Abstract:
A non-volatile memory device may include a plurality of memory blocks including memory cells connected in series to bit lines, respectively. Each of the plurality of memory blocks may include a first sub memory block having a first group of memory cells, which are respectively connected in series between first select transistors connected to the bit lines, respectively, and second select transistors connected to a common source line, and a second sub memory block having a second group of memory cells, which are respectively connected in series between third select transistors connected to the bit lines, respectively, and fourth select transistors connected to the common source line.
Abstract:
Methods are disclosed for erasing a flash memory cell including: (a) a semiconductor substrate, (b) a gate, (c) a source, (d) a drain, (e) a well, the gate including: (1) a tunnel oxide film, (2) a floating gate, (3) a dielectric film and (4) a control gate stacked on the semiconductor substrate. In one of the disclosed methods, a positive bias voltage is applied to the control gate, the source and drain are floated, a negative bias voltage is applied to the well, a ground voltage is then applied to the well while maintaining the positive bias voltage at the control gate, and subsequently a ground voltage is applied to the control gate.
Abstract:
The invention relates to a flash EEPROM cell and method of manufacturing the same. The method of manufacturing a flash EEPROM cell includes sequentially forming a tunnel oxide film, a polysilicon layer for a floating gate and a hard mask layer on a semiconductor substrate; patterning the hard mask layer and then forming a hard mask layer spacer at the etching side of the patterned hard mask layer; removing the exposed portion of the polysilicon layer for the floating gate by etching process using the patterned hard mask layer and the hard mask layer spacer as etching masks thus to form first and second patterns that are separated in two; removing the patterned hard mask layer and the hard mask layer spacer and then depositing a dielectric film and a polysilicon layer for a control gate on the entire structure, thus forming a first floating gate, a second floating gate and a control gate by self-aligned etching process; and forming a drain junction and a source junction by cell source/drain ion implantation process. Thus, the present invention can prevent lower of the quality of the tunnel oxide film and thus increase the coupling ratio.
Abstract:
A layout of a flash memory and a formation method of the same are disclosed. The layout includes a plurality of memory cells each having a cell transistor having a cell gate electrode having a floating gate and a control gate, and a source/drain electrode for thereby storing and erasing a data, a selection transistor having two gate electrodes, a common drain electrode between the gate electrodes and a source electrode formed outside the same and having a predetermined channel width larger than two times compared to the channel width of the cell transistor, and the drain electrode and source electrodes which are crossingly formed to each other with respect to the axis of the word lines through which a driving voltage is applied to the gate electrodes for thereby selecting a corresponding memory cell, a pair of cell bit lines connected with the source electrode of the selection transistor and connected in parallel with the drain electrode of the memory cell transistor for inputting/outputting the data to the cell transistor, and a pair of array bit lines connected with a drain electrode of the selection transistor and a peripheral circuit.
Abstract:
This invention relates to a test pattern structure comprising a test pattern structure for endurance test of a flash memory device comprising: at least three active regions formed on a semiconductor substrate, each active region being isolated by a field oxide film; a common drain region formed on each active region, respectively; source regions formed on left and right sides of the common drain region in each active region, respectively; a first common floating gate formed along left side of each common drain region; a second common floating gate formed along right side of each common drain region; a control gate overlapped with the first and second floating gates, respectively and connected from each other at both ends of the first and second floating gates; a select gate formed over the common drain region, the source regions and the control gate in each active region, respectively; and metal wires connected to the common drain region, the source regions and the control gate in each active region, respectively.
Abstract:
A method of programming a nonvolatile memory device includes inputting program data to page buffers; performing a program operation and a program verification operation until threshold voltages of memory cells included in a selected page reach a target level according to the program data; when the threshold voltages of the memory cells reach the target level, performing an over-program verification operation to determine over-programmed memory cells in the memory cells; and making a determination of whether error checking and correction (ECC) processing for the over-programmed memory cells is feasible.
Abstract:
A method for operating a non-volatile memory device which includes a plurality of memory cells serially coupled between a source selection transistor and a drain selection transistor, a first dummy memory cell coupled between the source selection transistor and the memory cells, and a second dummy memory cell coupled between the drain selection transistor and the memory cells includes applying a verification voltage to a gate of a selected memory cell, applying a first voltage to gates of unselected memory cells, and applying a second voltage that is lower than the first voltage to a gate of at least one of the first dummy memory cell and the second dummy memory cell, during a program verification operation.
Abstract:
In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.
Abstract:
A semiconductor memory device includes a plurality of memory cells, including an N well formed within a P type region and a P well formed within the N well, a peripheral circuit configured to perform a program, program verify, read, erase, or erase verify operation on memory cells selected from among the memory cells, a voltage supply circuit configured to generate a positive voltage and a negative voltage for the program, program verify, read, erase, or erase verify operation, and a control circuit configured to control the peripheral circuit and the voltage supply circuit so that the program, program verify, read, erase, or erase verify operation is performed and, when the program verify and read operations are performed, different voltage is supplied to the P well and the N well.
Abstract:
A method for operating a flash memory device includes applying a pass voltage to a drain pass word line, a source pass word line, and unselected word lines. The drain pass word line is provided between a drain select line and a word line. The drain pass word line has a structure in the same manner as the word lines. The source pass word line is provided between a source select line and a word line. The source pass word line has a structure in the same manner as the word lines. A program voltage is applied to a selected word line associated with a selected memory cell block. A ground voltage is applied to drain pass word lines and source pass word lines. Word lines associated with unselected memory cell blocks are set to a floating state.