公开(公告)号：US20210082737A1

公开(公告)日：2021-03-18

申请号：US16989864

申请日：2020-08-10

Applicant: AP SYSTEMS INC.

Inventor： Chang Kyo KIM ,  Chang Min KWON

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

Abstract: Provided are an edge ring and a heat treatment apparatus having the same. The edge ring includes a main body having a ring shape. The main body includes a substrate support part configured to support an edge of a bottom surface of a substrate, an outer band provided outside the substrate support part and having a top surface that is higher than a top surface of the substrate support part and is parallel to a top surface of the substrate supported by the substrate support part, an outer sidewall provided outside the outer band, and a groove part provided between the substrate support part and the outer band.

公开(公告)号：US20190103296A1

公开(公告)日：2019-04-04

申请号：US16132218

申请日：2018-09-14

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Yong Soo MOON ,  Gun Bum LEE

IPC: H01L21/67 ,  G01J5/00 ,  G01J5/02

Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).

公开(公告)号：US09470581B2

公开(公告)日：2016-10-18

申请号：US14190084

申请日：2014-02-25

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun Ji

IPC: F27D11/00 ,  G01J5/60 ,  G01J5/00 ,  G01J5/06

CPC classification number: G01J5/602 ,  G01J5/0007 ,  G01J2005/0048 ,  G01J2005/067

Abstract: Disclosed are an apparatus and method of detecting a temperature through a pyrometer in a non-contact manner, and an apparatus for processing a substrate using the apparatus, and more particularly, an apparatus and method of detecting a temperature, which precisely measures a temperature without any effect by humidity, and an apparatus for processing a substrate using the same. In an exemplary embodiment, an apparatus for detecting a temperature includes a humidity sensor configured to measure a humidity value, a temperature compensation database configured to store a temperature compensation value for each humidity value, and a pyrometer providing a non-contact temperature calculated by adding a temperature compensation value corresponding to a humidity value detected by the humidity sensor to a temperature to be compensated, which is obtained by converting a measured a wavelength intensity of a radiation radiated from an object in a wavelength band to be compensated.

Abstract translation: 公开了以非接触方式通过高温计检测温度的装置和方法，以及使用该装置处理基板的装置，更具体地，涉及一种检测温度的装置和方法，其精确地测量温度而没有 湿度的任何影响，以及使用其的基板的处理装置。 在一个示例性实施例中，用于检测温度的装置包括被配置为测量湿度值的湿度传感器，配置为存储每个湿度值的温度补偿值的温度补偿数据库，以及提供非接触温度的高温计， 将由湿度传感器检测到的湿度值对应的温度补偿值与要补偿的温度相对应的温度补偿值，该温度补偿值是通过将被测量的被测物体辐射的波长的波长强度转换成待补偿的波段而得到的。

公开(公告)号：US20160284572A1

公开(公告)日：2016-09-29

申请号：US15051660

申请日：2016-02-23

Applicant: AP SYSTEMS INC.

Inventor： Pil Seong JEONG ,  Sang Hyun JI ,  Sung Yong LEE ,  Yong Woo HAN

IPC: H01L21/67 ,  H05B1/02

CPC classification number: H01L21/67115 ,  H05B1/0233

Abstract: Present disclosure relates to a heater block including a plurality of heating lamps mounted on one surface thereof facing an object to be processed, e.g., a substrate and a substrate processing apparatus including the same. The heating lamp includes a first lamp configured to irradiate ultraviolet (UV) rays to the object to be processed and a second lamp configured to irradiate infrared (IR) rays to the object to be processed. A relative ratio of the number of first lamp to the number of second lamp is different for each of a plurality of areas on the one surface. Provided are the heater block that may thermally compensate a temperature of an edge area of the substrate to increase temperature uniformity of the substrate and the substrate processing apparatus.

Abstract translation: 本公开涉及一种加热器块，其包括安装在其面对待处理物体的一个表面上的多个加热灯，例如基板和包括该加热器的基板处理设备。 加热灯包括被配置为向待处理物体照射紫外（UV）射线的第一灯和配置成向被处理物体照射红外（IR）射线的第二灯。 第一灯的数量与第二灯的数量的相对比对于一个表面上的多个区域中的每个区域是不同的。 提供了可以热补偿衬底的边缘区域的温度以增加衬底和衬底处理设备的温度均匀性的加热器块。

公开(公告)号：US09386632B2

公开(公告)日：2016-07-05

申请号：US14403575

申请日：2013-05-21

Applicant: AP SYSTEMS INC.

