公开(公告)号：US10272253B2

公开(公告)日：2019-04-30

申请号：US15797278

申请日：2017-10-30

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  H01B17/30 ,  A61N1/05

Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.

公开(公告)号：US10183162B2

公开(公告)日：2019-01-22

申请号：US14986647

申请日：2016-01-01

Applicant: Greatbatch Ltd.

Inventor： Robert Shawn Johnson ,  Robert A. Stevenson

IPC: A61N1/08 ,  A61N1/05 ,  H03H1/00 ,  H03H7/24 ,  H03H7/01

Abstract: A coiled, closed-loop RF current attenuator is configured to be placed about an implantable lead conductor. A coiled conductor extends in a coiled shape defining a longitudinal axis from a first coil end to a second coil end. The first coil end is electrically connected to the second coil end. An insulator is disposed about the coiled conductor. The closed loop attenuator can also include in series a short, a capacitor and/or a resistor. In some embodiments the closed loop attenuator can be resonant at an MRI RF-pulsed frequency. The closed loop attenuator can be integrated as a permanent part of an implantable lead conductor, or alternatively, be a stand-alone device that is placed about a premade implantable lead conductor.

公开(公告)号：US20180361164A1

公开(公告)日：2018-12-20

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B22F3/02 ,  B22F3/04 ,  B22F3/15 ,  B22F2007/042 ,  B22F2999/00 ,  B23K35/3013 ,  B32B18/00 ,  C04B35/00 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/72 ,  C22C1/0466 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US10092749B2

公开(公告)日：2018-10-09

申请号：US15704657

申请日：2017-09-14

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/37 ,  H01G4/30 ,  H01G4/32 ,  A61N1/375 ,  H01G4/005 ,  H03H1/00 ,  H01G4/12 ,  H01G4/35

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

公开(公告)号：US10080889B2

公开(公告)日：2018-09-25

申请号：US14187295

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/40 ,  A61N1/08 ,  A61N1/37 ,  H01R13/7195 ,  H03H1/00 ,  H01R13/52 ,  H01G2/02 ,  H01G2/10 ,  H03H7/01

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G2/02 ,  H01G2/10 ,  H01G4/40 ,  H01R13/5224 ,  H01R13/7195 ,  H01R2201/12 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.

公开(公告)号：US20180236244A1

公开(公告)日：2018-08-23

申请号：US15943998

申请日：2018-04-03

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods

IPC: A61N1/375 ,  A61N1/378 ,  H01R13/52 ,  H01R4/58 ,  H01R13/26

CPC classification number: A61N1/3754 ,  A61N1/37512 ,  A61N1/378 ,  H01R4/58 ,  H01R13/26 ,  H01R13/5221 ,  H01R13/5224 ,  H01R2201/12 ,  H03H2001/0014 ,  H03H2001/0021 ,  H03H2001/0042

Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.

公开(公告)号：US10016595B2

公开(公告)日：2018-07-10

申请号：US15373139

申请日：2016-12-08

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H01G4/40 ,  A61N1/375 ,  A61N1/37 ,  H01G4/35 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US09999765B2

公开(公告)日：2018-06-19

申请号：US15466939

申请日：2017-03-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson

IPC: A61N1/37 ,  A61N1/08 ,  A61N1/375

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3752

Abstract: A surrogate implantable medical device includes a thermally conductive and electrically conductive housing. A header connector block includes a header block body, where the header block body is attached to the housing. At least one connector cavity is located within the header block body and configured to be attachable to an implantable lead. At least one conductive leadwire is disposed at least partially within the header block body having a first end and a second end. The at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing. The housing does not contain active electronics.

公开(公告)号：US09931514B2

公开(公告)日：2018-04-03

申请号：US15250210

申请日：2016-08-29

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

IPC: A61N1/00 ,  A61N1/375 ,  H02G15/013 ,  H01G4/40 ,  H01G2/02 ,  H01G4/35 ,  H01G4/228 ,  H03H1/00 ,  H01R13/7197 ,  H01R13/52

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/5224 ,  H01R13/7197 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an active implantable medical device includes an electrically conductive ferrule hermetically sealed by a first braze to an insulator. A conductor is hermetically sealed to and disposed through the insulator. A filter capacitor has an active electrode plate and a ground electrode plate which are disposed within and supported by a capacitor dielectric in an interleaved, partially overlapping relationship. A first passageway is disposed through the capacitor dielectric having a capacitor internal metallization which is connected to the active electrode plate. A capacitor external metallization electrically connects to the ground electrode plate. An oxide-resistant metal addition includes a conductive core with a conductive cladding of a different material. A first electrical connection is between the oxide-resistant metal addition and the capacitor external metallization. A second electrical connection is between the oxide-resistant metal addition and the ferrule.

公开(公告)号：US09889306B2

公开(公告)日：2018-02-13

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: B01J20/34 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.