公开(公告)号：US07566244B1

公开(公告)日：2009-07-28

申请号：US11801588

申请日：2007-05-10

Applicant: Toan Nguyen ,  Gary Myers ,  Jimmy Leung ,  Saeed Seyed ,  Michael Chern

Inventor： Toan Nguyen ,  Gary Myers ,  Jimmy Leung ,  Saeed Seyed ,  Michael Chern

IPC: H01R13/648

CPC classification number: G02B6/4201 ,  G02B6/4277 ,  G02B6/4284 ,  H01R12/7064 ,  H01R12/716 ,  H01R12/721 ,  H01R12/724 ,  H01R13/659 ,  H01R13/6594

Abstract: A circuit board assembly includes a circuit board, and a connector supported by the circuit board. The connector is configured to electrically connect with a pluggable transceiver module having a retention post. The circuit board assembly further includes a cage supported by the circuit board. The cage includes a cage body defining (i) a circuit board side which faces the circuit board, (ii) an opposing side which faces away from the circuit board, and (iii) a cavity within which the module substantially resides during module operation. The connector is substantially disposed within the cavity. The cage further includes a tab is configured to engage the retention post of the module when the module substantially resides within the cavity defined by the cage body. The tab resides on the opposing side defined by the cage body. Such an assembly enables installation of the module with its belly side up.

Abstract translation: 电路板组件包括电路板和由电路板支撑的连接器。 连接器被配置为与具有保持柱的可插拔收发器模块电连接。 电路板组件还包括由电路板支撑的保持架。 笼子包括笼体，其限定（i）面向电路板的电路板侧，（ii）背离电路板的相对侧，以及（iii）在模块操作期间该模块基本上位于该空腔内。 连接器基本上设置在空腔内。 所述保持架还包括突片，其构造成当所述模块基本上位于由所述笼体限定的空腔内时与所述模块的所述保持柱接合。 标签位于由笼体限定的相对侧上。 这样的组件可以将模块的腹部侧面向上安装。

公开(公告)号：US07292458B1

公开(公告)日：2007-11-06

申请号：US11291229

申请日：2005-12-01

Applicant: Michael Chern ,  Saeed Seyed ,  Phillip Ting

Inventor： Michael Chern ,  Saeed Seyed ,  Phillip Ting

IPC: H05K7/02

CPC classification number: H05K7/142 ,  G06F1/186 ,  H05K1/141 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2036

Abstract: A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The motherboard and the daughter board electrically connect to each other through a set of circuit board connectors. The circuit board assembly further includes a set of edge clips. Each edge clip extends outwardly from the daughter board along the daughter board plane and is configured to operate as a mounting platform through which to physically secure the daughter board to the motherboard.

Abstract translation: 电路板组件包括限定母板平面的母板和限定基本平行于母板平面的子板平面的子板。 主板和子板通过一组电路板连接器彼此电连接。 电路板组件还包括一组边缘夹。 每个边缘夹子沿着子板平面从子板向外延伸并且被配置为作为安装平台操作，通过该安装平台将子板物理地固定到母板。

公开(公告)号：USD549089S1

公开(公告)日：2007-08-21

申请号：US29254251

申请日：2006-02-21

Applicant: Frank Jun ,  Michael Chern ,  Saeed Seyed

Designer： Frank Jun ,  Michael Chern ,  Saeed Seyed

公开(公告)号：US07139174B1

公开(公告)日：2006-11-21

申请号：US10695682

申请日：2003-10-29

Applicant: Toan Nguyen ,  Michael Chern ,  Saeed Seyed

Inventor： Toan Nguyen ,  Michael Chern ,  Saeed Seyed

IPC: H05K7/20

CPC classification number: H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between a first location proximate to the component and a second location distal to the component. The heat sink assembly further includes a first rail member coupled to the base member along the first edge of the base member, a second rail member coupled to the base member along the second edge of the base member, and an actuation mechanism coupled to the base member. The actuation mechanism is configured to move portions of the members toward each other when the base member resides at the first location to fasten the base member to the component.