Inventor： Sang-Hyun Ji

IPC: H05B1/02 ,  H05B3/00 ,  G01J5/00

CPC classification number: H05B1/0233 ,  G01J5/0007 ,  G01J5/0044 ,  H05B3/0047

Abstract: The present invention relates to a substrate treatment apparatus and method which perform heat treatment on a substrate, and can accurately measure the temperature of the substrate even at a low temperature. An embodiment of the present invention includes a process chamber that has a substrate treatment space, a heating housing that contains a plurality of heating lamps for generating radiant energy, a window that is placed between the heating housing and the process chamber to maintain the air-tightness of the process chamber and transmit the radiant energy to be transferred to a substrate, a first pyrometer that measures a wavelength generated at the substrate in the process chamber, and converts the wavelength into substrate measurement energy, a second pyrometer that measures a wavelength generated at the window, and converts the wavelength into window measurement energy; and a heating controller that compensates for the window measurement energy in the substrate measurement energy, thereby calculating the temperature of the substrate itself, and uses the calculated temperature of the substrate itself to control the heating lamps.

Abstract translation: 本发明涉及对基板进行热处理的基板处理装置和方法，并且即使在低温也能够精确地测量基板的温度。 本发明的实施例包括具有基板处理空间的处理室，包含用于产生辐射能的多个加热灯的加热壳体，设置在加热壳体和处理室之间的窗口， 传递处理室的密封性并传输要转移到衬底的辐射能，测量在处理室中的衬底处产生的波长并将波长转换成衬底测量能量的第一高温计，测量所产生的波长的第二高温计 在窗口处，将波长转换成窗口测量能量; 以及加热控制器，其补偿基板测量能量中的窗口测量能量，由此计算基板本身的温度，并且使用所计算的基板本身的温度来控制加热灯。

公开(公告)号：US20150181649A1

公开(公告)日：2015-06-25

申请号：US14403575

申请日：2013-05-21

Applicant: AP SYSTEMS INC.

Inventor： Sang-Hyun Ji

IPC: H05B1/02 ,  G01J5/00 ,  H05B3/00

CPC classification number: H05B1/0233 ,  G01J5/0007 ,  G01J5/0044 ,  H05B3/0047

Abstract: The present invention relates to a substrate treatment apparatus and method which perform heat treatment on a substrate, and can accurately measure the temperature of the substrate even at a low temperature. An embodiment of the present invention includes a process chamber that has a substrate treatment space, a heating housing that contains a plurality of heating lamps for generating radiant energy, a window that is placed between the heating housing and the process chamber to maintain the air-tightness of the process chamber and transmit the radiant energy to be transferred to a substrate, a first pyrometer that measures a wavelength generated at the substrate in the process chamber, and converts the wavelength into substrate measurement energy, a second pyrometer that measures a wavelength generated at the window, and converts the wavelength into window measurement energy; and a heating controller that compensates for the window measurement energy in the substrate measurement energy, thereby calculating the temperature of the substrate itself, and uses the calculated temperature of the substrate itself to control the heating lamps.

Abstract translation: 本发明涉及对基板进行热处理的基板处理装置和方法，并且即使在低温也能够精确地测量基板的温度。 本发明的实施例包括具有基板处理空间的处理室，包含用于产生辐射能的多个加热灯的加热壳体，设置在加热壳体和处理室之间的窗口， 传递处理室的密封性并传输要转移到衬底的辐射能，测量在处理室中的衬底处产生的波长并将波长转换成衬底测量能量的第一高温计，测量所产生的波长的第二高温计 在窗口处，将波长转换成窗口测量能量; 以及加热控制器，其补偿基板测量能量中的窗口测量能量，由此计算基板本身的温度，并且使用所计算的基板本身的温度来控制加热灯。

公开(公告)号：US20130308928A1

公开(公告)日：2013-11-21

申请号：US13895331

申请日：2013-05-15

Applicant: AP SYSTEMS INC.

Inventor： Chang-Kyo KIM ,  Sung-Chul KIM ,  Chang-Min KWON ,  Ki-Nam KIM

IPC: H01L21/67

CPC classification number: H01L21/67115

Abstract: The present invention relates to a heater block and a substrate treatment apparatus, and more particularly to a heater block to perform heat treatment on a substrate and a substrate treatment apparatus having the same. According to embodiments of the present invention, it is provided a heater block for a substrate treatment apparatus having heating lamps on its one side to transfer heat to a target subjected to heat treatment, the heating lamps having different arrangement patterns in a plurality of regions on said one side.

