010-10-28

申请号：US12429469

申请日：2009-04-24

Applicant: Bily Wang ,  Jonnie Chuang

Inventor： Bily Wang ,  Jonnie Chuang

IPC: F21V7/22

CPC classification number: G02B6/0023

Abstract: A light-guiding structure with phosphor material layers includes a light-guiding unit, a light-emitting unit and a phosphor unit. The light-emitting unit is disposed beside an outer lateral side of the light-guiding unit. The phosphor unit is connected with the light-guiding unit and is disposed between the light-guiding unit and the light-emitting unit. In addition, the phosphor unit is formed or pasted on the lateral side of the light-guiding unit, and the light-emitting unit has a PCB substrate and a plurality of light-emitting elements electrically disposed on the PCB substrate and facing the light-guiding unit. Hence, light beams generated by the light-emitting elements of the light-emitting unit pass through the phosphor unit to form another light beams, and the light beams are guided into the light-guiding unit. Finally, the light beams are projected out from a light-exiting face of the light-guiding unit.

Abstract translation: 具有荧光体材料层的导光结构包括导光单元，发光单元和荧光体单元。 发光单元设置在导光单元的外侧的旁边。 荧光体单元与导光单元连接并设置在导光单元和发光单元之间。 此外，荧光体单元形成或粘贴在导光单元的侧面上，并且发光单元具有PCB基板和多个发光元件，电气设置在PCB基板上并面对发光元件， 指导单位 因此，由发光单元的发光元件产生的光束通过荧光体单元以形成另一个光束，并且光束被引导到导光单元中。 最后，光束从导光单元的光出射面突出。

公开(公告)号：US20100264435A1

公开(公告)日：2010-10-21

申请号：US12385819

申请日：2009-04-21

Applicant: Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

Inventor： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

IPC: H01L33/00 ,  H01L21/28

CPC classification number: H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A white light-emitting diode package structure for simplifying package process includes a substrate unit, a light-emitting unit, a phosphor unit and a conductive unit. The light-emitting unit is disposed on the substrate, and the light-emitting unit has a positive conductive layer and a negative conductive layer. The phosphor unit has a phosphor layer formed on the light-emitting unit and at least two openings for respectively exposing one partial surface of the positive electrode layer and one partial surface of the negative electrode layer. The conductive unit has at least two conductive wires respectively passing through the two openings in order to electrically connect the positive electrode layer with the substrate unit and electrically connect the negative electrode layer with the substrate unit.

Abstract translation: 用于简化封装处理的白色发光二极管封装结构包括衬底单元，发光单元，荧光体单元和导电单元。 发光单元设置在基板上，发光单元具有正导电层和负导电层。 荧光体单元具有形成在发光单元上的荧光体层和用于分别暴露正极层的一个部分表面和负极层的一个部分表面的至少两个开口。 导电单元具有分别通过两个开口的至少两根导线，以将正电极层与衬底单元电连接并将负电极层与衬底单元电连接。

公开(公告)号：US07815346B2

公开(公告)日：2010-10-19

申请号：US12285178

申请日：2008-09-30

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: F21V5/00 ,  G09G5/00

CPC classification number: G01B11/14

Abstract: A method for calculating out an optimum arrangement pitch between each two LED chip package units, including: providing a backlight module with a predetermined brightness value and a predetermined material information that a customer needs; determining what brightness level and amount of LED chip package units need to be used by a designer according to the brightness value and the material information of the backlight module; and dividedly arranging the LED chip package units determined by the designer on a light-entering area of the backlight module in order to define what the optimum arrangement pitch between each two LED chip package units is.

Abstract translation: 一种用于计算每个两个LED芯片封装单元之间的最佳布置间距的方法，包括：提供具有预定亮度值的背光模块和客户需要的预定材料信息; 根据背光模块的亮度值和材料信息确定设计者需要使用什么亮度级别和数量的LED芯片封装单元; 并且将由设计者确定的LED芯片封装单元分开地布置在背光模块的光进入区域上，以便限定每个两个LED芯片封装单元之间的最佳布置间距。

公开(公告)号：US07804162B2

公开(公告)日：2010-09-28

申请号：US12379258

申请日：2009-02-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC: H01L23/02 ,  H01J1/62 ,  H01J63/04 ,  F21V9/00

CPC classification number: C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract translation: 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光，并使用蓝色发光二极管芯片来激发绿色荧光体以发射波长为490nm的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。