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171.发明授权Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof 有权散热片和采用环形气流的气流管组件及其制造方法公开(公告)号：US06650538B1
公开(公告)日：2003-11-18
申请号：US10197108
申请日：2002-07-17
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for cooling one or more heat generating components. The cooling apparatus includes a heat sink structure and an airflow tube assembly. In one embodiment, the heat sink structure has a first surface for coupling to one or more heat generating components, and a second surface having at least one fin extending therefrom. The airflow tube assembly has at least one airflow tube which is sized to at least partially receive the at least one fin of the heat sink structure, wherein an annular airflow can be established between the at least one airflow tube and the at least one fin of the heat sink structure, thereby enhancing heat transfer from the heat sink structure to the airflow and cooling of the heat generating component(s).
摘要翻译： 提供冷却装置和制造方法来冷却一个或多个发热部件。 冷却装置包括散热器结构和气流管组件。 在一个实施例中，散热器结构具有用于耦合到一个或多个发热部件的第一表面和具有从其延伸的至少一个翅片的第二表面。 所述气流管组件具有至少一个气流管，其尺寸被设计成至少部分地容纳所述散热器结构的所述至少一个翅片，其中可以在所述至少一个气流管和所述至少一个翅片之间建立环形气流 散热器结构，从而增强从散热器结构到发热部件的气流和冷却的热传递。
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公开(公告)号：US06557354B1
公开(公告)日：2003-05-06
申请号：US10116099
申请日：2002-04-04
IPC分类号： F25B2102
摘要： A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.
摘要翻译： 提供了一种使用热电结构的热交换器来冷却电子设备的发热部件。 热交换器包括一排隔开的通道，例如由两个或更多个分开的管或单个盘绕管形成，用于承载第一冷却流体。 热交换器还包括设置在相邻间隔通道之间并暴露于第二冷却流体的热电结构。 在一个实施例中，热交换器还包括设置在相邻相邻间隔通道之间的翅片，使得热电结构设置在相邻通道和翅片之间。
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173.发明授权公开(公告)号：US06548894B2
公开(公告)日：2003-04-15
申请号：US09726909
申请日：2000-11-30
IPC分类号： H01L2334
CPC分类号： H01L23/38 , H01L23/34 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/16152 , H01L2224/0401
摘要： An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
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174.发明授权Thermoelectric-enhanced heat spreader for heat generating component of an electronic device 失效用于电子设备的发热部件的热电增强散热器公开(公告)号：US06424533B1
公开(公告)日：2002-07-23
申请号：US09606984
申请日：2000-06-29
IPC分类号： H05K720
CPC分类号： H01L35/32 , H01L23/38 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/01322 , Y10S257/93 , Y10T29/4935
摘要： A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.
摘要翻译： 为电子设备提供散热子组件。 子组件包括配置成热耦合到电子设备的发热部件的表面的散热器。 发热组件，例如集成电路芯片，在其表面的至少一个第一区域和表面的至少一个第二区域之间的表面上具有不均匀的热分布，其中至少一个第一区域具有 比所述至少一个第二区域更高的热通量。 所述子组件还包括至少一个热电装置，其对准具有较高热通量的每个第一区域的至少一部分，其中所述至少一个热电装置有助于较高热通量的耗散。 在一个实施例中，一个或多个热电装置被嵌入散热器内并与其热隔离。
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175.发明授权Electronic module with integral refrigerant evaporator assembly and control system therefore 有权因此，具有集成制冷剂蒸发器组件和控制系统的电子模块公开(公告)号：US06366462B1
公开(公告)日：2002-04-02
申请号：US09618921
申请日：2000-07-18
IPC分类号： H05K720
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.
摘要翻译： 提供一种电子模块，其具有联接到闭循环冷却系统的集成制冷剂蒸发器组件以及用于控制该系统的方法。 模块和集成组件包括排列在衬底上的多个集成电路芯片。 蒸发器组件设置在芯片和衬底之上，使得在组件和芯片所在的衬底之间形成腔室。 组件的下板具有多个喷射孔，其将冷却剂引导到排列在衬底上的多个芯片的各个芯片上。 此外，下板包括在至少一些喷射孔之间形成的多个通道。 在通过撞击在集成电路芯片上的冷却剂被加热之后，多个通道从腔室中去除冷却剂。 提供控制系统以防止在闭合循环冷却系统的启动和关闭期间组件内的过大的压力积聚。
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公开(公告)号：US06253835B1
公开(公告)日：2001-07-03
申请号：US09502321
申请日：2000-02-11
IPC分类号： F28F700
CPC分类号： F28F3/12 , F28F13/08 , F28F2210/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one channel of the plurality of channels has a fluid flow cross-section that varies over a length thereof to selectively enhance a heat transfer coefficient of the coolant fluid within the channel and thereby produce a more uniform temperature at the surface of the heat sink member when making thermal contact with the electronic device.