Abstract translation: 电路板模块具有电路板，安装到电路板的部件和散热器组件。 散热器组件包括具有第一边缘和第二边缘的基底构件。 基座构件构造成在靠近部件的第一位置和远离部件的第二位置之间作为热导管工作。 所述散热器组件还包括沿着所述基座部件的第一边缘连接到所述基座部件的第一导轨部件，沿着所述基座部件的第二边缘联接到所述基座部件的第二导轨部件，以及联接到所述基座部件的致动机构 会员。 致动机构构造成当基部部件位于第一位置时使部件朝向彼此移动，以将基部部件固定到部件上。

公开(公告)号：US06498367B1

公开(公告)日：2002-12-24

申请号：US09520546

申请日：2000-03-08

Applicant: Paul Chang ,  Geeng-Chuan (aka Michael) Chern ,  Wayne Y. W. Hsueh ,  Vladimir Rodov

Inventor： Paul Chang ,  Geeng-Chuan (aka Michael) Chern ,  Wayne Y. W. Hsueh ,  Vladimir Rodov

IPC: H01L2976

CPC classification number: H01L29/7806 ,  H01L21/2815 ,  H01L27/0814 ,  H01L27/095 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/66712 ,  H01L29/7802 ,  H01L29/781 ,  H01L29/7811 ,  H01L29/861 ,  H01L29/872

Abstract: A power rectifier having low on resistance, fast recovery time and low forward voltage drop. In a preferred embodiment, the present invention provides a power rectifier device employing a vertical device structure, i.e., with current flow between the major surfaces of the discrete device. The device employs a large number of parallel connected cells, each comprising a MOSFET structure with a gate to drain short via a common conductive layer. This provides a low Vf path through the channel regions of the MOSFET cells to the contact metallization on the other side of the integrated circuit. A thin gate structure is formed annularly around pedestal regions on the upper surface of the device and a precisely controlled body implant defines the channel region and allows controllable device characteristics, including gate threshold voltage and Vf.

Abstract translation: 具有导通电阻低，恢复时间快，正向压降低的电力整流器。 在优选实施例中，本发明提供一种采用垂直装置结构的电力整流装置，即在分立装置主要表面之间的电流流动。 该器件采用大量并联连接的单元，每个单元包括具有栅极的MOSFET结构，以通过公共导电层短路地漏极。 这提供了通过MOSFET单元的沟道区域到集成电路另一侧上的接触金属化的低Vf路径。 薄栅结构环形地围绕器件的上表面上的基座区域形成，并且精确控制的体植入物限定沟道区域并且允许可控制的器件特性，包括栅极阈值电压和Vf。

公开(公告)号：US20100157687A1

公开(公告)日：2010-06-24

申请号：US12645337

申请日：2009-12-22

Applicant: Geeng-Chuan Michael Chern ,  Ben Sheen ,  Jonathan Pabustan ,  Prateep Tuntasood ,  Der-Tsyr Fan ,  Yaw Wen Hu

Inventor： Geeng-Chuan Michael Chern ,  Ben Sheen ,  Jonathan Pabustan ,  Prateep Tuntasood ,  Der-Tsyr Fan ,  Yaw Wen Hu

IPC: G11C16/06 ,  G11C16/16

CPC classification number: G11C16/16

Abstract: A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”). In addition, a ground voltage is applied to erase gates other than the first alternating gates (“second alternating gates”). In a second method to erase the flash memory cell, a pulse of a first positive voltage is applied to the first alternating gates and a negative voltage is applied to the second alternating gates and to all control gates.

Abstract translation: 闪存单元是具有第一导电类型的衬底的类型，在第一端具有第二导电类型的第一区域，在第二端处具有与第一端部间隔开的第二导电类型的第二区域 ，在第一端和第二端之间具有通道区域。 闪存单元具有多个堆叠的浮置栅极和控制栅极对，其中浮置栅极位于沟道区域的部分上方并与其绝缘，并且每个控制栅极在浮动栅极上并与之绝缘。 闪速存储单元还在通道区域上具有与其绝缘的多个擦除栅极，在每对堆叠的一对浮置栅极和控制栅极之间具有擦除栅极。 在擦除闪存单元的方法中，将第一正电压的脉冲施加到交替擦除栅极（“第一交替栅极”）。 此外，施加接地电压以擦除除第一交流栅极（“第二交替栅极”）之外的栅极。 在擦除闪存单元的第二种方法中，将第一正电压的脉冲施加到第一交流栅极，并且向第二交替栅极和所有控制栅极施加负电压。

公开(公告)号：US20070109760A1

公开(公告)日：2007-05-17

申请号：US11274024

申请日：2005-11-15

Applicant: Jimmy Leung ,  Mandy Lam ,  Toan Nguyen ,  Saeed Seyed ,  Michael Chern

Inventor： Jimmy Leung ,  Mandy Lam ,  Toan Nguyen ,  Saeed Seyed ,  Michael Chern

IPC: H05K7/14 ,  H05K7/18

CPC classification number: H05K7/1409

Abstract: A control assembly controls removal of a circuit board from a chassis. The control assembly includes a support member configured to fasten to the circuit board, and a handle pivotally attached to the support member. The handle is configured to swing from an opened position to a closed position relative to the support member during installation of the circuit board within the chassis, and from the closed position to the opened position during removal of the circuit board from the chassis. The control assembly further includes a button configured to move between a biased position and a depressed position relative to the support member. The button is further configured to (i) inhibit removal of the circuit board from the chassis when the button is in the biased position, and (ii) enable removal of the circuit board from the chassis when the button is in the depressed position.

