Abstract:
A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine or in the component mounting machine to engage with the arrangement for feeding the components towards the picking position.
Abstract:
The present invention is generally related to a jetting device for jetting droplets of viscous medium onto a substrate, said jetting device comprising an ejector element for performing the jetting process and a jetting outlet through which said droplets are jetted. In particular, the invention is related to a method, a measuring device, a jetting device, and a viscous medium container for use in such a jetting device for measuring or monitoring a level or volume of viscous medium during a jetting process and/or measuring electrical properties of the viscous medium to determine characteristics of the medium.
Abstract:
Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.
Abstract:
System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides.Each tape guide also comprises visual marking for indicating the sub-set to which the tape guide belongs.
Abstract:
A surface mount machine has a fixed X-axis comprising a straight beam rigidly mounted in the machine chassis along which one or several wagons move(s), each one carrying at least one component pick-up device. Below the X-beam for the X-axis there are component feeders which are organized in groups and which are accessible by the pick-up devices and at least two Y-axes provided by linear bearings, which are rigidly mounted in the machine chassis. Y-wagons for carrying printed circuit boards move along the Y-axes. As there are at least two PCB carrying Y-axes, it can be arranged that at least one of them presents a PCB on which the pick-up devices can place components. The time during which the pick-up devices must be idle during PCB unload and load will thereby be dramatically reduced.
Abstract:
The invention relates to an apparatus for surface mounting of components (201) on a support (106). The arrangement comprises a positioning device )102, 103, 104) for holding and moving the components to a mounting position relative to the support. A centering arrangement of two components (203, 204) movable towards and from each other and disposed to center the component from opposite sides concurrently with its movement to the mounting position is provided. The centering arrangement (203, 204) comprises two centering electrodes (300, 310) which are designed with recesses (301, 302, 305, 306) which are adapted to the form and the size of the different component types to be mounted. The centering electrodes moreover comprise electric contact members (307, 308, 706) which are intended to connect the component to an equipment for measuring its electrical properties.
Abstract:
A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.
Abstract:
A mechanical interface for transferring a reciprocating movement from one element to another element releasably mountable thereto. The interface comprises at least three interface points, at least two of which being laterally spaced apart, and at least two of which being longitudinally spaced apart. A motion generator provides a reciprocating movement, which is transferred from the one element to the other element via at least one of the interface points. The interface point(s) transferring the movement includes contact portions having curved contact surfaces, such that the curved contact surfaces are in abutment with opposing contact surfaces of the interface point when the elements are mounted, thereby transferring the reciprocating movement.
Abstract:
A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.
Abstract:
A mechanical interface for transferring a reciprocating movement from one element to another element releasably mountable thereto. The interface comprises at least three interface points, at least two of which being laterally spaced apart, and at least two of which being longitudinally spaced apart. Motion means provides a reciprocating movement, which is transferred from the one element to the other element via at least one of the interface points. The interface point(s) transferring the movement comprises contact portions having curved contact surfaces, such that the curved contact surfaces are in abutment with opposing contact surfaces of the interface point when the elements are mounted, thereby transferring the reciprocating movement.