Thermal interface material for electronic device

    公开(公告)号:US11991870B1

    公开(公告)日:2024-05-21

    申请号:US17814184

    申请日:2022-07-21

    CPC classification number: H05K7/20945 G06F1/163 G06F1/206

    Abstract: An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.

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