公开(公告)号：US07064957B1

公开(公告)日：2006-06-20

申请号：US10614908

申请日：2003-07-08

Applicant: Hsing-Sheng Liang ,  Michael Chern ,  Hong Huynh ,  Phillip Ting ,  Saeed Seyed

Inventor： Hsing-Sheng Liang ,  Michael Chern ,  Hong Huynh ,  Phillip Ting ,  Saeed Seyed

IPC: H05K7/20

CPC classification number: H05K7/1461 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K7/20545 ,  H01L2224/0401

Abstract: A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.

Abstract translation: 散热器附接机构包括具有相关联的可压缩构件的紧固件。 紧固件限定了凸缘，当凸缘固定到电路板部件上的散热器时，凸缘被配置为接触与电路板部件相关联的电路板表面。 法兰和电路板之间的接触使紧固件相对于电路板部件的行程最小化，并限制在电路板部件上产生的应力或与电路板部件相关联的球栅阵列的焊球上的散热片 。 此外，当紧固件将散热器固定到电路板部件上时，紧固件将可压缩部件压靠在散热片上，从而使可压缩部件膨胀。 可压缩构件的膨胀允许可压缩构件随时间吸收由紧固件施加到散热器和电路板部件的应力变化。

公开(公告)号：US06853556B1

公开(公告)日：2005-02-08

申请号：US10755572

申请日：2004-01-12

Applicant: Gary Lynn Myers ,  Jack Brown Rector, III ,  Michael Chern

Inventor： Gary Lynn Myers ,  Jack Brown Rector, III ,  Michael Chern

IPC: H01R13/633 ,  H05K7/14 ,  H05K5/00 ,  H05K5/04 ,  H05K5/06

CPC classification number: H05K7/1409 ,  H01R12/7005 ,  H01R13/633

Abstract: A motherboard assembly includes a motherboard, a circuit board, and an ejector assembly. The motherboard has a motherboard connector extending from a planar surface of the motherboard. The circuit board has a circuit board connector extending from a planar surface of the circuit board and coupled to the motherboard connector of the motherboard such that the planar surface of the circuit board orients substantially parallel to the planar surface of the motherboard. The ejector assembly orients between the motherboard and the circuit board. During an ejection procedure, the ejector assembly separates the motherboard connector and the circuit board connector while minimizing bending of either the circuit board or the motherboard. By limiting bending of either the circuit board or the motherboard, the ejector assembly minimizes damage to electrical traces or components carried by either the circuit board or the motherboard during the separation process.

Abstract translation: 主板组件包括主板，电路板和喷射器组件。 主板具有从主板的平面延伸的主板连接器。 电路板具有从电路板的平坦表面延伸并连接到母板的主板连接器的电路板连接器，使得电路板的平面表面基本平行于母板的平面表面。 喷射器组件位于主板和电路板之间。 在喷射过程中，喷射器组件分离主板连接器和电路板连接器，同时最小化电路板或主板的弯曲。 通过限制电路板或母板的弯曲，喷射器组件最大限度地减少了在分离过程期间由电路板或母板承载的电迹线或部件的损坏。

公开(公告)号：US06385053B1

公开(公告)日：2002-05-07

申请号：US09258446

申请日：1999-02-26

Applicant: Bobby Parizi ,  Nguyen Nguyen ,  Michael Chern ,  Saeed H. Seyedarab

Inventor： Bobby Parizi ,  Nguyen Nguyen ,  Michael Chern ,  Saeed H. Seyedarab

IPC: H01R1216

CPC classification number: H01R12/7005 ,  H05K7/1418 ,  H05K7/1454

Abstract: A guide device receives and engages a cutout in a distal pin-bearing edge of a printed circuit board for aligning pins with pin sockets. The alignment device includes a web, sized and shaped to be received in a circuit board cutout and a shelf surface for engaging a part of a major surface of the circuit board, to provide for biaxial guidance during board insertion. By positioning guide devices and circuit board cutouts in different locations, for different circuit boards, insertion of circuit boards in an incorrect slot or location is avoided.

Abstract translation: 引导装置接收并接合印刷电路板的远端销轴承边缘中的切口，用于将销与销插座对准。 对准装置包括一个尺寸和形状被容纳在电路板切口中的腹板，以及用于接合电路板的主表面的一部分的搁板表面，以在板插入期间提供双轴向引导。 通过将引导装置和电路板切口定位在不同的位置，对于不同的电路板，避免了将电路板插入不正确的插槽或位置。