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61 条记录 (耗时 0.019 秒)

    Micro-mirror and a method for fabricating the same
    13.
    发明授权
    Micro-mirror and a method for fabricating the same 失效
    微镜及其制造方法

    公开(公告)号：US07173748B2

    公开(公告)日：2007-02-06

    申请号：US11297929

    申请日：2005-12-08

    申请人： Masaki Hara ,  Takuya Makino ,  Kazuhito Hori ,  Kazuhiro Hane ,  Minoru Sasaki

    发明人： Masaki Hara ,  Takuya Makino ,  Kazuhito Hori ,  Kazuhiro Hane ,  Minoru Sasaki

    IPC分类号： G02B26/08

    CPC分类号： G02B26/0866 ,  G02B26/0833 ,  Y10S359/904

    摘要： A micro-mirror for deflecting an incident light is disclosed, wherein the micro-mirror comprises: a mirror section for reflecting an incident light issued from a laser diode; a hinge section including a fixed section and a movable section each having a flat surface; and a drive section having a bi-morph structure made of two or more of materials having different heat expansion coefficient for deflecting said mirror section to change relative angle to said incident light.

    摘要翻译： 公开了一种用于偏转入射光的微镜，其中微镜包括：用于反射从激光二极管发出的入射光的反射镜部分; 铰链部分，其包括固定部分和每个具有平坦表面的可动部分; 以及具有由两种或更多种具有不同热膨胀系数的材料制成的双变形结构的驱动部分，用于偏转所述镜部分以改变与所述入射光的相对角度。

    Heat transport device and electronic device
    15.
    发明授权
    Heat transport device and electronic device 失效

    公开(公告)号：US06976526B2

    公开(公告)日：2005-12-20

    申请号：US11086361

    申请日：2005-03-23

    申请人： Takuya Makino ,  Masaki Hara

    发明人： Takuya Makino ,  Masaki Hara

    IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427

    CPC分类号： H01L23/427 ,  F28D15/043 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.

    Heat transport device and electronic device
    16.
    发明申请
    Heat transport device and electronic device 失效

    公开(公告)号：US20050161198A1

    公开(公告)日：2005-07-28

    申请号：US11086361

    申请日：2005-03-23

    申请人： Takuya Makino ,  Masaki Hara

    发明人： Takuya Makino ,  Masaki Hara

    IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  F28D15/00

    CPC分类号： H01L23/427 ,  F28D15/043 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat transport device includes an evaporator, a condenser, and a vapor channel and a plurality of liquid channels that connect the evaporator and the condenser. The evaporator generates a capillary force to circulate working fluid. This structure prevents the performance deterioration and malfunction due to the entry of vapor-phase working fluid into the liquid channels. Since the cross-sectional areas of the liquid channels gradually decrease from the condenser toward the evaporator, the capillary force at the liquid channels can be increased, and vapor-phase working fluid is prevented from entering the liquid channels. Wicks and the portions of the liquid channels adjacent thereto are filled with liquid-phase working fluid even after dryout occurs, stable operation is achieved.

    Bonded substrate structures and method for fabricating bonded substrate structures
    19.
    发明授权
    Bonded substrate structures and method for fabricating bonded substrate structures 失效
    粘合的基片结构和制造键合衬底结构的方法

    公开(公告)号：US06433390B1

    公开(公告)日：2002-08-13

    申请号：US09625475

    申请日：2000-07-25

    申请人： Masaki Hara

    发明人： Masaki Hara

    IPC分类号： H01L2701

    CPC分类号： B81C3/001 ,  H01L21/2007 ,  H01L21/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2924/00014

    摘要： In fabricating bonded substrate structures having a device-housing space therein, microstructures in the bonded substrates are prevented from being broken or damaged, and the yield of the bonded substrate structures fabricated is increased. A through-groove capable of connecting the device-housing space to the outside is formed in the bonded surface of one substrate. Thus configured, the atmosphere inside the device-housing space is kept the same as the outside atmosphere while openings that reach the device-housing space are formed through the bonded substrate structure by etching the structure, and the device-housing space is prevented from being subjected to any rapid pressure change in the process of forming the openings. The depth of the through-groove may be the same as that of the recess for the device-housing space. Thus configured, the through-groove may be formed in one and the same etching treatment for forming the device-housing space. The through-groove may be partly sealed with a Pb bump or the like, and the atmosphere inside the device-housing space can be insulated from the outside atmosphere in any stage of processing the bonded substrate structure.

    摘要翻译： 在制造其中具有器件容纳空间的键合衬底结构中，防止粘合衬底中的微结构被破坏或损坏，并且所制造的键合衬底结构的产量增加。 在一个基板的接合表面上形成能够将装置容纳空间连接到外部的通槽。 如此构成，通过蚀刻该结构，通过键合衬底结构形成到达器件容纳空间的开口，使得器件容纳空间内的气氛保持与外部气氛相同，并且防止器件容纳空间 在形成开口的过程中经受任何快速的压力变化。 通孔的深度可以与用于装置容纳空间的凹部的深度相同。 如此构成，可以在用于形成器件容纳空间的同一蚀刻处理中形成贯通槽。 贯通槽可以用Pb凸块等部分地密封，并且在处理结合的衬底结构的任何阶段中，器件容纳空间内的气氛可以与外部气氛绝缘。

    Solid activated carbon, process for manufacturing the same and electric double layer capacitor using the same
    20.
    发明授权
    Solid activated carbon, process for manufacturing the same and electric double layer capacitor using the same 失效
    固体活性炭，制造相同的工艺和使用其的双电层电容器

    公开(公告)号：US06353528B1

    公开(公告)日：2002-03-05

    申请号：US09083343

    申请日：1998-05-22

    申请人： Yuuichi Hori ,  Shinya Matsuno ,  Naotomo Hokajou ,  Masaki Hara

    发明人： Yuuichi Hori ,  Shinya Matsuno ,  Naotomo Hokajou ,  Masaki Hara

    IPC分类号： D01F912

    CPC分类号： H01G11/72 ,  C01B32/382 ,  H01G11/32 ,  Y02E60/13

    摘要： Disclosed is a solid activated carbon and a process for manufacturing the solid activated carbon which is particularly suitable for electrode materials used in an electric double layer capacitor and various batteries. The use of the solid activated carbon makes it possible to prepare an activated carbon substrate having high mechanical strength and practical capacitance while the content of activated carbon is high. The solid activated carbon comprises an activated carbon powder and/or an activated carbon fiber, a carburized substance of a PVA or a resin derived from PVA, and a PVA or a resin derived from PVA. The process for manufacturing the solid activated carbon comprises, molding a molding material consisting of an activated carbon powder and/or an activated carbon fiber, a PVA or a resin derived from PVA or a mixture of a PVA or a resin derived from PVA and a mesophase using a known molding method, aging the molded compact in air and heat-treating the aged compact in a non-oxidizing atmosphere.

    摘要翻译： 公开了固体活性炭和固体活性炭的制造方法，其特别适用于双电层电容器和各种电池中使用的电极材料。 使用固体活性炭可以制备具有高机械强度和实用电容的活性炭基材，同时活性炭的含量高。 固体活性炭包括活性炭粉末和/或活性炭纤维，PVA或由PVA衍生的树脂的渗碳物质，PVA或衍生自PVA的树脂。 制造固体活性炭的方法包括：将由活性炭粉末和/或活性碳纤维，PVA或衍生自PVA的树脂或PVA或衍生自PVA的树脂的混合物和/ 使用已知的成型方法的中间相，在空气中老化成型体，在非氧化性气氛中对老化的成形体进行热处理。