Abstract:
An IGBT with a fast reverse recovery time rectifier includes an N-type drift epitaxial layer, a gate, a gate insulating layer, a P-type doped base region, an N-type doped source region, a P-type doped contact region, and a P-type lightly doped region. The P-type doped base region is disposed in the N-type drift epitaxial layer, and the P-type doped contact region is disposed in the N-type drift epitaxial layer. The P-type lightly doped region is disposed between the P-type contact doped region and the N-type drift epitaxial layer, and is in contact with the N-type drift epitaxial layer.
Abstract:
A semiconductor device having integrated MOSFET and Schottky diode includes a substrate having a MOSFET region and a Schottky diode region defined thereon; a plurality of first trenches formed in the MOSFET region; and a plurality of second trenches formed in the Schottky diode region. The first trenches respectively including a first insulating layer formed over the sidewalls and bottom of the first trench and a first conductive layer filling the first trench serve as a trenched gate of the trench MOSFET. The second trenches respectively include a second insulating layer formed over the sidewalls and bottom of the second trench and a second conductive layer filling the second trench. A depth and a width of the second trenches are larger than that of the first trenches; and a thickness of the second insulating layer is larger than that of the first insulating layer.
Abstract:
A power semiconductor device with an electrostatic discharge (ESD) structure includes an N-type semiconductor substrate, at least one ESD device, and at least one trench type transistor device. The N-type semiconductor has at least two trenches, and the ESD device is disposed in the N-type semiconductor substrate between the trenches. The ESD device includes a P-type first doped region, and an N-type second doped region and an N-type third doped region disposed in the P-type first doped region. The N-type second doped region is electrically connected to a gate of the trench type transistor device, and the N-type third doped region is electrically connected to a drain of the trench type transistor device.
Abstract:
A computer includes a switch, a power supply, a TV module, a computer module and a control module. The switch creates a trigger signal. The TV module plays TV programs. The control module controls the power supply to power on the TV module after receiving the trigger signal when the control module determines the TV module and the computer module are powered off.
Abstract:
A method for monitoring and controlling a household appliance is provided. The method has the steps of: monitoring and sampling the power of the household appliance to obtain a first standby power range; monitoring and sampling the power of the household appliance to obtain a set of first real-time power data; calculating a first standby confidence level based on the number of times that the first real-time power data fall within the first standby power range; and determining that the household appliance is in a standby state if the first standby confidence level is greater than or equal to a standby confidence level threshold.
Abstract:
A synchronization system for a widget and a corresponding application includes a display and a processor. The processor includes a background management module, an application window module, a widget, and a widget management module. The application layer is adapted to store application data, and tell the background management module to download updated data corresponding to the application via a network, after determining a storage time of the application data is greater than a reference time. The application window module is adapted to obtain the application data or the updated data from the application layer and display the application data or the updated data. The widget is displayed. The widget management module is adapted to obtain the widget data of the application data or the updated data from the application layer and send the widget data to the widget.
Abstract:
A pharyngeal intubation guiding device includes lengthwise extending tongue-side and palate-side walls that cooperatively define a guiding duct. The tongue-side wall is configured to conform to the rear end of a patient's tongue to permit the guiding duct to confront the opening of the patient's larynx. The palate-side wall has an outer contour which establishes a guideway towards the opening of the patient's esophagus. A lengthwise extending laryngoscope guiding channel and a lengthwise extending endotracheal tube guiding groove are disposed in the guiding duct. A viewing window is disposed to define a terminal end of the laryngoscope guiding channel. The endotracheal tube guiding groove has a lead-in port to permit an endotracheal tube introduced therein to be removable laterally. A lengthwise extending conduit is disposed in the guiding duct to permit an aspirator tube to reach the patient's trachea to suck out phlegm.
Abstract:
A conductive pad structure, configured in a peripheral circuit area of a device substrate, is provided. The conductive pad structure includes a conductive pad and a plurality of conductive spacers. The conductive spacers are configured on the conductive pad and arranged as a non-closed pattern on the conductive pad. Besides, a chip package structure and a device substrate that both have the above-mentioned conductive pad structure are also provided.
Abstract:
A manufacturing method of a depletion mode trench semiconductor device includes following steps. Firstly, a substrate including a drift epitaxial layer disposed thereon is provided. A trench is disposed in the drift epitaxial layer. A gate dielectric layer is formed on an inner sidewall of the trench and an upper surface of the drift epitaxial layer. A base doped region is formed in the drift epitaxial layer and adjacent to a side of the trench. A thin doped region is formed and conformally contacts the gate dielectric layer. A gate material layer is formed to fill the trench. A source doped region is formed in the base doped region, and the source doped region overlaps the thin doped region at a side of the trench. Finally, a contact doped region is formed to overlap the thin doped region, and the contact doped region is adjacent to the source doped region.