Film forming method and producing method for electron source substrate
    164.
    发明申请
    Film forming method and producing method for electron source substrate 失效
    电子源基片的成膜方法及其制造方法

    公开(公告)号:US20060216409A1

    公开(公告)日:2006-09-28

    申请号:US11354811

    申请日:2006-02-16

    Applicant: Seiji Mishima

    Inventor: Seiji Mishima

    Abstract: In case of forming films in plural positions with an ink jet head having plural nozzles, to provide a method of efficiently correcting an aberration in the liquid droplet applying position resulting for example from a distortion of a substrate, thereby producing an electron source with a high production yield. Positions of device electrodes 2, 3 on the electron source substrate 1 are detected by fetching in advance a surface image of the substrate 1, then a position of an electroconductive film 4 is calculated as a liquid droplet applying position, and an inclination angle θ of the ink jet head 11 is so regulated that a pitch of the nozzles 12 matches a pitch d of the obtained liquid droplet applying positions.

    Abstract translation: 在用具有多个喷嘴的喷墨头形成多个位置的膜的情况下,提供一种有效地校正液滴施加位置的像差的方法,例如由于基板的变形而产生高的电子源 产量。 通过提取基板1的表面图像来检测电子源基板1上的器件电极2,3的位置,然后计算导电膜4的位置作为液滴施加位置,并且计算出倾斜角θ 喷墨头11被调整为使得喷嘴12的间距与获得的液滴施加位置的间距d相匹配。

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