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    Device for making an in-mold circuit
    5.
    发明授权
    Device for making an in-mold circuit 失效
    用于制造模内电路的装置

    公开(公告)号：US07621043B2

    公开(公告)日：2009-11-24

    申请号：US11554237

    申请日：2006-10-30

    Applicant: Andre Cote ,  Detlef Duschek

    Inventor： Andre Cote ,  Detlef Duschek

    IPC: H05K3/07

    CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  G08B13/244 ,  H01L21/56 ,  H01L21/67132 ,  H01L24/86 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/7965 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/14 ,  H01L2924/00

    Abstract: A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

    Abstract translation: 将在机器方向上连续移动的聚酯片材加热至刚好低于其玻璃热温度的温度，以使该聚合物具有延展性。 电路（例如，RFID芯片，EAS芯片，应答器，IC）被放置在聚合物片材上并且嵌入到多片材中，优选地具有耐热柔软（例如橡胶）辊，其将电路压入聚合物而不破坏 电路。 可以将导电条或线施加到聚合物片上或其上，以与电路的连接点（例如，导电凸块）对齐，以与电路导电连通。 优选地，导电条或线被切割以形成在导线的切割部分之间不导电的间隙，以避免电路的短路和/或允许导电条或线作为电路的天线发挥作用，并因此形成芯片 表带或标签。 因此，聚酰胺片为电路和电线提供了保护性的子宫或屏蔽。

    ROTARY CHIP ATTACH
    6.
    发明申请
    ROTARY CHIP ATTACH 有权
    旋转芯片附件

    公开(公告)号：US20090269882A1

    公开(公告)日：2009-10-29

    申请号：US12500373

    申请日：2009-07-09

    Applicant: Andre Cote ,  Detlef Duschek

    Inventor： Andre Cote ,  Detlef Duschek

    IPC: H01L21/50

    CPC classification number: H01L21/67144 ,  H01L24/95 ,  H01L2224/75822 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    Abstract: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

    Abstract translation: 旋转芯片连接工艺和制造方法在旋转工艺中从晶片获取芯片（例如，集成电路（IC））。 具有定位单元的芯片晶片被放置在链轮的顶部上，该轮链轮从晶片直接拾取IC并将它们以半连续的逐步运动移动到将接受IC的网。 链轮包括优选地与典型的拾放机器人系统中使用的相同类型的切屑，其中真空头适合于根据需要刺穿晶片平膜（如果需要），抓斗和IC以及放置和IC。 该定位系统将IC的放置位置保持在纸幅上的准确位置，可以使多个链轮轮放置单元在适当位置上连续移动。

    Process for making UHF antennas for EAS and RFID tags and antennas made thereby
    7.
    发明授权
    Process for making UHF antennas for EAS and RFID tags and antennas made thereby 有权
    用于制造用于EAS和RFID标签的UHF天线以及由此制造的天线的过程

    公开(公告)号：US07497004B2

    公开(公告)日：2009-03-03

    申请号：US11400893

    申请日：2006-04-10

    Applicant: Andre Cote ,  Detlef Duschek

    Inventor： Andre Cote ,  Detlef Duschek

    IPC: H01P11/00

    CPC classification number: H01Q1/2225 ,  B32B37/12 ,  B32B38/10 ,  B32B2519/02 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

    Abstract: A method of making UHF antennas for security tag and antennas thereby. A web of electrically conductive material having a thickness in the range of approximately 5 to approximately 50 microns is releasably secured to a carrier web using a releasably securable adhesive substantially coextensive with the conductive web. A series of antennas of a desired shape are die-cut into the conductive web, but not into the carrier web. The portion of the conductive web not making up the antennas is in the form of scrap and is removed, thereby leaving the series of antennas releasably secured to the carrier sheet. The antennas are arranged to be removed from the carrier sheet, whereupon the releasably securable adhesive is transferred to them, so that they may be subsequently secured to other components to form a security tag.

    Abstract translation: 从而制造用于安全标签和天线的UHF天线的方法。 具有大约5至大约50微米范围内的厚度的导电材料的网状物可释放地固定到载体网，使用基本上与导电性网共同延伸的可释放地固化的粘合剂。 所需形状的一系列天线被切割成导电网，但不会进入载体网。 不构成天线的导电纤维网的部分是废料的形式，并被去除，从而使一系列天线可释放地固定在载体片上。 这些天线布置成从承载片上移除，于是将可释放地固定的粘合剂转移到它们上，使得它们随后可以被固定到其它部件上以形成安全标签。

    Rotary chip attach process
    9.
    发明授权
    Rotary chip attach process 有权
    旋转芯片连接过程

    公开(公告)号：US07820481B2

    公开(公告)日：2010-10-26

    申请号：US12500373

    申请日：2009-07-09

    Applicant: Andre Cote ,  Detlef Duschek

    Inventor： Andre Cote ,  Detlef Duschek

    IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC classification number: H01L21/67144 ,  H01L24/95 ,  H01L2224/75822 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    Abstract: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

    Abstract translation: 旋转芯片连接工艺和制造方法在旋转工艺中从晶片获取芯片（例如，集成电路（IC））。 具有定位单元的芯片晶片被放置在链轮的顶部上，该轮链轮从晶片直接拾取IC并将其以半连续的逐步运动移动到将接受IC的网。 链轮包括优选地与典型的拾放机器人系统中使用的相同类型的切屑，其中真空头适合于根据需要刺穿晶片平膜（如果需要），抓斗和IC以及放置和IC。 该定位系统将IC的放置位置保持在纸幅上的准确位置，可以使多个链轮轮放置单元在位置上连续移动。

    Process for making UHF antennas for EAS and RFID tags and antennas made thereby
    10.
    发明申请
    Process for making UHF antennas for EAS and RFID tags and antennas made thereby 有权
    用于制造用于EAS和RFID标签的UHF天线以及由此制造的天线的过程

    公开(公告)号：US20070234553A1

    公开(公告)日：2007-10-11

    申请号：US11400893

    申请日：2006-04-10

    Applicant: Andre Cote ,  Detlef Duschek

    Inventor： Andre Cote ,  Detlef Duschek

    IPC: H01P11/00

    CPC classification number: H01Q1/2225 ,  B32B37/12 ,  B32B38/10 ,  B32B2519/02 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

    Abstract: A method of making UHF antennas for security tag and antennas thereby. A web of electrically conductive material having a thickness in the range of approximately 5 to approximately 50 microns is releasably secured to a carrier web using a releasably securable adhesive substantially coextensive with the conductive web. A series of antennas of a desired shape are die-cut into the conductive web, but not into the carrier web. The portion of the conductive web not making up the antennas is in the form of scrap and is removed, thereby leaving the series of antennas releasably secured to the carrier sheet. The antennas are arranged to be removed from the carrier sheet, whereupon the releasably securable adhesive is transferred to them, so that they may be subsequently secured to other components to form a security tag.

    Abstract translation: 从而制造用于安全标签和天线的UHF天线的方法。 具有大约5至大约50微米范围内的厚度的导电材料的网状物可释放地固定到载体网，使用基本上与导电性网共同延伸的可释放地固化的粘合剂。 所需形状的一系列天线被切割成导电网，但不会进入载体网。 不构成天线的导电纤维网的部分是废料的形式，并被去除，从而使一系列天线可释放地固定在载体片上。 这些天线布置成从承载片上移除，于是将可释放地固定的粘合剂转移到它们上，使得它们随后可以被固定到其它部件上以形成安全标签。

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