公开(公告)号：US20090057884A1

公开(公告)日：2009-03-05

申请号：US11846642

申请日：2007-08-29

申请人： Seah Sun Too ,  James Hayward

发明人： Seah Sun Too ,  James Hayward

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/04 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

摘要： Various semiconductor chip packages and package lids are disclosed. In one aspect, a method of manufacturing is provided that includes forming a semiconductor chip package lid with a peripheral wall that defines a first interior space. A first bridge structure is formed in the first interior space. The first bridge structure is adapted to engage a surface of a substrate.

摘要翻译： 公开了各种半导体芯片封装和封装盖。 一方面，提供一种制造方法，其包括：形成具有限定第一内部空间的周壁的半导体芯片封装盖。 在第一内部空间中形成第一桥结构。 第一桥结构适于接合衬底的表面。

公开(公告)号：US07513035B2

公开(公告)日：2009-04-07

申请号：US11422807

申请日：2006-06-07

申请人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

发明人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

IPC分类号： H05K3/30 ,  H05K3/34

CPC分类号： H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

摘要： Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

摘要翻译： 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。

公开(公告)号：US20070284144A1

公开(公告)日：2007-12-13

申请号：US11422807

申请日：2006-06-07

申请人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

发明人： Seah Sun Too ,  Mohammad Khan ,  James Hayward ,  Jacquana Diep

IPC分类号： H01R13/46

CPC分类号： H01L23/3675 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

摘要： Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.

摘要翻译： 提供各种集成电路封装元件。 一方面，提供一种集成电路封装装置，其包括用于覆盖集成电路的盖。 当盖被置于选定位置时，该盖具有用于在集成电路上施加压力的凸面。 在另一方面，提供一种集成电路封装装置，其包括盖，该盖具有当盖处于选定位置时向集成电路施加压力的表面。 金膜耦合到表面。 金膜具有从周边延伸的周边和多个圆。

公开(公告)号：US06936501B1

公开(公告)日：2005-08-30

申请号：US10818981

申请日：2004-04-05

申请人： Seah Sun Too ,  James Hayward ,  Janet D. Kirkland

发明人： Seah Sun Too ,  James Hayward ,  Janet D. Kirkland

IPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/12 ,  H01L23/42

CPC分类号： H01L23/10 ,  H01L23/04 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting surface. It is flip-chip mounted to a support substrate so the active surface is adjacent the support substrate. A passive or active circuit element may be mounted to the support substrate. The mounting surface of the semiconductor chip has a radius of curvature. A thermal interface material is dispensed on the mounting surface of the semiconductor chip. A lid is coupled to the support substrate via a lid adhesive. A portion of the lid has a radius of curvature that corresponds to the radius of curvature of the semiconductor chip. A force is applied to the lid so that it contacts the thermal interface material and urges the interface material to the sides of the semiconductor chip. The force causes wetting of the thermal interface material.

摘要翻译： 一种具有用于保护半导体芯片的盖的半导体部件和半导体部件的制造方法。 半导体芯片具有活性表面和安装表面。 它被倒装安装到支撑基板上，使得有源表面邻近支撑基板。 无源或有源电路元件可以安装到支撑衬底。 半导体芯片的安装表面具有曲率半径。 热界面材料被分配在半导体芯片的安装表面上。 盖通过盖粘合剂连接到支撑基板。 盖的一部分具有对应于半导体芯片的曲率半径的曲率半径。 将力施加到盖子上，使其接触热界面材料并将界面材料推向半导体芯片的侧面。 该力导致热界面材料的润湿。

公开(公告)号：US06170407B2

公开(公告)日：2001-01-09

申请号：US09361224

申请日：1999-07-27

申请人： James Hayward

发明人： James Hayward

IPC分类号： A47B3500

CPC分类号： A47B21/06 ,  A47B3/0803 ,  A47B3/0818

摘要： A folding table leg mechanism for mounting to a tabletop, having a leg support with an extension portion and a base portion fixedly mounted to the extension portion, and a mounting mechanism for pivotally connecting the leg support to the tabletop. The mounting mechanism has a hinge joint for pivoting the leg support in a pivot plane substantially perpendicular to the tabletop plane from a collapsed position in which the leg support is substantially parallel to the tabletop to an erect position in which the leg support is substantially perpendicular to the tabletop, and also has a rotation joint for rotating the leg support about a rotation axis substantially perpendicular to the tabletop when the leg support is in the erect position, from a first rotational position to a second rotational position. The leg support may be locked in place when it is in the second rotational position. The mechanism may also include a cord tray pivotally coupled to the leg support wherein the cord tray pivots with the leg support when the leg support is pivoted between the collapsed position and the erect position, but wherein the cord tray remains fixed in position relative to the tabletop when the leg support is rotated between the first rotational position and the second rotational position.

