公开(公告)号：US20120094841A1

公开(公告)日：2012-04-19

申请号：US13255969

申请日：2010-07-02

Applicant: Kook-Chae Chung ,  Tae-Jeong Jeong ,  Gyu-Chae Choi ,  Tae-Hoon Kim ,  Tae-Soo Lim ,  Young-Kuk Kim ,  Soon-Tae Ahn

Inventor： Kook-Chae Chung ,  Tae-Jeong Jeong ,  Gyu-Chae Choi ,  Tae-Hoon Kim ,  Tae-Soo Lim ,  Young-Kuk Kim ,  Soon-Tae Ahn

IPC: H01B12/02 ,  H01L39/24

CPC classification number: B21C23/002 ,  B21B2003/006 ,  B21C23/08 ,  H01L39/2487

Abstract: Disclosed herein is a method of preparing a MgB2 superconducting wire and the MgB2 superconducting wire prepared thereby. The method comprising rolling a raw powder by using a powder rolling method. According to the method of the present invention has an effect of increasing an effective area where superconducting current can flow by improvement of the connectivity of a MgB2 superconducting powder and achievement of high density through a powder rolling process, and maintaining an uniform current value even in a large length because of the improvement of the connectivity.

Abstract translation: 本文公开了一种制备MgB 2超导线材和由此制备的MgB 2超导线材的方法。 该方法包括使用粉末轧制方法轧制原料粉末。 根据本发明的方法，通过改善MgB 2超导粉末的连通性并通过粉末轧制工艺实现高密度，从而提高超导电流可以流动的有效面积，并且即使在 由于连接性的提高，长度很大。

公开(公告)号：US20120093395A1

公开(公告)日：2012-04-19

申请号：US13377935

申请日：2010-09-06

Applicant: Tae Hoon Kim ,  Jung Hee Ryu

Inventor： Tae Hoon Kim ,  Jung Hee Ryu

IPC: G06K9/46 ,  G06K9/00

CPC classification number: G06T7/593 ,  G06T7/30 ,  G06T2200/32

Abstract: The present invention relates to a method for hierarchically matching a building image. The method includes the steps of: matching a wall of a specific building in the building image inputted as a query with a wall(s) of a building(s) in at least one panoramic image by using a technology of matching a building's shape or repeated pattern; selecting a candidate panoramic image(s) which includes a building(s) recognized to have the same or similar wall to the specific building in the panoramic image(s) as a result of matching its wall with others; matching at least one local region, if containing a recognizable string or figure, in the specific building with local region(s) in the building(s) of the candidate panoramic image(s) by using a technology of recognizing a string or a figure; and determining top n panoramic image(s) as the result of matching the local region.

Abstract translation: 本发明涉及一种层次匹配建筑物图像的方法。 该方法包括以下步骤：通过使用匹配建筑物的形状的技术将建筑图像中输入的建筑物图像中的特定建筑物的墙壁与​​至少一幅全景图像中的建筑物的墙壁进行匹配，或 反复模式; 选择候选全景图像，其包括被认为具有与全景图像中的特定建筑物相同或相似的墙壁的建筑物，作为将其墙壁与其他墙壁匹配的结果; 通过使用识别字符串或图形的技术来将至少一个本地区域（如果包含可识别的字符串或图形）与候选全景图像的建筑物中的本地区域相关联的特定建筑物匹配 ; 并且作为匹配局部区域的结果来确定顶部n个全景图像。

公开(公告)号：US20120087592A1

公开(公告)日：2012-04-12

申请号：US13378166

申请日：2010-12-23

Applicant: Tae Hoon Kim ,  Jung Hee Ryu ,  Chan Jin Ju

Inventor： Tae Hoon Kim ,  Jung Hee Ryu ,  Chan Jin Ju

IPC: G06K9/68

CPC classification number: G06K9/6255

Abstract: The present invention relates to a method for adaptively performing an image matching process according to a situation. The method includes the steps of: (a) recognizing the situation of a subject included in an inputted image; and (b) selecting an image group including at least one image to be compared with the inputted image of the subject for the image matching process among multiple images stored on a database, as a qualified reference image group, according to the recognized situation; wherein the images included in the qualified reference image group are dynamically changed according to the recognized situation.

