摘要:
A motherboard of a computer system has a video display port, a reprogrammable non-volatile memory, a controller for the non-volatile memory, and a graphics controller circuit for outputting video signals to the video display port. A wired-OR circuit connects the graphics controller circuit to the controller to the port. Thus, the video display port can be used to output video signals from the computer system to a peripheral video display device, and the video display port can be used as an input port to reprogram the non-volatile memory. The present invention also relates to a non-volatile memory device which has an array of non-volatile memory cells and two ports for communication therewith. A first port receives a first communication protocol and interfaces with the array in the first communication protocol. A second port receives a second communication protocol and converts the second communication protocol into the first communication protocol.
摘要:
A USB switching device can selectively connect between a removable card and a mobile wireless communication device and a computer. The removable card has a first port; the mobile wireless communicating device has a second port while the computer has a third port. The switching device comprises a first full duplex switch having an input and a first output and a second output, and a select port for switching the connection of the input to the first output and the connection of the input to the second output. The switching device further comprises a second full duplex switch having an input and a first output and a second output, and a select port for switching the connection of the input to the first output and the connection of the input to the second output. The switching device further comprises a third full duplex switch having an input and a first output and a second output, and a select port for switching the connection of the input to the first output and the connection of the input to the second output. The input of the first switch is connected to the first port. The input of the second switch is connected to the second port. The input of the third switch is connected to the third port. The first output of the first switch is connected to the second output of the second switch. The second output of the first switch is connected to the first output of the third switch. Finally, the first output of the second switch is connected to the second output of the third switch.
摘要:
A single integrated circuit microcontroller 10 including embedded erasable/programmable non-volatile memory 12 having a read protection. Microcontroller 10 can operate within a special mode in which external circuits may access memory 12 by use of input/output pins 18. When microcontroller 10 activates this special mode, a read protection flag 13 within memory 12 is checked. The read protection flag 13 may be set during production of the microcontroller 10 after instructional data or firmware has been installed onto memory 12. If the read protection flag 13 has been set, the contents of memory 12 are erased or reprogrammed prior to allowing access to memory 12. In this manner, external circuits cannot access instructional data or firmware that is stored in memory 12.
摘要:
A single integrated circuit microcontroller 10 includes an embedded erasable/programmable non-volatile memory 12 having a read protection capability. Microcontroller 10 can operate within a special mode in which external circuits may access memory 12 by use of input/output pins 18. When microcontroller 10 activates this special mode, a read protection flag 13 within memory 12 is checked. The read protection flag 13 may be set during production of the microcontroller 10 after instructional data or firmware has been installed onto memory 12. If the read protection flag 13 has been set, only certain portions of the memory 12 may be read, depending upon the value of the read protection flag 13.
摘要:
A non-volatile memory device has a plurality of blocks each of which can be erased simultaneously. Each block has a plurality of sectors. A status byte comprising of non-volatile memory cells is associated with each sector. A status circuit receives signals stored in each of the status bytes and generates a status signal indicative of the status of the block.
摘要:
In the present invention, a method of testing an unpackaged integrated circuit die is disclosed. The die has a plurality of first input/output pads. A serial electrical connection is fabricated in the die between all of the input/output pads of the die which are not of the first plurality (hereinafter: “second plurality”). The second plurality has a start input and an end output. The start input of the second plurality is connected to the output of one selected input buffer of the input pad of the first plurality and the end output of the second plurality is also connected to the input of one selected output pad of the first plurality. The second plurality of input/output pads are tested through selected input pad and selected output pad of the first plurality without electrical probes making contact during the wafer sort. The present invention also relates to an integrated circuit die so fabricated as to facilitate testing.
摘要:
In the present invention, a method of testing an unpackaged integrated circuit die is disclosed. The die has a plurality of first input/output pads. A serial electrical connection is fabricated in the die between all of the input/output pads of the die which are not of the first plurality (hereinafter: “second plurality”). The second plurality has a start input and an end output. The start input of the second plurality is connected to the output of one selected input buffer of the input pad of the first plurality and the end output of the second plurality is also connected to the input of one selected output pad of the first plurality. The second plurality of input/output pads are tested through selected input pad and selected output pad of the first plurality without electrical probes making contact during the wafer sort. The present invention also relates to an integrated circuit die so fabricated as to facilitate testing.
摘要:
A NOR emulating device using a controller and NAND memories can be used in a computer system in placed of the main memory or in place of the BIOS NOR memory. Thus, the emulating device can function as a bootable memory. In addition, the device can act as a cache to the hard disk drive. Further, with the addition of an MP3 player controller into the device, the device can function as a stand alone audio playback device, even while the PC is turned off or is in a hibernating mode. Finally with the MP3 player controller, the device can access additional audio data stored on the hard drive, again with the PC in an off mode or a hibernating mode. Finally, the device can function to operate the disk drive, even while the PC is off or is in a hibernating mode, and control USB ports attached thereto.
摘要:
A motherboard of a computer system has a video display port, a reprogrammable non-volatile memory, a controller for the non-volatile memory, and a graphics controller circuit for outputting video signals to the video display port. A wired-OR circuit connects the graphics controller circuit to the controller to the port. Thus, the video display port can be used to output video signals from the computer system to a peripheral video display device, and the video display port can be used as an input port to reprogram the non-volatile memory. The present invention also relates to a non-volatile memory device which has an array of non-volatile memory cells and two ports for communication therewith. A first port receives a first communication protocol and interfaces with the array in the first communication protocol. A second port receives a second communication protocol and converts the second communication protocol into the first communication protocol.
摘要:
In the present invention, a method of testing an unpackaged integrated circuit die is disclosed. The die has a plurality of first input/output pads. A serial electrical connection is fabricated in the die between all of the input/output pads of the die which are not of the first plurality (hereinafter: “second plurality”). The second plurality has a start input and an end output. The start input of the second plurality is connected to the output of one selected input buffer of the input pad of the first plurality and the end output of the second plurality is also connected to the input of one selected output pad of the first plurality. The second plurality of input/output pads are tested through selected input pad and selected output pad of the first plurality without electrical probes making contact during the wafer sort. The present invention also relates to an integrated circuit die so fabricated as to facilitate testing.