Abstract translation: 本发明涉及一种加热器块和基板处理装置，更具体地涉及对基板进行热处理的加热器块和具有该加热块的基板处理装置。 根据本发明的实施例，提供了一种用于基板处理装置的加热器块，该基板处理装置的一侧具有加热灯，以将热量传递到经受热处理的目标，加热灯在多个区域中具有不同的布置图案 一方说

公开(公告)号：US20130294756A1

公开(公告)日：2013-11-07

申请号：US13886261

申请日：2013-05-02

Applicant: AP SYSTEMS INC.

Inventor： Il-Hwan LIM ,  Jang-Woo SHIM ,  Chul-Soo KIM ,  Seung-Ae CHOI

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  H05B3/0047

Abstract: The present invention relates to an apparatus for heat-treating a substrate, and more particularly to an apparatus for substrate treatment to perform a heat treatment of a substrate for a flat panel display panel.An apparatus for substrate treatment according to an embodiment of the present invention comprises a processing chamber having a substrate treatment space; a heating housing having a heating lamp that emits radiant energy and a reflecting block that reflects radiant energy emitted from the heating lamp; and a window that maintains a sealing between the processing chamber and the heating housing and transmits the radiant energy to a substrate.

Abstract translation: 本发明涉及一种用于对基板进行热处理的装置，更具体地涉及用于对平板显示面板进行基板的热处理的基板处理装置。 根据本发明的实施例的用于基板处理的装置包括具有基板处理空间的处理室; 具有发射辐射能的加热灯的加热壳体和反射从加热灯发出的辐射能的反射块; 以及在处理室和加热壳体之间保持密封并将辐射能传递到基板的窗口。

公开(公告)号：US20180205018A1

公开(公告)日：2018-07-19

申请号：US15744029

申请日：2016-08-04

Applicant: AP SYSTEMS INC.

Inventor： Jong-Kab PARK ,  Bo-Ram KIM ,  Jun-Gyu HUR ,  Doh-Hoon KIM

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/04 ,  G03F7/30 ,  B23K26/364 ,  B23K26/082 ,  B23K26/0622

Abstract: The present invention discloses a method of manufacturing a shadow mask, wherein hybrid processing is used to form a mask pattern on the shadow mask, the method includes: forming a laser-processed pattern by irradiating a laser beam from above a base; and forming a wet-etched pattern that continues from the laser-processing pattern, by performing wet etching from above the base or from below the base on which the laser-processed pattern is formed. The present invention uses hybrid processing including wet etching and laser processing for manufacturing a shadow mask. The method has an effect on solving the productivity degradation of the conventional laser processing and provides a shadow mask with high quality using wet etching.

公开(公告)号：US20170071053A1

公开(公告)日：2017-03-09

申请号：US15220387

申请日：2016-07-26

Applicant: AP SYSTEMS INC.

Inventor： Jae Seung LEE ,  Chang Won LEE

IPC: H05H1/46

CPC classification number: H05H1/46 ,  H05H2001/4645 ,  H05H2001/4682

Abstract: The present disclosure relates to a device for feeding high-frequency power and a substrate processing apparatus having the same, and more particularly, to a device for feeding high-frequency power, in which a matcher is integrated with a power divider and a substrate processing apparatus having the same. The device for feeding high-frequency power includes an input unit into which high-frequency power is inputted from a high-frequency power source, a plurality of output units in which the high-frequency power inputted into the input unit is divided and outputted, a plurality of variable capacitors connected between a division point at which the high-frequency power is divided and the plurality of output units, respectively, and a second variable capacitor connected between the input unit and the division point.

Abstract translation: 本发明涉及一种用于馈送高频电源的装置和具有该装置的基板处理装置，更具体地，涉及一种用于馈送高频电源的装置，其中匹配器与功率分配器和基板处理 具有相同的装置。 用于馈送高频电力的装置包括从高频电源输入高频电力的输入单元，分配输出输入到输入单元的高频电力的多个输出单元， 多个可变电容器分别连接在高频电源被分割的分割点和多个输出单元之间，以及连接在输入单元和分割点之间的第二可变电容器。