Abstract:
In one embodiment of the present invention, one row is selected and two columns are selected for a read or programming operation, such that twice as many flash memory cells can be read from or programmed in a single operation compared to the prior art. In another embodiment of the present invention, two rows in different sectors are selected and one column is selected for a read operation, such that twice as many flash memory cells can be read in a single operation compared to the prior art.
Abstract:
A method of forming a memory device on a semiconductor substrate having a memory region (with floating and control gates), a first logic region (with first logic gates) and a second logic region (with second logic gates). A first implantation forms the source regions adjacent the floating gates in the memory region, and the source and drain regions adjacent the first logic gates in the first logic region. A second implantation forms the source and drain regions adjacent the second logic gates in the second logic region. A third implantation forms the drain regions adjacent the control gates in the memory region, and enhances the source region in the memory region and the source/drain regions in the first logic region. A fourth implantation enhances the source/drain regions in the second logic region.
Abstract:
The present invention relates to a flash memory device with EEPROM functionality. The flash memory device is byte-erasable and bit-programmable.
Abstract:
The present invention relates to a flash memory device with EEPROM functionality. The flash memory device is byte-erasable and bit-programmable.