Semiconductor devices with extended active regions
    11.
    发明授权
    Semiconductor devices with extended active regions 有权
    半导体器件具有扩展的有源区

    公开(公告)号:US08062953B2

    公开(公告)日:2011-11-22

    申请号:US12182421

    申请日:2008-07-30

    Abstract: A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.

    Abstract translation: 在半导体层中和半导体层上实现制造半导体器件的方法。 在第一有效区域附近形成沟槽。 沟槽填充绝缘材料。 掩模特征形成在沟槽的中心部分上,以在掩蔽特征的第一侧和第一有效区域之间露出沟槽的第一侧。 蚀刻到沟槽的第一侧的步骤在沟槽中留下第一凹槽。 在第一凹槽中生长第一外延区域以使第一有源区域延伸以包括第一凹部,从而形成延伸的第一有源区域。

    Transducer structure for generating uniform and focused ultrasonic beams
and applications thereof
    12.
    发明授权
    Transducer structure for generating uniform and focused ultrasonic beams and applications thereof 失效
    用于产生均匀和聚焦的超声波束的传感器结构及其应用

    公开(公告)号:US4431936A

    公开(公告)日:1984-02-14

    申请号:US350020

    申请日:1982-02-18

    Abstract: Transducer structures for use in volume flow measurements which generate a first uniform beam and a second focused beam within the uniform beam. The transducer may include concentric elements, a linear array, or combinations thereof. In a two element concentric array, a central disc generates a uniform beam and a peripheral annular element having a lens thereon defines a second focused beam within the first beam. In a linear array, a plurality of juxtaposed linear elements define a scan surface, and a segmented element within the linear element array defines a focused reference sample volume within the scanned surface. A concentric array having a plurality of annular elements is driven with amplitude weighting of each element, in accordance with a Fourier-Bessel approximation to the desired beam pattern, thereby electronically achieving ultrasonic beam width control.

    SEMICONDUCTOR WAFER HAVING SCRIBE LANE ALIGNMENT MARKS FOR REDUCING CRACK PROPAGATION
    13.
    发明申请
    SEMICONDUCTOR WAFER HAVING SCRIBE LANE ALIGNMENT MARKS FOR REDUCING CRACK PROPAGATION 有权
    具有用于减少裂纹扩展的可选择的对准标记的半导体波形

    公开(公告)号:US20110089581A1

    公开(公告)日:2011-04-21

    申请号:US12581549

    申请日:2009-10-19

    Abstract: A wafer including at least a first die and at least a second die, wherein the first die and the second die are separated from each other by an area located between the first die and the second die, is provided. The wafer further includes an alignment mark group used for aligning the wafer to a tool used for patterning the wafer. The alignment mark group is located entirely within the area between the first die and the second die and the alignment mark group includes a plurality of alignment lines, and wherein each line of the plurality of alignment lines is formed using a plurality of segments separated from each other by a plurality of gaps filled with an insulating material.

    Abstract translation: 提供包括至少第一管芯和至少第二管芯的晶片,其中所述第一管芯和所述第二管芯彼此分开位于所述第一管芯和所述第二管芯之间的区域。 晶片还包括用于将晶片对准用于图案化晶片的工具的对准标记组。 对准标记组完全位于第一管芯和第二管芯之间的区域内,并且对准标记组包括多个对准线,并且其中多个对准线中的每条线使用与每个对准线分离的多个段形成 另外由填充绝缘材料的多个间隙。

    SEMICONDUCTOR DEVICES WITH EXTENDED ACTIVE REGIONS
    14.
    发明申请
    SEMICONDUCTOR DEVICES WITH EXTENDED ACTIVE REGIONS 有权
    具有扩展活动区域的半导体器件

    公开(公告)号:US20100025805A1

    公开(公告)日:2010-02-04

    申请号:US12182421

    申请日:2008-07-30

    Abstract: A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.

    Abstract translation: 在半导体层中和半导体层上实现制造半导体器件的方法。 在第一有效区域附近形成沟槽。 沟槽填充绝缘材料。 掩模特征形成在沟槽的中心部分上,以在掩蔽特征的第一侧和第一有效区域之间露出沟槽的第一侧。 蚀刻到沟槽的第一侧的步骤在沟槽中留下第一凹槽。 在第一凹槽中生长第一外延区域以使第一有源区域延伸以包括第一凹部,从而形成延伸的第一有源区域。

    Dual silicide semiconductor fabrication process
    15.
    发明申请
    Dual silicide semiconductor fabrication process 有权
    双硅化物半导体制造工艺

    公开(公告)号:US20070048985A1

    公开(公告)日:2007-03-01

    申请号:US11213470

    申请日:2005-08-26

    CPC classification number: H01L29/66507

    Abstract: A semiconductor fabrication process includes forming a gate stack overlying semiconductor substrate. Source/drain regions are formed in the substrate laterally aligned to the gate stack. A hard mask is formed overlying a gate electrode of the gate stack. A first silicide is then formed selectively over the source/drain regions. After removing the hard mask, a second silicide is selectively formed on the gate electrode. The first silicide and the second silicide are different. Forming the gate stack may include forming a gate dielectric on the semiconductor substrate and a polysilicon gate electrode on the gate dielectric. The gate electrode may have a line width of less than 40 nm. Forming the second silicide may include forming nickel silicide in upper portions of the gate electrode.

    Abstract translation: 半导体制造工艺包括形成覆盖半导体衬底的栅叠层。 源极/漏极区域形成在与栅极叠层横向对准的衬底中。 形成覆盖栅极堆叠的栅电极的硬掩模。 然后在源极/漏极区域上选择性地形成第一硅化物。 在去除硬掩模之后,在栅电极上选择性地形成第二硅化物。 第一硅化物和第二硅化物不同。 形成栅极堆叠可以包括在半导体衬底上形成栅极电介质和在栅极电介质上形成多晶硅栅电极。 栅电极的线宽可以小于40nm。 形成第二硅化物可以包括在栅电极的上部形成硅化镍。

    Process for producing and inspecting a lithographic reticle and
fabricating semiconductor devices using same
    17.
    发明授权
    Process for producing and inspecting a lithographic reticle and fabricating semiconductor devices using same 失效
    用于制造和检查光刻掩模版并使用其制造半导体器件的方法

    公开(公告)号:US5849440A

    公开(公告)日:1998-12-15

    申请号:US792670

    申请日:1997-01-29

    CPC classification number: G03F7/705 G03F1/84 G03F7/70433 G03F7/70633

    Abstract: A process for fabricating a semiconductor device includes the formation of a lithographic reticle (20) having a lithographic pattern (18) overlying a reticle substrate (10). In one embodiment, a reticle inspection database incorporates altered resolution assisting features (30,32) to inspect the lithographic pattern (18). The dimensional difference between the reticle inspection database and the lithographic reticle is substantially equal to the process bias realized during reticle fabrication. Inspection of the lithographic reticle (20) using a reticle inspection database containing altered resolution assisting features reduces the false detection of defects and provides increased sensitivity in the reticle inspection process.

    Abstract translation: 一种用于制造半导体器件的工艺包括形成具有覆盖在掩模版衬底(10)上的平版印刷图案(18)的光刻掩模版(20)。 在一个实施例中,掩模版检查数据库包含改变的分辨率辅助特征(30,32)以检查光刻图案(18)。 标线检查数据库和光刻掩模版之间的尺寸差异基本上等于在掩模版制造期间实现的工艺偏差。 使用包含改变的分辨率辅助特征的掩模版检查数据库对光刻掩模版(20)的检查减少了缺陷的错误检测并且在掩模版检查过程中提供了增加的灵敏度。

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