Abstract:
A method of producing a security element for electronically securing an object, a device for producing the security element and the security element itself form aspects of the present invention. The security element includes a strip element embedded in sheathing. The sheathing has a melting temperature below that of the strip element. The method has associated steps and the device has associated elements for producing the security element from the strip element and sheathing. In each aspect, the ends of the strip element and sheathing are heated and the sheathing ends pulled to seal the strip element in the sheathing.
Abstract:
This invention concerns a process and device for producing anti-theft elements for electronic anti-theft securing of articles. The anti-theft elements are made of at least two layers. The invention also concerns a strip material made using the process. The aim of this invention is to present a simple, economical process, a corresponding device for producing a strip material and a strip material for securing articles electronically which is made by the process. As for the process of this invention, the aim is achieved in that segments of a predetermined length of a second web of material are fed and applied on a first continuous web of material perpendicular to the running direction said first web of material.
Abstract:
The present invention relates to an apparatus for manufacturing labels for electronic article surveillance, comprising a label repositioner which by means of a first dispensing edge removes the labels from a carrier web and by means of a second dispensing edge places them in a predetermined position on the same or a different carrier web, and an applicator unit for applying security elements to the carrier web. The applicator unit is constructed to apply the security elements continuously to the carrier web, whereby at least one security element is allocated to each label or to any number of labels.
Abstract:
A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.
Abstract:
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
Abstract:
A method of making UHF antennas for security tag and antennas thereby. A web of electrically conductive material having a thickness in the range of approximately 5 to approximately 50 microns is releasably secured to a carrier web using a releasably securable adhesive substantially coextensive with the conductive web. A series of antennas of a desired shape are die-cut into the conductive web, but not into the carrier web. The portion of the conductive web not making up the antennas is in the form of scrap and is removed, thereby leaving the series of antennas releasably secured to the carrier sheet. The antennas are arranged to be removed from the carrier sheet, whereupon the releasably securable adhesive is transferred to them, so that they may be subsequently secured to other components to form a security tag.
Abstract:
A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into the poly sheet at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction. The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips with the embedded wire and form a protected RFID circuit.
Abstract:
The invention is directed to a security tag (7′) for protecting an article (1) against theft, with an electronically detectable first security element (3) and a covering layer (4) covering said first security element completely. The covering layer (4) is covered completely with a label (6) made of tearable material, which on its side facing the covering layer (4) is provided with an adhesive whose bonding strength is at least somewhat lower than that of the adhesive applied to the covering layer (4). Arranged between the covering layer (4) and the label (6) is a second security element (5), which overlaps the covering layer (4) at least in part and is provided on its side facing the covering layer (4) with an adhesive whose bonding strength is somewhat greater than that of the adhesive applied to the label (6). The covering layer (4) and the second security element (5) are completely covered by the label (6). With this construction of the security tag (7) it is ensured that a removal of the security elements (3, 5) from the secured article (1) is not possible at all or only with great difficulty.
Abstract:
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
Abstract:
The invention is directed to a security tag (7′) for protecting an article (1) against theft, with an electronically detectable first security element (3) and a covering layer (4) covering said first security element completely. The covering layer (4) is covered completely with a label (6) made of tearable material, which on its side facing the covering layer (4) is provided with an adhesive whose bonding strength is at least somewhat lower than that of the adhesive applied to the covering layer (4). Arranged between the covering layer (4) and the label (6) is a second security element (5), which overlaps the covering layer (4) at least in part and is provided on its side facing the covering layer (4) with an adhesive whose bonding strength is somewhat greater than that of the adhesive applied to the label (6). The covering layer (4) and the second security element (5) are completely covered by the label (6). With this construction of the security tag (7) it is ensured that a removal of the security elements (3, 5) from the secured article (1) is not possible at all or only with great difficulty.