公开(公告)号：US06657532B1

公开(公告)日：2003-12-02

申请号：US09139309

申请日：1998-08-24

Applicant: Karen P. Shrier ,  Gerald R. Behling ,  James B. Intrater ,  Kailash C. Joshi ,  William W. Alston, Jr.

Inventor： Karen P. Shrier ,  Gerald R. Behling ,  James B. Intrater ,  Kailash C. Joshi ,  William W. Alston, Jr.

IPC: H01C710

CPC classification number: H01C7/10 ,  H01C7/105 ,  H01C7/12

Abstract: Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.

Abstract translation: 公开了一种用于电子设备的可变电压保护装置，其一方面包括位于接地平面和用于过电压保护的电导体之间的纯介电聚合物或玻璃的薄层，其中纯聚合物或玻璃层不包括 导电或半导体颗粒。 还公开了位于常规可变电压保护材料上的纯介电聚合物或玻璃薄层的组合，其包含含有导电或半导体颗粒的粘合剂。 公开了一种多层可变电压保护组件，其包括三层过电压保护材料，其中外两层含有较低百分比的导电或半导电颗粒，并且其中内层含有较高百分比的导电或半导电颗粒。 多层组分可以任选地与纯介电聚合物或玻璃层组合使用，并且可以任选地具有插入的金属层。 公开了一种用于在粘合剂混合之前使用用于分散绝缘颗粒和导电或半导电颗粒的挥​​发性溶剂将绝缘颗粒和导电或半导电颗粒分散在粘合剂中的方法。

公开(公告)号：US06373719B1

公开(公告)日：2002-04-16

申请号：US09548904

申请日：2000-04-13

Applicant: Gerald R. Behling ,  James B. Intrater

Inventor： Gerald R. Behling ,  James B. Intrater

IPC: H05K900

CPC classification number: H01T4/08 ,  H01L23/60 ,  H01L23/62 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/0259 ,  H05K1/026 ,  H05K1/111 ,  H05K1/116 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the electronic circuit. Microgaps between each contact portion and the corresponding ground bar are designed to provide an electrical conduit from the contact portion to the ground bar when normal operating voltages are exceeded, thereby channeling excess current harmlessly to ground. Under normal operating conditions, however, the microgaps act as electrical barriers, insulating the contact portions from ground. The microgaps may be filled with any combination of air, vacuum, or known variable voltage material.

Abstract translation: 通过设置一个或多个用于将有害电流转移离开敏感电子电路元件的接地棒，为电子电路提供过电压保护。 接地棒各自与电子电路的一排接触部分相关联。 每个接触部分和相应的接地棒之间的微隙被设计成在超过正常工作电压时从接触部分到接地棒提供电导体，从而将过量电流无害地引导到地面。 然而，在正常工作条件下，微隙作为电气屏障，将接触部分与地面绝缘。 微隙可以用空气，真空或已知的可变电压材料的任何组合填充。