Abstract:
A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.
Abstract:
Transducer structures for use in volume flow measurements which generate a first uniform beam and a second focused beam within the uniform beam. The transducer may include concentric elements, a linear array, or combinations thereof. In a two element concentric array, a central disc generates a uniform beam and a peripheral annular element having a lens thereon defines a second focused beam within the first beam. In a linear array, a plurality of juxtaposed linear elements define a scan surface, and a segmented element within the linear element array defines a focused reference sample volume within the scanned surface. A concentric array having a plurality of annular elements is driven with amplitude weighting of each element, in accordance with a Fourier-Bessel approximation to the desired beam pattern, thereby electronically achieving ultrasonic beam width control.
Abstract:
A wafer including at least a first die and at least a second die, wherein the first die and the second die are separated from each other by an area located between the first die and the second die, is provided. The wafer further includes an alignment mark group used for aligning the wafer to a tool used for patterning the wafer. The alignment mark group is located entirely within the area between the first die and the second die and the alignment mark group includes a plurality of alignment lines, and wherein each line of the plurality of alignment lines is formed using a plurality of segments separated from each other by a plurality of gaps filled with an insulating material.
Abstract:
A method of making a semiconductor device is achieved in and over a semiconductor layer. A trench is formed adjacent to a first active area. The trench is filled with insulating material. A masking feature is formed over a center portion of the trench to expose a first side of the trench between a first side of the masking feature and the first active area. A step of etching into the first side of the trench leaves a first recess in the trench. A first epitaxial region is grown in the first recess to extend the first active area to include the first recess and thereby form an extended first active region.
Abstract:
A semiconductor fabrication process includes forming a gate stack overlying semiconductor substrate. Source/drain regions are formed in the substrate laterally aligned to the gate stack. A hard mask is formed overlying a gate electrode of the gate stack. A first silicide is then formed selectively over the source/drain regions. After removing the hard mask, a second silicide is selectively formed on the gate electrode. The first silicide and the second silicide are different. Forming the gate stack may include forming a gate dielectric on the semiconductor substrate and a polysilicon gate electrode on the gate dielectric. The gate electrode may have a line width of less than 40 nm. Forming the second silicide may include forming nickel silicide in upper portions of the gate electrode.
Abstract:
A method of forming low stack height transistors having controllable linewidth in an integrated circuit without channeling is disclosed. A disposable hardmask of doped glass is utilized to define the gate and subsequently protect the gate (and the underlying substrate) during ion implantation which forms the source and drains. An anti-reflective coating helps protect against reflective gate notching. A variety of silicided and non-silicided) structures may be formed.
Abstract:
A process for fabricating a semiconductor device includes the formation of a lithographic reticle (20) having a lithographic pattern (18) overlying a reticle substrate (10). In one embodiment, a reticle inspection database incorporates altered resolution assisting features (30,32) to inspect the lithographic pattern (18). The dimensional difference between the reticle inspection database and the lithographic reticle is substantially equal to the process bias realized during reticle fabrication. Inspection of the lithographic reticle (20) using a reticle inspection database containing altered resolution assisting features reduces the false detection of defects and provides increased sensitivity in the reticle inspection process.