摘要翻译： 提供用于冷却电子设备的设备和所得到的流体冷却电子设备。 在一个实施例中，该设备包括具有用于与电子设备进行热接触的表面的散热构件。 散热构件具有用于承载冷却剂流体的多个通道。 多个通道定位在第一组和第二组中，使得冷却剂流在组件上交替。 多个通道中的至少一个通道具有在其长度上变化的流体流动截面，以选择性地增强通道内的冷却剂流体的传热系数，从而在散热器的表面产生更均匀的温度 与电子设备进行热接触时的部件。
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公开(公告)号：US6144013A
公开(公告)日：2000-11-07
申请号：US346382
申请日：1999-07-01
IPC分类号： H01L23/473 , H05K1/02 , H05K5/02 , H05K7/20 , H05B1/00
CPC分类号： H05K5/0213 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/1305 , H05K1/0212
摘要： A local humidity control system and method are provided for a low temperature electronic device assembly wherein a surface of the low temperature electronic device assembly is maintained above an ambient dew point. The local humidity control system includes a first layer of thermal insulation at least partially surrounding and contacting the cooled electronic device, and a second layer of thermal insulation surrounding the first layer of thermal insulation and the cooled electronic device in which a volume is defined between the first and second layers of insulation. A heater assembly interfaces with the volume to heat the volume to a temperature sufficient to maintain the surface of the cooled electronic device above the ambient dew point. The heater assembly includes a thin film heater attached to the first layer of thermal insulation to maintain temperature of the surface above the ambient dew point, and a wire mesh heater suspended within the volume to lower relative humidity in the volume and inhibit the ingress of water vapor.
摘要翻译： 本发明提供了一种用于低温电子器件组件的局部湿度控制系统和方法，其中低温电子器件组件的表面被保持在环境露点之上。 本地湿度控制系统包括至少部分地围绕和接触冷却的电子设备的第一绝热层，以及围绕第一绝热层和冷却的电子设备的第二绝热层，其中在第 第一层和第二层绝缘。 加热器组件与体积接口以将体积加热到足以将冷却的电子设备的表面保持在环境露点之上的温度。 加热器组件包括附接到第一绝热层的薄膜加热器，以将表面的温度保持在环境露点之上，并且将线网加热器悬挂在体积内以降低体积中的相对湿度并抑制水的进入 汽。
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公开(公告)号：US5269372A
公开(公告)日：1993-12-14
申请号：US047763
申请日：1993-04-15
IPC分类号： F28F3/12 , H01L23/473 , F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L2924/0002
摘要： A cold plate for cooling electronic modules and devices is disclosed which incorporates an intersecting flow network. The flow network is designed and devised such that flow paths are arranged in a rectilinear fashion surrounding blocks of material which act as heat sinks. Supply conduits and return conduits for supplying and returning cooling fluid are disposed orthogonally to the flow directions within the flow paths and such that each supply channel is circumscribed by a plurality of return channels, and each return channel is circumscribed by a plurality of supply channels. The arrangement of the supply and return channels insures the shortest possible flow path for the cooling fluid thereby insuring maximum cooling efficiency and minimizing and localizing the temperature rise in the cooling fluid during passage from the supply conduit to the return conduit. With a minimum temperature rise of the cooling fluid over a short flow path, conduction in the cold plate insures optimum uniformity of cooling to the electronic components. The components of the cold plate either may be assembled and clamped or may be rigidly affixed to one another by means of either soldering or braising to form the structure defining the flow channels, conduits and manifold connections necessary for the consistent and uniform circulation of the cooling fluid.
摘要翻译： 公开了一种用于冷却电子模块和装置的冷板，其包括相交流网络。 设计和设计流动网络，使得流动路径以围绕作为散热器的材料块的直线方式布置。 用于供应和返回冷却流体的供应管道和返回管道设置成与流动路径内的流动方向正交，并且使得每个供应通道被多个返回通道限定，并且每个返回通道被多个供应通道限定。 供应和返回通道的布置确保了用于冷却流体的最短可能的流动路径，从而确保最大的冷却效率，并且在从供应导管到返回导管的通道期间最小化和定位冷却流体中的温度升高。 随着冷却流体在短流路上的最小温升，冷板中的传导确保对电子部件的最佳冷却均匀性。 冷板的组件可以被组装和夹紧，或者可以通过焊接或炖制将它们彼此刚性地固定，以形成限定流体通道，管道和歧管连接的结构，以使冷却器的一致和均匀循环 流体。
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179.发明申请CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM 失效导电热交换冷却系统和多组分电子系统的方法公开(公告)号：US20080084668A1
公开(公告)日：2008-04-10
申请号：US11539905
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Randall G. Kemink , Roger R. Schmidt , Robert E. Simons
CPC分类号： H05K7/20509 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H05K7/20009 , H05K7/20772 , H01L2224/0401
摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.
摘要翻译： 提供导电热传输冷却系统和方法来冷却电子系统的一次和二次发热部件。 冷却系统包括液体冷却子系统，其包括物理耦合到电子系统的至少一个主要发热部件的至少一个液体冷却冷却板，以及耦合到流体连通的流体传导冷却剂管 至少一个液冷冷板。 导热辅助结构耦合到冷却剂承载管和电子系统的至少一个二次发热部件。 当使用时，导热辅助结构提供从至少一个二次发热部件到耦合到其上的至少一个导热冷却剂输送管的导热传输，并且因此通过对流通过其中的液体冷却剂。
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公开(公告)号：US20080084664A1
公开(公告)日：2008-04-10
申请号：US11539910
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20009 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.
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