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49 条记录 (耗时 0.019 秒)

    Method and an apparatus to adjust duty cycle for voltage supply regulation
    11.
    发明授权
    Method and an apparatus to adjust duty cycle for voltage supply regulation 有权
    调整电压调节占空比的方法和装置

    公开(公告)号：US07405551B2

    公开(公告)日：2008-07-29

    申请号：US11430788

    申请日：2006-05-08

    申请人： Edward A. Burton ,  Robert Greiner ,  Anant Deval ,  Douglas R. Huard

    发明人： Edward A. Burton ,  Robert Greiner ,  Anant Deval ,  Douglas R. Huard

    IPC分类号： G05F5/00

    CPC分类号： H02M3/156 ,  H02M2001/0022

    摘要： A method and an apparatus to regulate voltage supply have been disclosed. In one embodiment, the apparatus includes a power converter block to generate an output voltage from an input voltage and a voltage regulator controller coupled to the power converter block to input at least one time-modulated signal to the power converter block, the at least one time-modulated signal having a duty cycle, the voltage regulator controller including a counter having an increment value substantially proportional to the input voltage, wherein the counter is used to adjust the duty cycle of the at least one time-modulated signal. Other embodiments have been claimed and described.

    摘要翻译： 已经公开了一种用于调节电压供应的方法和装置。 在一个实施例中，该装置包括功率转换器块，用于从输入电压产生输出电压，耦合到功率转换器模块的电压调节器控制器将至少一个时间调制信号输入到功率转换器模块，该至少一个 具有占空比的时间调制信号，所述电压调节器控制器包括具有与所述输入电压基本成比例的增量值的计数器，其中所述计数器用于调整所述至少一个时间调制信号的占空比。 已经要求和描述了其它实施例。

    Downlocking and/or upgrading integrated circuit
    13.
    发明授权
    Downlocking and/or upgrading integrated circuit 失效
    下锁和/或升级集成电路

    公开(公告)号：US07196500B2

    公开(公告)日：2007-03-27

    申请号：US10750584

    申请日：2003-12-31

    申请人： Edward A. Burton

    发明人： Edward A. Burton

    IPC分类号： G05F1/40 ,  H02M1/00

    CPC分类号： G06F11/24

    摘要： An integrated circuit distribution and upgrade method, and systems/devices to practice various aspect of the method that is for reducing power consumption and operating the integrated circuit with a constituent operating circuit and a proxy circuit near the lower end of the targeted voltage range.

    摘要翻译： 一种集成电路分配和升级方法，以及用于实现方法的各个方面的系统/装置，其用于降低功耗并且利用在目标电压范围的下端附近的组成工作电路和代理电路来操作集成电路。

    Regulating voltage applied to an integrated circuit and proxy frequency
    14.
    发明授权
    Regulating voltage applied to an integrated circuit and proxy frequency 有权
    调节施加到集成电路和代理频率的电压

    公开(公告)号：US07098635B2

    公开(公告)日：2006-08-29

    申请号：US10750585

    申请日：2003-12-31

    申请人： Edward A. Burton

    发明人： Edward A. Burton

    IPC分类号： G05F1/40 ,  H02M1/00

    CPC分类号： G06F1/26

    摘要： An apparatus or a system having an integrated circuit (IC) or a microprocessor with an operational circuit, a proxy circuit and a voltage regulator. In various embodiments, the operational circuit operates at a first frequency, and the proxy circuit outputs a periodic signal at a second frequency reflective of a potential of the first frequency. The periodic signal is provided to the voltage regulator controller, which conditionally regulates voltage applied to the IC or microprocessor, based at least in part on the second frequency.

    摘要翻译： 具有集成电路（IC）或具有操作电路，代理电路和电压调节器的微处理器的装置或系统。 在各种实施例中，操作电路以第一频率工作，代理电路以反映第一频率的电位的第二频率输出周期性信号。 周期性信号被提供给电压调节器控制器，其至少部分地基于第二频率有条件地调节施加到IC或微处理器的电压。

    Suspended inductor microelectronic structures
    16.
    发明授权
    Suspended inductor microelectronic structures 有权
    悬浮电感微电子结构

    公开(公告)号：US09526175B2

    公开(公告)日：2016-12-20

    申请号：US13996830

    申请日：2012-04-24

    申请人： Mathew J. Manusharow ,  Mihir K. Roy ,  Kaladhar Radhakrishnan ,  Debendra Mallik ,  Edward A. Burton

    发明人： Mathew J. Manusharow ,  Mihir K. Roy ,  Kaladhar Radhakrishnan ,  Debendra Mallik ,  Edward A. Burton

    IPC分类号： H05K1/18 ,  H05K1/14 ,  H01L23/13 ,  H05K1/11 ,  H01L23/50

    CPC分类号： H05K1/183 ,  H01L23/13 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/1003

    摘要： The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

    摘要翻译： 本说明书涉及制造微电子结构的领域。 微电子结构可以包括具有开口的微电子衬底，其中开口可以通过微电子衬底形成，或者可以是在微电子衬底中形成的凹部。 微电子封装可以附接到微电子衬底，其中微电子封装可以包括具有第一表面和相对的第二表面的插入件。 微电子器件可以附接到插入器第一表面，并且插入器可以通过插入器第一表面附接到微电子衬底，使得微电子器件延伸到开口中。 至少一个次级微电子器件可以附接到插入件第二表面。

    SUSPENDED INDUCTOR MICROELECTRONIC STRUCTURES
    19.
    发明申请
    SUSPENDED INDUCTOR MICROELECTRONIC STRUCTURES 有权
    悬挂电感器微电子结构

    公开(公告)号：US20140251669A1

    公开(公告)日：2014-09-11

    申请号：US13996830

    申请日：2012-04-24

    申请人： Mathew J. Manusharow ,  Mihir K. Roy ,  Kaladhar Radhakrishnan ,  Debendra Mallik ,  Edward A. Burton

    发明人： Mathew J. Manusharow ,  Mihir K. Roy ,  Kaladhar Radhakrishnan ,  Debendra Mallik ,  Edward A. Burton

    IPC分类号： H05K1/18 ,  H05K1/11

    CPC分类号： H05K1/183 ,  H01L23/13 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/1003

    摘要： The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

    摘要翻译： 本说明书涉及制造微电子结构的领域。 微电子结构可以包括具有开口的微电子衬底，其中开口可以通过微电子衬底形成，或者可以是在微电子衬底中形成的凹部。 微电子封装可以附接到微电子衬底，其中微电子封装可以包括具有第一表面和相对的第二表面的插入件。 微电子器件可以附接到插入器第一表面，并且插入器可以通过插入器第一表面附接到微电子衬底，使得微电子器件延伸到开口中。 至少一个次级微电子器件可以附接到插入件第二表面。