Abstract translation: 本发明涉及一种根据情况自适应地进行图像匹配处理的方法。 该方法包括以下步骤：（a）识别输入图像中包含的被摄体的状况; 以及（b）根据所识别的情况，选择包含至少一个图像的图像组，作为合格参考图像组，将与图像匹配处理对象的输入图像进行比较的至少一个图像与存储在数据库中的多个图像中进行比较; 其中包括在合格参考图像组中的图像根据识别的情况动态地改变。

公开(公告)号：US20120062980A1

公开(公告)日：2012-03-15

申请号：US13052580

申请日：2011-03-21

Applicant: Sang Jin KIM ,  Young Soo OH ,  Hwan Soo LEE ,  Jung Min PARK ,  Tae Hoon KIM ,  Sang Moon LEE

Inventor： Sang Jin KIM ,  Young Soo OH ,  Hwan Soo LEE ,  Jung Min PARK ,  Tae Hoon KIM ,  Sang Moon LEE

IPC: G02F1/167 ,  B05D5/12 ,  B05D5/06

CPC classification number: G02B26/026

Abstract: Disclosed herein are a color electronic paper display device and a method for manufacturing the same. The color electronic paper display device according to the present invention includes: a barrier rib structure including a plurality of cavities partitioned so that rotating balls are separately inserted thereinto; an electrode structure including an upper electrode and a lower electrode each formed over and under the barrier rib structure and applying voltage to the rotating balls; and a black coating layer formed on the surfaces of the barrier ribs of the barrier rib structure.

Abstract translation: 这里公开了彩色电子纸显示装置及其制造方法。 根据本发明的彩色电子纸显示装置包括：隔壁结构，包括被分隔成多个空腔，使得旋转球分别插入其中; 包括上部电极和下部电极的电极结构，每个形成在所述阻挡肋结构之上和之下，并向所述旋转球施加电压; 以及形成在隔壁结构的隔壁的表面上的黑色涂层。

公开(公告)号：US20120032342A1

公开(公告)日：2012-02-09

申请号：US12981463

申请日：2010-12-29

Applicant: Bok Gyu MIN ,  Joon Ki HONG ,  Tae Hoon KIM ,  Da Un NAH ,  Jae Joon AHN ,  Ki Bum KIM

Inventor： Bok Gyu MIN ,  Joon Ki HONG ,  Tae Hoon KIM ,  Da Un NAH ,  Jae Joon AHN ,  Ki Bum KIM

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L2224/16 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/15311

Abstract: A semiconductor package includes: first, second, third and fourth semiconductor chips stacked while having the arrangement of chip selection vias; and a connection unit provided between a second semiconductor chip and a third semiconductor chip, and configured to mutually connect some of the chip selection vias of the second and third semiconductor chips and disconnect the others of the chip selection vias of the second and third semiconductor chips, wherein the first and second semiconductor chips and the third and fourth semiconductor chips are stacked in a flip chip type.

Abstract translation: 半导体封装包括：第一，第二，第三和第四半导体芯片，同时具有芯片选择通孔的布置; 以及连接单元，设置在第二半导体芯片和第三半导体芯片之间，并且被配置为相互连接第二和第三半导体芯片的一些芯片选择通孔，并且断开第二和第三半导体芯片的芯片选择通孔中的其它芯片 ，其中第一和第二半导体芯片以及第三和第四半导体芯片以倒装芯片类型堆叠。

公开(公告)号：US08100573B2

公开(公告)日：2012-01-24

申请号：US12483406

申请日：2009-06-12

Applicant: Tae-Hoon Kim ,  Seoung-Bum Pyoun ,  Young-Jin Kim ,  Yeon-Sun Na

Inventor： Tae-Hoon Kim ,  Seoung-Bum Pyoun ,  Young-Jin Kim ,  Yeon-Sun Na

IPC: F21V8/00

CPC classification number: G02B6/0068 ,  G02B6/003 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  G02F1/133615

Abstract: A light-emitting module includes a power transmitting substrate disposed adjacent to a light guide plate (LGP). The power transmitting substrate includes first and second substrate portions positioned substantially perpendicular to each other. The first substrate portion faces a light incident surface of the LGP. The second substrate portion extends from the first substrate portion and is substantially parallel with a counter surface of the LGP. First and second light sources respectively emit light from a top and a side thereof, and are respectively mounted on the first and second substrate portions. The first and second light sources respectively emit light to the light incident surface. A receiving container supports the light-emitting module and contains the LGP.

Abstract translation: 发光模块包括邻近导光板（LGP）设置的电力传输基板。 电力传输基板包括基本上彼此垂直地定位的第一和第二基板部分。 第一基板部分面向LGP的光入射表面。 第二基板部分从第一基板部分延伸并且基本上平行于LGP的相对表面。 第一和第二光源分别从其顶部和侧面发射光，并分别安装在第一和第二基板部分上。 第一和第二光源分别向光入射表面发光。 接收容器支持发光模块并包含LGP。

公开(公告)号：US20120001544A1

公开(公告)日：2012-01-05

申请号：US12904512

申请日：2010-10-14

Applicant: Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

Inventor： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

IPC: H01J7/44 ,  H01J9/00

CPC classification number: H01L25/167 ,  H01L27/3276 ,  H01L27/3288 ,  H01L33/641 ,  H01L51/529 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.

