WAFER CONFIGURED TO RECONDITION A SUPPORT SURFACE OF A WAFER HOLDING STAGE

    公开(公告)号:US20210020494A1

    公开(公告)日:2021-01-21

    申请号:US16927707

    申请日:2020-07-13

    Applicant: IMEC vzw

    Inventor: Thomas Hantschel

    Abstract: According to one aspect, a reconditioning wafer can include a carrier substrate that supports at least one array of regularly spaced protrusions configured to form indentations in a support surface of a wafer holding stage. The protrusions within the same array can have substantially the same shape and dimensions, thereby enabling a more reliable reconditioning process compared to prior art solutions. The protrusions may have the form of pyramids or pillars or other similar shapes with at least the tip of the protrusions formed of a material suitable to make the indentations. The reconditioning wafer can be obtainable by a molding technique wherein an array of molds can be created in a mold substrate. The molds can be filled with an indentation material such as diamond, and can be bonded to the carrier substrate. The mold substrate can be removed by thinning and wet etching.

    MEMORY WRITING
    182.
    发明申请

    公开(公告)号:US20210017595A1

    公开(公告)日:2021-01-21

    申请号:US17040036

    申请日:2019-03-22

    Applicant: IMEC VZW

    Abstract: The present invention relates to a method for writing data comprising a sequence of bits, the data being written in a form of nucleic acid, by in-vitro enzymatically producing memory nucleic acid from a strand of memory writing substrate nucleic acid, wherein the strand of memory writing substrate nucleic acid comprises a plurality of spacer sections and memory writing sections sandwiched between the spacer sections. Each of the spacer sections comprises one or more nucleobases, and each of the memory writing sections comprises a nucleobase other than the nucleobases of an adjacent spacer section upstream of the memory writing section in a travel direction of an enzyme along the strand of memory writing substrate nucleic acid. The method comprising: repeating of: synthesising, in liquid medium comprising the strand of memory writing substrate nucleic acid contacted with the enzyme, a spacer portion of the memory nucleic acid from a spacer section by the enzyme by contacting with a solution of spacer nucleotides compatible with the nucleobases of the spacer section; halting the synthesising of the spacer portion in a position where the enzyme is reaching the memory writing section resulting from incompatibility between spacer nucleotides and nucleobases of the portion of the memory nucleic acid from the memory writing section; receiving a sub-sequence of the sequence of bits, said sub-sequence comprising at least one bit; selecting a memory nucleotide compatible with the nucleobase of the memory writing section, and comprising a first label or first modification, on a condition that said sub-sequence comprises a predetermined first sequence of bit-values, and selecting a memory nucleotide compatible with the nucleobase of the memory writing section, and comprising a second label or second modification, on a condition that said sub-sequence comprises a predetermined second sequence of bit-values; and subsequent to the halting, synthesising, in the liquid medium comprising the strand of memory writing substrate nucleic acid contacted with the enzyme, a memory portion of the memory nucleic acid from the memory writing section by the enzyme by contacting the enzyme with a solution of the selected memory nucleotide.

    Extreme Ultraviolet Lithography Device

    公开(公告)号:US20210011370A1

    公开(公告)日:2021-01-14

    申请号:US16926460

    申请日:2020-07-10

    Applicant: IMEC VZW

    Abstract: The present disclosure relates to an extreme ultraviolet lithography, EUVL, device comprising: a reticle comprising a lithographic pattern to be imaged on a target wafer; a light-transmissive pellicle membrane mounted in front of, and parallel to, the reticle, wherein the pellicle membrane scatters transmitted light along a scattering axis; and an extreme ultraviolet, EUV, illumination system configured to illuminate the reticle through the pellicle membrane, wherein an illumination distribution provided by the EUV illumination system is asymmetric as seen in a source-pupil plane of the EUV illumination system; wherein light reflected by the reticle and then transmitted through the pellicle membrane comprises a non-scattered fraction and a scattered fraction formed by light scattered by the pellicle membrane; the EUVL device further comprising: an imaging system having an acceptance cone configured to capture a portion of the light reflected by the reticle and then transmitted through the pellicle membrane.

