公开(公告)号：US06603151B2

公开(公告)日：2003-08-05

申请号：US10085584

申请日：2002-03-01

申请人： Ming-Der Lin ,  Chang-Da Tsai ,  Kwang-Ru Wang ,  Ching-Liang Kao ,  Wen-Liang Tseng ,  Chia-Chen Chang

发明人： Ming-Der Lin ,  Chang-Da Tsai ,  Kwang-Ru Wang ,  Ching-Liang Kao ,  Wen-Liang Tseng ,  Chia-Chen Chang

IPC分类号： H01L310312

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

公开(公告)号：US08592234B2

公开(公告)日：2013-11-26

申请号：US13594948

申请日：2012-08-27

申请人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

发明人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

IPC分类号： H01L21/00

CPC分类号： H01L33/0079 ,  H01L33/30 ,  H01L33/385 ,  H01L33/40 ,  H01L33/405 ,  H01L33/483 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/00012

摘要： A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology.

摘要翻译： 发光二极管包括永久性基板，其具有形成在永磁基板的第一表面上的芯片保持空间; 绝缘层和金属层，其依次形成在永久性基板的第一表面和芯片保持空间上，其中金属层包括第一区域和第二区域彼此不接触; 芯片，其具有附接在所述芯片保持空间的底部上的第一表面，与所述金属层的所述第一区域接触; 填充在芯片保持空间和芯片之间的填充结构; 以及形成在所述芯片的第二表面上的第一电极。 芯片包括发光区域，并且通过使用芯片接合技术来实现金属层的第一区域和发光区域之间的电连接。

公开(公告)号：US20120322180A1

公开(公告)日：2012-12-20

申请号：US13594948

申请日：2012-08-27

申请人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

发明人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

IPC分类号： H01L33/60

CPC分类号： H01L33/0079 ,  H01L33/30 ,  H01L33/385 ,  H01L33/40 ,  H01L33/405 ,  H01L33/483 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/00012

摘要： A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology.

摘要翻译： 发光二极管包括永久性基板，其具有形成在永磁基板的第一表面上的芯片保持空间; 绝缘层和金属层，其依次形成在永久性基板的第一表面和芯片保持空间上，其中金属层包括第一区域和第二区域彼此不接触; 芯片，其具有附接在所述芯片保持空间的底部上的第一表面，与所述金属层的所述第一区域接触; 填充在芯片保持空间和芯片之间的填充结构; 以及形成在所述芯片的第二表面上的第一电极。 芯片包括发光区域，并且通过使用芯片接合技术来实现金属层的第一区域和发光区域之间的电连接。

公开(公告)号：US06809341B2

公开(公告)日：2004-10-26

申请号：US10384619

申请日：2003-03-11

申请人： Jung-Kuei Hsu ,  Hsueh-Chih Yu ,  Hung-Yuan Lu ,  Chui-Chuan Chang ,  Kwang-Ru Wang ,  Chang-Da Tsai ,  San Bao Lin ,  Yung-Chiang Hwang ,  Ming-Der Lin

发明人： Jung-Kuei Hsu ,  Hsueh-Chih Yu ,  Hung-Yuan Lu ,  Chui-Chuan Chang ,  Kwang-Ru Wang ,  Chang-Da Tsai ,  San Bao Lin ,  Yung-Chiang Hwang ,  Ming-Der Lin

IPC分类号： H01L2715

CPC分类号： H01L33/0079 ,  H01L21/42 ,  H01L33/14 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405

摘要： A light-emitting diode with enhanced brightness and a method for fabricating the diode is provided. The light-emitting diode includes an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of windows formed in a highly doped layer. At least one conductive contact is formed on the bottom surface of the highly doped layer. A transparent material layer is formed in the windows. An adhesion layer is formed between the transparent material layer and a permanent substrate. A bottom electrode is formed on the bottom surface of the permanent substrate and an opposed electrode is formed on the top surface of the epitaxial LED structure.

摘要翻译： 提供了具有增强亮度的发光二极管和制造二极管的方法。 发光二极管包括具有至少一个发光有源层的外延LED结构，其具有形成在高掺杂层中的多个窗口。 在高掺杂层的底表面上形成至少一个导电接触。 在窗户中形成透明材料层。 在透明材料层和永久性基板之间形成粘附层。 在永久性基板的底表面上形成底部电极，并且在外延LED结构的顶表面上形成相对的电极。

公开(公告)号：US06686218B2

公开(公告)日：2004-02-03

申请号：US10342185

申请日：2003-01-15

申请人： Ming-Der Lin ,  Chang-Da Tsai ,  Kwang-Ru Wang ,  Ching-Liang Kao ,  Wen-Liang Tseng ,  Chia-Chen Chang

发明人： Ming-Der Lin ,  Chang-Da Tsai ,  Kwang-Ru Wang ,  Ching-Liang Kao ,  Wen-Liang Tseng ,  Chia-Chen Chang

IPC分类号： H01L2100

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.

摘要翻译： 公开了一种用于封装电光装置的方法。 在模具载体和电光器件之间添加透明材料，从而可以提取从电光器件的背面发射的光。 此外，在模具载体上形成光反射层，并且设计光反射层的图案以防止光被反射到有源层，反射再次降低发光效率。