摘要:
A frequency doubler receiving an in-phase oscillating signal and an inverse oscillating signal and generating an output signal oscillating at a multiplied frequency, accordingly. The frequency doubler has a first transistor, a second transistor, a first inductor and a second inductor. A first terminal of the first transistor and a first terminal of the second transistor are at a common voltage. The frequency doubler receives the in-phase oscillating signal and the inverse oscillating signal via control terminals of the first and second transistors. The first and second inductors couple a second terminal of the first transistor and a second terminal of the second transistor to an output terminal of the frequency doubler, respectively. The first and second inductors may be separate inductance devices or, in another case, be implemented by a symmetric inductor.
摘要:
A voltage controlled oscillator (VCO) includes a voltage controlled current source (VCCS), a negative resistance circuit (NRC), a first transformer, a second transformer, a first transistor and a second transistor. A current terminal of the VCCS receives a control voltage. First terminals of first and second current paths in the NRC are coupled to a current terminal of the VCCS. Primary sides of the first and the second transformers are respectively coupled to second terminals of the first and the second current paths. Secondary sides of the first and the second transformers are first and second output terminals of the VCO, respectively. First terminals of the first and the second transistor are respectively coupled to the secondary sides of the first and the second transformers. Control terminals of the first and the second transformers are respectively coupled to the primary sides of the first and the second transformers.
摘要:
An integrated circuit structure includes a substrate and a germanium-containing semiconductor fin over the substrate. The germanium-containing semiconductor fin has an upper portion having a first width, and a neck region under the upper portion and having a second width smaller than the first width.
摘要:
A method for producing a SiGe stressor with high Ge concentration is provided. The method includes providing a semiconductor substrate with a source area, a drain area, and a channel in between; depositing the first SiGe film layer on the source area and/or the drain area; performing a low temperature thermal oxidation, e.g., a high water vapor pressure wet oxidation, to form an oxide layer at the top of the first SiGe layer and to form the second SiGe film layer with high Ge percentage at the bottom of the first SiGe film layer without Ge diffusion into the semiconductor substrate; performing a thermal diffusion to form the SiGe stressor from the second SiGe film layer, wherein the SiGe stressor provides uniaxial compressive strain on the channel; and removing the oxide layer. A Si cap layer can be deposited on the first SiGe film layer prior to performing oxidation.
摘要:
A voltage-controlled oscillator (VCO) module including a first VCO unit, a second VCO unit, and a matching circuit is provided. The first VCO unit includes a first terminal and a second terminal and generates a first oscillator signal. The second VCO unit is coupled to the first VCO unit and generates a second oscillator signal. The matching circuit is coupled between the first VCO unit and second VCO unit. The matching circuit includes a plurality of inductor modules respectively coupled between the first terminal of the first VCO unit and the second VCO unit, between the first terminal and the second terminal of the first VCO unit, and between the second terminal of the first VCO unit and the second VCO unit. Furthermore, a method for generating oscillator signals is also provided.
摘要:
A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a conformal deposition method to fill a dielectric material into the opening; performing a first treatment on the dielectric material, wherein the first treatment provides an energy high enough for breaking bonds in the dielectric material; and performing a steam anneal on the dielectric material.
摘要:
A parking device for a bicycle includes a main control unit (11), a parking unit (12) mounted on the main control unit, and a locking member (13) movably mounted in the main control unit and extending into the parking unit. Thus, the parking device can lock the bicycle (20) so as to provide a burglarproof effect. In addition, the bicycle is locked by the parking device so that the user needs not to carry a lock to prevent from causing a burden to the user. Further, the parking device locks the bicycle easily and quickly to facilitate the user locking and unlocking the bicycle.
摘要:
A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a conformal deposition method to fill a dielectric material into the opening; performing a first treatment on the dielectric material, wherein the first treatment provides an energy high enough for breaking bonds in the dielectric material; and performing a steam anneal on the dielectric material.
摘要:
A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a conformal deposition method to fill a dielectric material into the opening; performing a first treatment on the dielectric material, wherein the first treatment provides an energy high enough for breaking bonds in the dielectric material; and performing a steam anneal on the dielectric material.
摘要:
A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a conformal deposition method to fill a dielectric material into the opening; performing a first treatment on the dielectric material, wherein the first treatment provides an energy high enough for breaking bonds in the dielectric material; and performing a steam anneal on the dielectric material.