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27 条记录 (耗时 0.019 秒)

    MODIFICATION OF WOOD WITH HYDROPHILIC PREPOLYMERS
    13.
    发明申请
    MODIFICATION OF WOOD WITH HYDROPHILIC PREPOLYMERS 有权
    用水解预处理剂修饰木材

    公开(公告)号：US20100068543A1

    公开(公告)日：2010-03-18

    申请号：US12517150

    申请日：2007-12-04

    申请人： Peter James Hayward ,  Wallace James Rae ,  Christopher Molloy

    发明人： Peter James Hayward ,  Wallace James Rae ,  Christopher Molloy

    IPC分类号： C08K5/15 ,  B05D3/02 ,  B32B27/10

    CPC分类号： C08H8/00 ,  B27K3/156 ,  C08K5/0025 ,  C08L33/02 ,  Y10T428/31895 ,  Y10T428/31971 ,  Y10T428/31989

    摘要： A composition for modification of wood products is disclosed. The composition contains a prepolymer formed by the reaction of a polyfunctional hydrophilic polymer of high molecular weight and a crosslinking agent. The composition may also contain a prepolymer formed by the reaction of a sugar and a crosslinking agent. Modification of the wood product may result in one or more of: improved stiffness, strength, surface hardness, dimensional stability, water resistance, flame retardancy, and biological resistance.

    摘要翻译： 公开了一种用于木制品改性的组合物。 该组合物含有通过高分子量多官能亲水性聚合物与交联剂的反应形成的预聚物。 组合物还可以含有通过糖和交联剂的反应形成的预聚物。 木制品的改性可以产生以下一个或多个：改进的刚度，强度，表面硬度，尺寸稳定性，耐水性，阻燃性和生物抗性。

    TREATMENT OF WOOD BASED ON NOVEL FORMULATIONS OF BORATRANES
    14.
    发明申请
    TREATMENT OF WOOD BASED ON NOVEL FORMULATIONS OF BORATRANES 审中-公开
    基于BORATRANES公式的木材处理

    公开(公告)号：US20090227540A1

    公开(公告)日：2009-09-10

    申请号：US12095789

    申请日：2006-12-04

    申请人： Peter James Hayward ,  Wallace James Rae ,  Robert Arthur Franch

    发明人： Peter James Hayward ,  Wallace James Rae ,  Robert Arthur Franch

    IPC分类号： A01N55/08 ,  A01P3/00 ,  A01P7/04

    CPC分类号： A01N55/00 ,  B27K3/163 ,  B27K3/34 ,  B27K3/52 ,  A01N33/12 ,  A01N2300/00

    摘要： A wood preservative composition comprising leach resistant boron in the form of a boratrane, and a synergistic proportion of quaternary ammonium compound. The composition can include triadimefon in synergistic proportions with the boratrane and quaternary ammonium compound. It can be in the form of a stable water dilutable composition and include an insoluble fungicide or an insecticide. The composition has the property of providing decay and insect resistance to wood, reconstituted wood fibers and flake and veneer products.

    摘要翻译： 一种木材防腐剂组合物，其包含硼酸盐形式的浸出性硼，以及季铵化合物的协同比例。 组合物可以包括与硼酸盐和季铵化合物协同比例的三唑酮。 它可以是稳定的水可稀释组合物的形式，并且包括不溶性杀真菌剂或杀虫剂。 该组合物具有对木材，复原木纤维以及薄片和薄板产品提供抗腐蚀和抗虫性的特性。

    Folding leg mechanism
    16.
    发明授权
    Folding leg mechanism 失效
    折腿机构

    公开(公告)号：US06170407B2

    公开(公告)日：2001-01-09

    申请号：US09361224

    申请日：1999-07-27

    申请人： James Hayward

    发明人： James Hayward

    IPC分类号： A47B3500

    CPC分类号： A47B21/06 ,  A47B3/0803 ,  A47B3/0818

    摘要： A folding table leg mechanism for mounting to a tabletop, having a leg support with an extension portion and a base portion fixedly mounted to the extension portion, and a mounting mechanism for pivotally connecting the leg support to the tabletop. The mounting mechanism has a hinge joint for pivoting the leg support in a pivot plane substantially perpendicular to the tabletop plane from a collapsed position in which the leg support is substantially parallel to the tabletop to an erect position in which the leg support is substantially perpendicular to the tabletop, and also has a rotation joint for rotating the leg support about a rotation axis substantially perpendicular to the tabletop when the leg support is in the erect position, from a first rotational position to a second rotational position. The leg support may be locked in place when it is in the second rotational position. The mechanism may also include a cord tray pivotally coupled to the leg support wherein the cord tray pivots with the leg support when the leg support is pivoted between the collapsed position and the erect position, but wherein the cord tray remains fixed in position relative to the tabletop when the leg support is rotated between the first rotational position and the second rotational position.

    摘要翻译： 一种折叠台腿机构，用于安装到桌面上，具有腿部支撑件，其具有延伸部分和固定地安装到延伸部分的基部部分，以及用于将腿部支撑件枢转地连接到桌面的安装机构。 安装机构具有铰链接头，用于使腿部支撑件在基本上垂直于桌面的枢转平面中从折叠位置枢转，其中腿部支撑件基本上平行于桌面到直立位置，在该位置，腿部支撑件基本上垂直于 并且还具有旋转接头，用于当腿部支撑件处于从第一旋转位置到第二旋转位置的直立位置时围绕基本上垂直于台面的旋转轴线旋转腿部支撑件。 腿部支撑件处于第二旋转位置时可以被锁定就位。 该机构还可以包括枢转地联接到腿部支撑件的绳索盘，其中当腿部支撑件在收缩位置和直立位置之间枢转时，绳索盘与腿支撑件枢转，但是其中，绳索托盘保持固定在相对于 当腿部支撑件在第一旋转位置和第二旋转位置之间旋转时，桌面。

    Integrated circuit chip package and method of making the same
    17.
    发明授权
    Integrated circuit chip package and method of making the same 失效
    集成电路芯片封装及其制作方法

    公开(公告)号：US6124546A

    公开(公告)日：2000-09-26

    申请号：US984547

    申请日：1997-12-03

    申请人： James Hayward ,  Quang Nguyen

    发明人： James Hayward ,  Quang Nguyen

    IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/28

    CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L2924/0002

    摘要： A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52 connected between the die 14 and the top interposer 2, and a tab bond 22 providing an electrical connection from the wirebond 18 or the flipchip connector 52 to outside the bottom interposer 4. A method of making the chip package includes providing top and bottom interposers 2 and 4, attaching a semiconductor die 14 to the top interposer 2, providing a wirebond 18 or a flipchip connector 52 between the die 14 and the top interposer 2, providing a tab bond 22 between the top and bottom interposers 2 and 4, and providing an encapsulant 16 to fill the intermediate volume 40 between the top and bottom interposers 2 and 4.

    摘要翻译： 半导体集成电路芯片封装包括顶部和底部插入件2和4，连接到顶部插入件2的半导体管芯14，连接在管芯14和顶部插入件2之间的引线接合件18或倒装芯片连接器52以及接头接合22 提供从引线键18或倒装芯片连接器52到底部插入件4的外部的电连接。制造芯片封装的方法包括提供顶部和底部插入件2和4，将半导体管芯14附接到顶部插入件2， 引线键18或芯片连接器52在芯片14和顶部插入件2之间提供在顶部和底部插入件2和4之间的接头接合22，并且提供密封剂16以填充顶部和底部插入件2之间的中间体积40 和4。