摘要翻译： 一种折叠台腿机构，用于安装到桌面上，具有腿部支撑件，其具有延伸部分和固定地安装到延伸部分的基部部分，以及用于将腿部支撑件枢转地连接到桌面的安装机构。 安装机构具有铰链接头，用于使腿部支撑件在基本上垂直于桌面的枢转平面中从折叠位置枢转，其中腿部支撑件基本上平行于桌面到直立位置，在该位置，腿部支撑件基本上垂直于 并且还具有旋转接头，用于当腿部支撑件处于从第一旋转位置到第二旋转位置的直立位置时围绕基本上垂直于台面的旋转轴线旋转腿部支撑件。 腿部支撑件处于第二旋转位置时可以被锁定就位。 该机构还可以包括枢转地联接到腿部支撑件的绳索盘，其中当腿部支撑件在收缩位置和直立位置之间枢转时，绳索盘与腿支撑件枢转，但是其中，绳索托盘保持固定在相对于 当腿部支撑件在第一旋转位置和第二旋转位置之间旋转时，桌面。

公开(公告)号：USD414350S

公开(公告)日：1999-09-28

申请号：US82511

申请日：1998-01-23

申请人： Jeffery Fear ,  James Hayward

设计人： Jeffery Fear ,  James Hayward

公开(公告)号：US20050186160A1

公开(公告)日：2005-08-25

申请号：US11114668

申请日：2005-04-26

申请人： Duncan Aust ,  James Wilmott ,  James Hayward

发明人： Duncan Aust ,  James Wilmott ,  James Hayward

IPC分类号： A61K8/04 ,  A61K8/73 ,  A61Q17/04 ,  A61K7/42

CPC分类号： A61K8/044 ,  A61K8/73 ,  A61K2800/413 ,  A61Q17/04 ,  B82Y5/00

摘要： The present invention relates to a sunscreen formulation which exhibits superior ultraviolet protection and water resistance than prior art sunscreen compositions. The sunscreen formulation comprises (a) a dispersion comprising a sunscreen active agent and (b) a base composition comprising a rheological modifying agent and water. The sunscreen formulation is substantially free of surfactants. According to a preferred embodiment, the sunscreen active agent is ethylhexylmethoxycinnamate, butylmethoxydibenzoylmethane, or a combination thereof. The sunscreen formulation preferably comprises a phosphorylated starch derivative as a Theological modifying agent. Another embodiment of the present invention is a method of protecting skin or hair from ultraviolet radiation by applying an effective amount of the sunscreen formulation of the present invention to the skin or hair.

摘要翻译： 本发明涉及与现有技术的防晒组合物相比表现出优异的紫外线防护性和耐水性的防晒制剂。 防晒制剂包含（a）包含防晒活性剂的分散体和（b）包含流变改性剂和水的基础组合物。 防晒制剂基本上不含表面活性剂。 根据优选的实施方案，防晒活性剂是甲氧基肉桂酸乙基己酯，丁基甲氧基二苯甲酰甲烷或其组合。 防晒制剂优选包含作为神学改性剂的磷酸化淀粉衍生物。 本发明的另一个实施方案是通过将有效量的本发明的防晒制剂施用于皮肤或毛发来保护皮肤或头发免受紫外线辐射的方法。

公开(公告)号：USD437144S1

公开(公告)日：2001-02-06

申请号：US29117410

申请日：2000-01-27

申请人： Jeffery Fear ,  James Hayward

设计人： Jeffery Fear ,  James Hayward

公开(公告)号：US6050579A

公开(公告)日：2000-04-18

申请号：US063591

申请日：1998-04-21

申请人： Arthur E. Selland ,  Thomas G. Pfotenhauer ,  Mark L. Thompson ,  James Hayward

发明人： Arthur E. Selland ,  Thomas G. Pfotenhauer ,  Mark L. Thompson ,  James Hayward

IPC分类号： B29C44/18 ,  B60R3/00

CPC分类号： B29C44/18 ,  B60R3/002

摘要： The running board of the present invention provide the structural integrity to withstand the static and dynamic loads to which articles of this type are normally subjected. The design of the running board in terms of its configuration, the components making up the running board, namely, the blow molded exterior shell and the foam core, have specific structural characteristics. For example, the foam core has a density in the range of 100 kg/m.sup.3 to 150 kg/m.sup.3 and has sufficient resiliency to permit the part to return to substantially its original shape following removal of a load of predetermined magnitude.

摘要翻译： 本发明的跑步板提供了结构完整性，以承受这种类型的物品通常受到的静态和动态载荷。 运行板的构造方面，构成运行板的部件，即吹塑外壳和泡沫芯的构造具有特定的结构特征。 例如，泡沫芯具有在100kg / m 3至150kg / m 3范围内的密度，并且具有足够的弹性，以在去除预定量级的载荷之后使部件恢复到其基本上其原始形状。

公开(公告)号：US6124546A

公开(公告)日：2000-09-26

申请号：US984547

申请日：1997-12-03

申请人： James Hayward ,  Quang Nguyen

发明人： James Hayward ,  Quang Nguyen

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L2924/0002

摘要： A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52 connected between the die 14 and the top interposer 2, and a tab bond 22 providing an electrical connection from the wirebond 18 or the flipchip connector 52 to outside the bottom interposer 4. A method of making the chip package includes providing top and bottom interposers 2 and 4, attaching a semiconductor die 14 to the top interposer 2, providing a wirebond 18 or a flipchip connector 52 between the die 14 and the top interposer 2, providing a tab bond 22 between the top and bottom interposers 2 and 4, and providing an encapsulant 16 to fill the intermediate volume 40 between the top and bottom interposers 2 and 4.

摘要翻译： 半导体集成电路芯片封装包括顶部和底部插入件2和4，连接到顶部插入件2的半导体管芯14，连接在管芯14和顶部插入件2之间的引线接合件18或倒装芯片连接器52以及接头接合22 提供从引线键18或倒装芯片连接器52到底部插入件4的外部的电连接。制造芯片封装的方法包括提供顶部和底部插入件2和4，将半导体管芯14附接到顶部插入件2， 引线键18或芯片连接器52在芯片14和顶部插入件2之间提供在顶部和底部插入件2和4之间的接头接合22，并且提供密封剂16以填充顶部和底部插入件2之间的中间体积40 和4。