Abstract:
A method for manufacturing a capacitor of a semiconductor element including: forming a bottom electrode of the capacitor on a semiconductor substrate; performing rapid thermal nitrification (RTN) on the upper surface of the bottom electrode; performing a thermal process on the obtained structure having the bottom electrode in a furnace under a nitride atmosphere to eliminate stress generated by the RTN; forming Al2O3 and HfO2 dielectric films on the nitrified bottom electrode; and forming a plate electrode of the capacitor on the Al2O3 and HfO2 dielectric films. The thermal process is performed after the RTN performed on the surface of the bottom electrode, so that stress, generated from the RTN, is alleviated, thereby allowing the capacitor to obtain a high capacitance and lowering leakage current.
Abstract translation:一种制造半导体元件的电容器的方法,包括:在半导体衬底上形成电容器的底部电极; 在底电极的上表面进行快速热硝化(RTN); 对所获得的在氮化物气氛下的炉中具有底部电极的结构进行热处理以消除由RTN产生的应力; 在硝化的底部电极上形成Al 2 O 3 N 3和HfO 2 N 2电介质膜; 以及在Al 2 O 3和HfO 2 N 2电介质膜上形成电容器的平板电极。 在底电极表面进行RTN之后进行热处理,从而可以减轻由RTN产生的应力,从而使电容器获得高电容,降低漏电流。
Abstract:
A method for forming an isolation layer of a semiconductor device, which comprises the steps of: a) sequentially forming a pad oxide layer and a pad nitride layer on a silicon substrate; b) etching the pad nitride layer, the pad oxide layer, and the silicon substrate, thereby forming a trench; c) thermal-oxidizing the resultant substrate to form a sidewall oxide layer on a surface of the trench; d) nitrifying the sidewall oxide layer through the use of NH3 annealing; e) depositing a liner aluminum nitride layer on an entire surface of the silicon substrate inclusive of the nitrated sidewall oxide layer; f) depositing a buried oxide layer on the liner aluminum nitride layer to fill the trench; g) performing a chemical mechanical polishing process with respect to the buried oxide layer; and h) eliminating the pad nitride layer.
Abstract:
Disclosed is a product quality test in a winding step of the entire manufacturing process of a deflection yoke, which is a core part of a display device employing a cathode ray tube such as a color TV or a monitor, and in particular, a winding zig for measuring magnetic fields of a deflection yoke and a magnetic field measuring system of a deflection yoke using the winding zig. The winding zig and the system according to the invention include a plurality of magnetic field sensors mounted inside of the A-shaped winding zig, a digital signal generator for receiving output signals from the magnetic field sensors that sense magnetic field characteristics of a deflection coil wound around the A-shaped winding zig, amplifying the received signals, and converting the amplified signals to digital signals, a digital signal interface for converting the data outputted from the digital signal generator to serial data, and a transmitter for receiving signals processed as serial data by the digital signal interface, and transmitting the received signals.
Abstract:
The invention and method enable the astigmatism correction at each crossing point of a cross hatch pattern, thereby making high-resolution display possible. An appropriate voltage or current for controlling the magnetic field adjusting coils are generated from the correction data stored in a memory. The voltage or current generated are then applied to two poles, four poles or six poles during scanning of the screen.
Abstract:
The present invention provides a method for fabricating a ferroelectric memory device to reduce manufacturing cost and to obtain the electric characteristic of capacitor. The method comprises the steps of: forming an intermetal insulating layer provided with a contact hole exposing a junction region formed on a semiconductor layer having the junction region; forming a contact plug within the contact hole; forming a barrier layer and a metal layer for lower electrode on the intermetal insulating layer successively; forming a lower electrode by patterning selected portions of the metal layer for lower electrode and the barrier layer; forming a high dielectric layer on the substrate on which the lower electrode is formed; and forming an upper electrode on the high dielectric layer, wherein during forming the upper electrode, an F ion layer to be trapped by dangling bonds formed at an interface between the upper electrode and the high dielectric layer, is formed at the interface.
Abstract:
An embodiment of the invention includes a pillar type capacitor where a pillar is formed over an upper portion of a storage node contact. A bottom electrode is formed over sidewalls of the pillar, and a dielectric film is formed over pillar and the bottom electrode. A top electrode is then formed over the upper portion of the dielectric film.
Abstract:
A semiconductor device having a high aspect cylindrical capacitor and a method for fabricating the same is presented. The high aspect cylindrical type capacitor is a stable structure which is not prone to causing bunker defects and losses in a guard ring. The semiconductor device includes the cylindrical type capacitor structure, a storage node oxide, a guard ring hole, a conductive layer, and a capping oxide. The cylindrical type capacitor structure in a cell region includes a cylindrical type lower electrode, a dielectric and an upper electrode. The storage node oxide is in a peripheral region over the semiconductor substrate. The conductive layer coating the guard ring hole. The guard ring hole at a boundary of the peripheral region that adjoins the cell region over the semiconductor substrate. The capping oxide partially fills in a part of the conductive layer. The gapfill film filling in the rest of the conductive layer.
Abstract:
A capacitor is made by forming a buffer oxide layer, an etching stop layer, and a mold insulation layer over a semiconductor substrate having a storage node contact plug. The mold insulation layer and the etching stop layer are etched to form a hole in an upper portion of the storage node contact plug. A tapering layer is deposited over the mold insulation layer including the hole. The tapering layer and the buffer oxide layer are etched back so that the tapering layer is remained only at the upper end portion of the etched hole. A metal storage node layer formed on the etched hole over the remaining tapering layer. The mold insulation layer and the remaining tapering layer are removed to form a cylindrical storage node having a tapered upper end. A dielectric layer and a plate node are formed over the storage node.
Abstract:
A semiconductor device that prevents the leaning of storage node when forming a capacitor having high capacitance includes a plurality of cylinder-shaped storage nodes formed over a semiconductor substrate; and support patterns formed to fix the storage nodes in the form of an ‘L’ or a ‘+’ when viewed from the top. This semiconductor device having support patterns in the form of an ‘L’ or a ‘+’ reduces stress on the storage nodes when subsequently forming a dielectric layer and plate nodes that prevents the capacitors from leaking.
Abstract:
The present invention discloses a method of manufacturing a capacitor in a semiconductor device which is directed to solve the problem of reduction of capacitance occurring when manufacturing a capacitor of a MIS structure using poly-silicon as an underlying electrode and metal as an upper electrode in a capacitor using Ta2O5 as a dielectric film. In order to solve the problem, the present invention forms an underlying electrode using metal having a good oxide-resistant such as TiSiN. Thus, the present invention could not only lower the thickness of the effective oxide film of Ta2O5 when depositing Ta2O5 or performing a thermal process for crystallization but also prevent increase of a leak current due to oxidization of the underlying electrode and the diffusion prevention film, thus securing the capacitance of the capacitor and improving the electric characteristic of the capacitor.