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    Integrated circuit test units with integrated physical and electrical test regions
    181.
    发明授权
    Integrated circuit test units with integrated physical and electrical test regions 有权
    集成电路测试单元，具有集成的物理和电气测试区域

    公开(公告)号：US08674355B2

    公开(公告)日：2014-03-18

    申请号：US12980865

    申请日：2010-12-29

    Applicant: Huan-Chi Tseng ,  Heng-Hsin Liu ,  Shu-Cheng Kuo ,  Chien-Chang Lee ,  Chun-Hung Lin

    Inventor： Huan-Chi Tseng ,  Heng-Hsin Liu ,  Shu-Cheng Kuo ,  Chien-Chang Lee ,  Chun-Hung Lin

    IPC: H01L23/58

    CPC classification number: H01L23/544 ,  H01L22/34 ,  H01L23/4824 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device includes a test unit in a die. The test unit includes a physical test region including an active region, and a plurality of conductive lines over the active region and parallel to each other. The plurality of conductive lines has substantially a uniform spacing, wherein no contact plugs are directly over and connected to the plurality of conductive lines. The test unit further includes an electrical test region including a transistor having a gate formed of a same material, and at a same level, as the plurality of conductive lines; and contact plugs connected to a source, a drain, and the gate of the transistor. The test unit further includes an alignment mark adjacent the physical test region and the electrical test region.

    Abstract translation: 一种装置包括在模具中的测试单元。 测试单元包括物理测试区域，该物理测试区域包括有源区域和在该有源区域上并且彼此平行的多个导电线。 多个导线具有基本上均匀的间隔，其中没有接触插塞直接在多个导线上并连接到多个导线。 测试单元还包括电测试区域，该电测试区域包括晶体管，该晶体管具有由相同材料形成的栅极，并且处于与多个导线相同的电平; 以及连接到晶体管的源极，漏极和栅极的接触插塞。 测试单元还包括邻近物理测试区域和电测试区域的对准标记。

    HEAT-DISSIPATING DEVICE AND METHOD FOR FABRICATING THE SAME
    183.
    发明申请
    HEAT-DISSIPATING DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
    热消散装置及其制造方法

    公开(公告)号：US20130118717A1

    公开(公告)日：2013-05-16

    申请号：US13298239

    申请日：2011-11-16

    Applicant: CHUN-HUNG LIN ,  HAN LIN CHEN ,  HSUAN HAO PAI

    Inventor： CHUN-HUNG LIN ,  HAN LIN CHEN ,  HSUAN HAO PAI

    IPC: F28D15/04 ,  B21D53/02

    CPC classification number: F28D15/0233 ,  F28D15/0275 ,  F28F1/24 ,  F28F2275/122 ,  Y10T29/4935

    Abstract: A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board.

    Abstract translation: 散热装置包括彼此相邻布置的多个翅片板，热管和盖板。 每个翅板具有从其顶部边缘突出的至少两个固定片，以及形成在固定片之间的支撑部。 在支撑部分和固定片之间限定一容纳空间。 热管具有设置在容纳空间中的部分。 盖板形成有与固定片相对应的多个狭缝。 固定片通过狭缝并固定到盖板上。

    Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure
    184.
    发明授权
    Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure 有权
    堆叠式固态电解电容器具有多方向产品引线框架结构

    公开(公告)号：US08390991B2

    公开(公告)日：2013-03-05

    申请号：US12833421

    申请日：2010-07-09

    Applicant: Chi-Hao Chiu ,  Yui-Shin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chun-Hung Lin ,  Wen-Yen Huang

    Inventor： Chi-Hao Chiu ,  Yui-Shin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chun-Hung Lin ,  Wen-Yen Huang

    IPC: H01G9/04 ,  H01G9/15 ,  H01G4/228

    CPC classification number: H01G9/00

    Abstract: A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.

    Abstract translation: 堆叠的固态固体电解电容器包括多个电容器单元，基板单元和封装单元。 基板单元包括正引导基板和负引导基板。 正引导基板具有沿着第一预定方向从其一体延伸的正露出端。 负引导基板具有沿着第二预定方向从其一体地延伸的第一负外露端，沿着第三预定方向从其一体地延伸的第二负外露端，以及沿着第四预定方向从其一体地延伸的第三负外露端。 第一，第二，第三和第四预定方向是不同的。 电容器单元堆叠在彼此的顶部并且设置在负引导基板上。 封装单元包围电容器单元，正极的一部分和负引导基板的一部分。

    HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF
    185.
    发明申请
    HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF 审中-公开
    热管制造方法及其热管

    公开(公告)号：US20130048249A1

    公开(公告)日：2013-02-28

    申请号：US13218580

    申请日：2011-08-26

    Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

    Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

    IPC: F28D15/00 ,  B21D53/02 ,  F28D15/04

    CPC classification number: F28D15/0233 ,  F28D15/046 ,  H01L21/4871 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

    Abstract: A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.