    METHOD FOR MANUFACTURING A SILICON ON NITRIDE SUBSTRATE

    公开(公告)号:US20210005444A1

    公开(公告)日:2021-01-07

    申请号:US16919102

    申请日:2020-07-01

    Applicant: IMEC VZW

    Inventor: Hu LIANG Lan PENG

    Abstract: According to an aspect of the present inventive concept there is provided a method for manufacturing a silicon on nitride, SON, substrate. The method comprises the steps of providing a semiconductor layer of a first crystal orientation, forming, on the semiconductor layer, an interface layer comprising a monocrystalline III-nitride layer forming a nucleation layer for a subsequent epitaxy process, and bonding a silicon substrate of a second crystal orientation with the interface layer.

    MONITORING AN OPERATING STATE OF A VALVE

    公开(公告)号:US20210003231A1

    公开(公告)日:2021-01-07

    申请号:US16981392

    申请日:2019-03-08

    Abstract: A device is configured to monitor a state of a rotatable handle of a valve when the device is attached to the rotatable handle. The device comprises a vector magnetometer configured to measure a magnetic field. The device comprises a processing unit configured to obtain from the vector magnetometer measurements of the magnetic field when the handle is rotated; calculate a change in the state of the rotatable handle based on a difference between the measurements of the magnetic field; and report the change in the state.

    Method of bonding semiconductor substrates

    公开(公告)号:US10886252B2

    公开(公告)日:2021-01-05

    申请号:US15908641

    申请日:2018-02-28

    Applicant: IMEC VZW

    Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient. The method additionally includes bonding the first and the second substrates by contacting the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate to form a substrate assembly. The method further includes post-bond annealing the assembly.

    Imaging apparatus and method for imaging an object

    公开(公告)号:US10883939B2

    公开(公告)日:2021-01-05

    申请号:US16442484

    申请日:2019-06-15

    Applicant: IMEC VZW

    Abstract: An imaging apparatus comprises: (i) an illumination waveguide configured to propagate light by total internal reflection, wherein an evanescent field illuminates an object in close relation to the illumination waveguide; (ii) an array of light-sensitive areas arranged on a common substrate with the illumination waveguide for detecting light from the object; and (iii) a controller configured to control forming of an interference pattern in the illumination waveguide, wherein the interference pattern comprises at least one element of constructive interference for selectively illuminating a portion of the object, the at least one element having a dimension with a size in a range of 100 nm-10 μm; wherein the controller is configured to sequentially change the interference pattern in relation to the object such that different portions are illuminated and light from different portions is sequentially detected.

    Method for high resolution patterning of organic layers

    公开(公告)号:US10862036B2

    公开(公告)日:2020-12-08

    申请号:US15740265

    申请日:2016-06-27

    Abstract: At least one embodiment relates to a method for photolithographic patterning of an organic layer on a substrate. The method includes providing a water-soluble shielding layer over the organic layer. In addition, the method includes providing a photoresist layer on the water-soluble shielding layer. The method also includes photolithographic patterning of the photoresist layer to form a patterned photoresist layer. Further, the method includes etching the water-soluble shielding layer and the organic layer, using the patterned photoresist layer as a mask, to form a patterned water-soluble shielding layer and a patterned organic layer. Still further, the method includes removing the patterned water-soluble shielding layer. The method includes, before providing the water-soluble shielding layer, providing a hydrophobic protection layer having a hydrophobic upper surface on the organic layer.

    Device, a system and a method in holographic imaging

    公开(公告)号:US10859976B2

    公开(公告)日:2020-12-08

    申请号:US15936489

    申请日:2018-03-27

    Applicant: IMEC VZW

    Abstract: A device in holographic imaging comprises: at least two light sources, wherein each of the at least two light sources is arranged to output light of a unique wavelength; and at least one holographic optical element, wherein the at least two light sources and the at least one holographic optical element are arranged in relation to each other such that light from the at least two light sources incident on the at least one holographic optical element interacts with the at least one holographic optical element to form wavefronts of similar shape for light from the different light sources.

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