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    Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
    1.
    发明授权
    Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same 有权
    具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法

    公开(公告)号：US08263876B2

    公开(公告)日：2012-09-11

    申请号：US12649824

    申请日：2009-12-30

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H05K1/11

    CPC分类号： B26D3/06 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/403 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T83/0524

    摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.

    摘要翻译： 导电基板结构包括基板单元，导电焊盘单元和导电层单元。 基板单元具有顶表面，底表面，两个相对的侧表面和前表面。 导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。 导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层 到两个第二导电焊盘的两个相对的侧面。 两个第一导电层分别与两个第二导电层电连接。

    Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
    2.
    发明授权
    Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach 有权
    制造具有通过使用双面切割方法形成的导电通道的导电基板结构的方法

    公开(公告)号：US08555492B2

    公开(公告)日：2013-10-15

    申请号：US13338410

    申请日：2011-12-28

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H05K3/04

    CPC分类号： B26D3/06 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/403 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T83/0524

    摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.

    摘要翻译： 导电基板结构包括基板单元，导电焊盘单元和导电层单元。 基板单元具有顶表面，底表面，两个相对的侧表面和前表面。 导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。 导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层 到两个第二导电焊盘的两个相对的侧面。 两个第一导电层分别与两个第二导电层电连接。

    Wafer level LED package structure and method for making the same
    5.
    发明授权
    Wafer level LED package structure and method for making the same 有权
    晶圆级LED封装结构及制作方法

    公开(公告)号：US07923747B2

    公开(公告)日：2011-04-12

    申请号：US12346329

    申请日：2008-12-30

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00

    CPC分类号： H01L33/38 ,  H01L33/44 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

    摘要翻译： 晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。 发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。 绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

    White light-emitting diode package structure for simplifying package process and method for making the same
    6.
    发明申请
    White light-emitting diode package structure for simplifying package process and method for making the same 审中-公开
    白色发光二极管封装结构，简化封装工艺及其制作方法

    公开(公告)号：US20100264435A1

    公开(公告)日：2010-10-21

    申请号：US12385819

    申请日：2009-04-21

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/28

    CPC分类号： H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A white light-emitting diode package structure for simplifying package process includes a substrate unit, a light-emitting unit, a phosphor unit and a conductive unit. The light-emitting unit is disposed on the substrate, and the light-emitting unit has a positive conductive layer and a negative conductive layer. The phosphor unit has a phosphor layer formed on the light-emitting unit and at least two openings for respectively exposing one partial surface of the positive electrode layer and one partial surface of the negative electrode layer. The conductive unit has at least two conductive wires respectively passing through the two openings in order to electrically connect the positive electrode layer with the substrate unit and electrically connect the negative electrode layer with the substrate unit.

    摘要翻译： 用于简化封装处理的白色发光二极管封装结构包括衬底单元，发光单元，荧光体单元和导电单元。 发光单元设置在基板上，发光单元具有正导电层和负导电层。 荧光体单元具有形成在发光单元上的荧光体层和用于分别暴露正极层的一个部分表面和负极层的一个部分表面的至少两个开口。 导电单元具有分别通过两个开口的至少两根导线，以将正电极层与衬底单元电连接并将负电极层与衬底单元电连接。

    Wafer level led package structure for increasing light-emitting efficiency and method for making the same
    8.
    发明申请
    Wafer level led package structure for increasing light-emitting efficiency and method for making the same 审中-公开
    用于提高发光效率的晶片级LED封装结构和制造它的方法

    公开(公告)号：US20100127292A1

    公开(公告)日：2010-05-27

    申请号：US12461742

    申请日：2009-08-24

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/30

    CPC分类号： H01L33/38 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.

    摘要翻译： 用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。 发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负导电层和反射绝缘层。 发光体具有底部材料层和顶部材料层。 绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。 一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。 两个第二导电单元分别形成在两个第一导电单元上。

    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME
    9.
    发明申请
    WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
    用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法

    公开(公告)号：US20100032706A1

    公开(公告)日：2010-02-11

    申请号：US12346329

    申请日：2008-12-30

    申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

    IPC分类号： H01L33/00 ,  H01L21/02

    CPC分类号： H01L33/38 ,  H01L33/44 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.

    摘要翻译： 晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。 发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。 第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。 第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。 绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。