Abstract:
An article of cookware for use in an oven, wherein the artiste of cookware comprises a base having an upper surface, wherein at least a first region of the upper surface incorporates a plurality of upward protrusions, and wherein the uppermost regions of said protrusions are substantially coplanar for supporting a food product for cooking. Preferably the upper surface between said protrusions is inclined relative to the uppermost regions of said protrusions. A gutter may be provided around at least part of said first region, arranged such that liquid released from a foodstuff during cooking flows into the gutter. The invention further provides a method of cooking using an oven and such an article of cookware.
Abstract:
This invention relates to methods, compositions, and kits for the capture, measurement, and quantification of endotoxins, glucans, or their combination in samples taken from indoor air.
Abstract:
A method for operating an optical sensing device having a light source and a photodetector device with at least one photosensitive element. A surface portion is illuminated with radiation by the light source and the radiation reflected from the illuminated surface portion is detected with a photosensitive element. While said surface portion is being illuminated, an output signal of the photosensitive element over time is integrated, the output signal integration level is compared with a first integration reference level during integration; the integration step is interrupted if the output signal integration level has reached the first integration reference level, or the comparison step is repeated until a first integration period has elapsed if the output signal integration level has not reached the first integration reference level.
Abstract:
The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
Abstract:
A freeze resistant animal watering installation includes a trough and a substantially vertical flow tube which provides water under pressure to the trough upon a valve actuator being activated by an animal accessing the trough. Any excess water is drained to a storage reservoir installed underground below frost level. A venturi is positioned on the flow tube in fluid communication with the storage reservoir, such that the flow of water along the flow tube serves to draw water from the storage reservoir.
Abstract:
An amplifier circuit (10) having a rotating input stage has a switching network (12) connected to an input (14). A number of parallel transconductance gain stages (16) are connected to the switching network (12). An auto-zeroing circuit (18) is connected to the switching network (12). A second transconductance gain stage (20) is connected to the parallel transconductance gain stages (16).
Abstract:
The invention provides a method for making piezoelectric printheads for ink jet The method includes applying an insulating layer to a first surface of a silicon wafer having a thickness ranging from about 200 to about 800 microns. A first conducting layer is applied to the insulating layer on the first surface and a piezoelectric layer is applied to the first conducting layer. The piezoelectric layer is patterned to provide piezoelectric elements on the first surface of the silicon wafer. A second conducting layer is applied to the piezoelectric layer and is patterned to provide conductors for applying an electric field across each of the piezoelectric elements. A photoresist layer is applied to a second surface of the silicon wafer, and the photoresist layer is imaged and developed to provide pressurizing chamber locations. The silicon wafer is then dry etched through the thickness of the wafer up to the insulating layer on the first surface of the wafer. A nozzle plate containing nozzle holes corresponding to the pressurizing chambers is applied and bonded to the second surface of the silicon wafer. As opposed to conventional wet chemical etching techniques, the method of the invention significantly decreases the manufacturing tolerances required and provides more reliable printheads for long term printer use.
Abstract:
The invention provides a method for forming ink jet nozzle structures in an ablatable material. More particularly, the invention provides uniform nozzle structure by ablating an ablatable material with a laser beam while setting a field lens unit to various locations relative to a projection lens. The resulting ink jet nozzle structures have substantially orthogonal ink delivery trajectory paths relative to a plane defined by the length and width of the ablatable material regardless of the nozzles hole position relative to the edges of the ablatable material.
Abstract:
An ink reservoir having a bubble generator includes an enclosure defining an interior space and an exterior space, the interior space being adapted for containing a supply of ink, the enclosure having a passage formed therein which permits fluid communication between the interior space and the exterior space, the passage including a surface, the passage defining a first aperture and a second aperture, wherein the second aperture is adjacent the interior space. A sphere is positioned in the passage and contacts a portion of the surface of the passage, the surface having a shape that permits ink to pass between the sphere and the surface. A membrane is positioned over the first aperture to retain the sphere in the passage, the membrane including at least one hole being sized to define a bubble admission pressure difference across a thickness of the membrane.
Abstract:
An ink jet printing apparatus is provided comprising first and second print cartridges. The first print cartridge includes at least one first resistive heating element in at least one first ink-containing chamber having a first orifice. The first heating element has a first surface area. The second print cartridge includes at least one second resistive heating element in at least one second ink-containing chamber having a second orifice. The second heating element has a second surface area which is less than the first surface area. The apparatus further comprises a driver circuit, electrically coupled to the first and second print cartridges, for selectively applying to one of the first and second heating elements via a common drive circuit a firing pulse. The firing pulse to the first heating element causing a vapor bubble to be produced in the first chamber such that a droplet of ink of a first size is ejected from the first chamber orifice. The firing pulse to the second heating element causing a vapor bubble to be produced in the second chamber such that a droplet of ink of a second size which is smaller than the first size is ejected from the second chamber orifice.