Abstract translation: 公开了发光模块和制造发光模块的方法。 发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用 驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

公开(公告)号：US20110278752A1

公开(公告)日：2011-11-17

申请号：US12900572

申请日：2010-10-08

Applicant: Tae-Hoon KIM ,  Se-Jin PARK ,  Young-Jin KIM ,  Seong-Woon KIM

Inventor： Tae-Hoon KIM ,  Se-Jin PARK ,  Young-Jin KIM ,  Seong-Woon KIM

IPC: E04B1/18

CPC classification number: E01D19/00 ,  E01D21/00

Abstract: The method for constructing precast coping for bridge of the present invention enables to manufacture a segment match-cast manufactured with the top of a pier body; to be applied to small and medium size bridges by introducing transverse tendon force to each segment through tendons after manufacturing a subsegment which is match cast to both sides of the pre-made segment; to be rapidly produced; and to retension tendons when the coping is constructed by using a plurality of segments. Further, the method for constructing precast coping for bridge of the present invention enables to manufacture the method for constructing precast coping for bridge, enabling to obtain stability towards lift by easily lifting the coping, assembled on the ground, through lifting lugs by forming lifting lugs on the top upon manufacturing segments.

Abstract translation: 本发明的桥梁预制构件的制造方法能够制造由墩体的顶部制造的片段搭配; 通过在制造与预制段的两侧相匹配的子段之后通过筋将横向筋力引入到中小型桥梁中; 快速生产; 以及当通过使用多个段来构建应对时的延续筋。 此外，本发明的桥梁预制构件的制造方法能够制造桥梁的预制拱顶的方法，能够通过提升凸耳通过提升凸耳容易地提升组装在地面上的应力来获得对提升的稳定性 在制造部门的顶部。

公开(公告)号：US07981345B2

公开(公告)日：2011-07-19

申请号：US12379069

申请日：2009-02-12

Applicant: Yeong-Eun Yoo ,  Doo-Sun Choi ,  Young-Ho Seo ,  Tae-Hoon Kim

Inventor： Yeong-Eun Yoo ,  Doo-Sun Choi ,  Young-Ho Seo ,  Tae-Hoon Kim

IPC: B29C45/14

CPC classification number: B29C45/14336 ,  B29C45/0046 ,  B29C2045/0094

Abstract: Disclosed is a fabrication method of products with closed channels by injection molding, which includes: a channel substrate mounting step of mounting a channel substrate comprising a plurality of opened micro-channels thereon to a mold; and a substrate cover molding step of molding a substrate cover by the injection molding on an upper surface of the channel substrate mounted to the mold, the substrate cover being coupled to the channel substrate while being molded. With this, the products with the closed channels can be fabricated without any additional coupling process between the channel substrate having the opened channels and the substrate cover, thereby simplifying a fabrication process and enhancing work efficiency.

Abstract translation: 公开了一种通过注塑成型的具有闭合通道的产品的制造方法，其包括：通道基板安装步骤，其将包括多个打开的微通道的通道基板安装到模具上; 以及基板覆盖成型步骤，其通过注射成型在安装到模具的通道基板的上表面上模制基板盖，基板盖在模制时联接到通道基板。 由此，具有闭合通道的产品可以在具有开放通道的通道基板和基板盖之间没有任何额外的耦合过程的情况下制造，从而简化制造工艺并提高工作效率。

公开(公告)号：US20110122169A1

公开(公告)日：2011-05-26

申请号：US12838666

申请日：2010-07-19

Applicant: Sung-jin CHOI ,  Sang-hoon LEE ,  Tae-hoon KIM ,  Pankaj AGARWAL ,  Myoung-jun LEE ,  Youn-hee KIM

Inventor： Sung-jin CHOI ,  Sang-hoon LEE ,  Tae-hoon KIM ,  Pankaj AGARWAL ,  Myoung-jun LEE ,  Youn-hee KIM

IPC: G06F3/038 ,  G09G5/10

CPC classification number: G09G3/342 ,  G09G2310/0235 ,  G09G2320/0233 ,  G09G2320/064 ,  G09G2320/0666 ,  G09G2330/02 ,  G09G2330/028 ,  H05B33/0827 ,  H05B33/0857

Abstract: A display apparatus is provided. The display apparatus includes: a display panel; and a backlight unit which provides the display panel with backlight. The backlight unit includes: a converter which converts a voltage of a received power and outputs an output power, a plurality of light source modules which receives the output power from the converter, and a control unit which determines powering conditions to operate the plurality of the light source modules in a specific state for each of the plurality of light source modules, and controls the converter sequentially based on the determined powering conditions.

Abstract translation: 提供一种显示装置。 显示装置包括：显示面板; 以及向显示面板提供背光的背光单元。 背光单元包括：转换器，其接收接收功率的电压并输出输出功率;多个光源模块，其从转换器接收输出功率;以及控制单元，其确定供电条件以操作多个 对于多个光源模块中的每一个，处于特定状态的光源模块，并且基于所确定的供电条件顺序控制转换器。