Abstract:
Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the electronic circuit. Microgaps between each contact portion and the corresponding ground bar are designed to provide an electrical conduit from the contact portion to the ground bar when normal operating voltages are exceeded, thereby channeling excess current harmlessly to ground. Under normal operating conditions, however, the microgaps act as electrical barriers, insulating the contact portions from ground. The microgaps may be filled with any combination of air, vacuum, or known variable voltage material.
Abstract:
A mass-producible, cost-effective discrete electrical protection device utilizing a precision gap between two electrically conductive members attached to an electrically insulating substrate to provide over-voltage protection to an electrical device. In one aspect, the electrical protection device is a surface mountable device. In another aspect, the device has through-holes for accommodating leads on an electrical connector. Methods are provided also for making the electrical protection device.
Abstract:
Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.
Abstract:
Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the electronic circuit. Microgaps between each contact portion and the corresponding ground bar are designed to provide an electrical conduit from the contact portion to the ground bar when normal operating voltages are exceeded, thereby channeling excess current harmlessly to ground. Under normal operating conditions, however, the microgaps act as electrical barriers, insulating the contact portions from ground. The microgaps may be filled with any combination of air, vacuum, or known variable voltage material.
Abstract:
Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.
Abstract:
Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.
Abstract:
A multilayer composite EMI/RFI filter for use in front of visual displays is disclosed to be constructed of a shaped or shapable plastic substrate having an outer diffuse hardcoat and one or more conductor transmissive layers of metal. Preferably the metal is presented as a sputter-deposited dielectric-metal-dielectric stack.
Abstract:
A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible ground plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.
Abstract:
A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible grounding plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.
Abstract:
A variable voltage protection component is provided with a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. The reinforcing layer defines a uniform thickness for the variable voltage protection component that is resistant to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection device component can be attached to a compressible ground plane to form a variable voltage protection device.