Abstract:
Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.
Abstract:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
Abstract:
Embodiments of making an energy harvesting device are described. In one embodiment, a case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.
Abstract:
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
Abstract:
Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.
Abstract:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
Abstract:
Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.
Abstract:
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
Abstract:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
Abstract:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.