    Abstract translation: 热管包括台阶管和烧结粉末结构。 台阶管的内壁具有多个槽。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 烧结粉末结构限制在每个冷凝段内，提高热管的内部空气流速和导热效率。

    Solar cell with two exposed surfaces of ARC layer disposed at different levels
    186.
    发明授权
    Solar cell with two exposed surfaces of ARC layer disposed at different levels 失效
    具有ARC层的两个暴露表面的太阳能电池处于不同的水平

    公开(公告)号：US08253010B2

    公开(公告)日：2012-08-28

    申请号：US12100786

    申请日：2008-04-10

    Applicant: Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

    Inventor： Sheng Yung Liu ,  Chin-Tien Yang ,  Chun-Hung Lin

    IPC: H01L31/00

    CPC classification number: H01L31/022433 ,  H01L31/02168 ,  Y02E10/50 ,  Y02E10/52

    Abstract: A solar cell includes a substrate, a conductor layer and an anti-reflection coating (ARC) layer. The substrate has a front side, a back side and a doped region adjacent to the front side. The conductor layer has a first portion embedded into the doped region and a second portion other than the first portion. The ARC layer has first and second exposed surfaces, first and second side surfaces and a bottom surface. The first side surface is connected to the first and second exposed surfaces. The second side surface is connected to the second exposed surface and the bottom surface disposed on the front side. The second portion is disposed in the ARC layer. The conductor layer has an exposed surface, which is exposed out of the ARC layer, and higher than the second exposed surface and substantially flush with an exposed surface of the ARC layer.

    Abstract translation: 太阳能电池包括基板，导体层和抗反射涂层（ARC）层。 衬底具有与前侧相邻的前侧，后侧和掺杂区。 导体层具有嵌入掺杂区域中的第一部分和除第一部分之外的第二部分。 ARC层具有第一和第二暴露表面，第一和第二侧表面和底表面。 第一侧表面连接到第一和第二暴露表面。 第二侧表面连接到第二暴露表面和设置在前侧的底表面。 第二部分设置在ARC层中。 导体层具有暴露于ARC层之外的暴露表面，并且高于第二暴露表面并且基本上与ARC层的暴露表面齐平。

    Integrated Circuit Test Units with Integrated Physical and Electrical Test Regions
    187.
    发明申请
    Integrated Circuit Test Units with Integrated Physical and Electrical Test Regions 有权
    具有综合物理和电气测试区域的集成电路测试单元

    公开(公告)号：US20120168751A1

    公开(公告)日：2012-07-05

    申请号：US12980865

    申请日：2010-12-29

    Applicant: Huan-Chi Tseng ,  Heng-Hsin Liu ,  Shu-Cheng Kuo ,  Chien-Chang Lee ,  Chun-Hung Lin

    Inventor： Huan-Chi Tseng ,  Heng-Hsin Liu ,  Shu-Cheng Kuo ,  Chien-Chang Lee ,  Chun-Hung Lin

    IPC: H01L23/58

    CPC classification number: H01L23/544 ,  H01L22/34 ,  H01L23/4824 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device includes a test unit in a die. The test unit includes a physical test region including an active region, and a plurality of conductive lines over the active region and parallel to each other. The plurality of conductive lines has substantially a uniform spacing, wherein no contact plugs are directly over and connected to the plurality of conductive lines. The test unit further includes an electrical test region including a transistor having a gate formed of a same material, and at a same level, as the plurality of conductive lines; and contact plugs connected to a source, a drain, and the gate of the transistor. The test unit further includes an alignment mark adjacent the physical test region and the electrical test region.

    Abstract translation: 一种装置包括在模具中的测试单元。 测试单元包括物理测试区域，该物理测试区域包括有源区域和在该有源区域上并且彼此平行的多个导电线。 多个导线具有基本上均匀的间隔，其中没有接触插塞直接在多个导线上并连接到多个导线。 测试单元还包括电测试区域，该电测试区域包括晶体管，该晶体管具有由相同材料形成的栅极，并且处于与多个导线相同的电平; 以及连接到晶体管的源极，漏极和栅极的接触插塞。 测试单元还包括邻近物理测试区域和电测试区域的对准标记。

    AUTOMATIC CONFIGURATION AND CONTINUATION OF FEDERATION RELATIONSHIPS
    190.
    发明申请
    AUTOMATIC CONFIGURATION AND CONTINUATION OF FEDERATION RELATIONSHIPS 有权
    自动配置与联合关系的持续性

    公开(公告)号：US20120036566A1

    公开(公告)日：2012-02-09

    申请号：US12852209

    申请日：2010-08-06

    Applicant: David J. Nicholson ,  David Lewis Fisher ,  Michael D. Ritche ,  Chun-Hung Lin ,  Christopher B. Dove ,  Kavitha Radhakrishnan

    Inventor： David J. Nicholson ,  David Lewis Fisher ,  Michael D. Ritche ,  Chun-Hung Lin ,  Christopher B. Dove ,  Kavitha Radhakrishnan

    IPC: G06F21/20 ,  G06F11/07

    CPC classification number: H04L63/0815 ,  H04L63/0876 ,  H04L63/126

    Abstract: Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack.

    Abstract translation: 实施例涉及在多个网络堆栈级别的至少一个级别上建立数据的一部分的完整性，并且自动地在至少两个联合计算机系统之间继续建立的联合关系。 在一个实施例中，第一联合计算机系统接收与由数字签名签名的计算机系统相对应的数字签名，数字签名包括计算机系统的身份和其他联合关系信息，其被配置为在第一联合计算机系统和第二联合计算机系统之间建立信任的联合关系 联合计算机系统。 第一联合计算机系统尝试在网络堆栈的第一级验证接收到的数字签名，并确定第一网络堆栈层的验证不成功。 第一联合计算机系统然后在网络堆栈的第二个不同级别验证所接收的数字签名。

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